AMD

XC7K325T-1FFG676C - Kintex-7 FPGA 326K Cells | AMD

MPN: XC7K325T-1FFG676C βœ“ Active
In Stock Ships in 1-3 business days
0.97 V to 1.03 V Vdss 676-BBGA, FCBGA Package 400 MHz Speed
From $350 USD / Unit
MOQ: 1 |
Price updated: 2026-08-20
Volume Pricing
Qty Unit Price Extended
1 $495 $495.00
10 $460 $4,600.00
100 $420 $42,000.00
500 $380 $190,000.00
1,000 $350 $350,000.00
ℹ️ All prices are in USD

Drop-in alternatives for XC7K325T-1FFG676C β€” same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool β€” Select alternative parts for side-by-side comparison:

XC7K325T-2FFG676C

βœ… Drop-In
πŸ“¦ 676-BBGA, FCBGA
Higher speed grade (-2), up to 450 MHz, same package and pinout

πŸ“‹ Reference alternative (not in catalog)

XC7K325T-1FFG676I

βœ… Drop-In
πŸ“¦ 676-BBGA, FCBGA
Industrial temperature range (-40Β°C to 100Β°C), same package and pinout

πŸ“‹ Reference alternative (not in catalog)

XC7K325T-3FFG676E

βœ… Drop-In
πŸ“¦ 676-BBGA, FCBGA
Extended temperature range (-40Β°C to 125Β°C), highest speed grade (-3), same package

πŸ“‹ Reference alternative (not in catalog)

XC7K325T-1FBG676C

βœ… Drop-In
AMD
πŸ“¦ 676-BBGA, FCBGA
Kintex-7 Β· 326080 Β· 16404480 bits Β· 400 Β· 676-BBGA, FCBGA Β· 1.0 V (0.97V to 1.03V) Β· 28nm Β· -1

βœ“ In Stock

$108 / Unit

View Datasheet β†’

CWC2P300T-FFG676I

βœ… Drop-In
πŸ“¦ 676-BBGA, FCBGA
Domestic Chinese FPGA alternative, 300K logic cells, pin-compatible but verify bitstream compatibility

πŸ“‹ Reference alternative (not in catalog)

XC7K325T-1FFG676C Maximum Ratings & Electrical Characteristics

Family Kintex-7
Logic Cells 326080
Number of I/Os 400
Block RAM 16404480 bits
DSP Slices 840
LUTs 203800
Maximum Clock Frequency 400 MHz
Core Voltage 0.97 V to 1.03 V
Package 676-BBGA, FCBGA
Operating Temperature 0Β°C to 85Β°C
Process Technology 28nm
Speed Grade -1
Transceivers 16 GTX (10.3 Gbps)
PCIe Support Gen3
Configuration SRAM-based, external flash
RoHS Status Compliant

XC7K325T-1FFG676C Pin Configuration

Electronic Component Package Diagram Default generic electronic component package diagram 1 2 3 Package
Pin A1 IO_L1P_T0 β€” User I/O differential pair P
Pin A2 IO_L1N_T0 β€” User I/O differential pair N
Pin B1 VCCINT β€” Internal core voltage 1.0V
Pin B2 GND β€” Ground
Pin C1 IO_L2P_T1 β€” User I/O differential pair P
Pin C2 IO_L2N_T1 β€” User I/O differential pair N
Pin D1 VCCAUX β€” Auxiliary voltage 1.8V
Pin D2 GND β€” Ground
Pin E1 IO_L3P_T2 β€” User I/O differential pair P
Pin E2 IO_L3N_T2 β€” User I/O differential pair N
Pin F1 VCCBRAM β€” Block RAM voltage 1.0V
Pin F2 GND β€” Ground

Safe Operating Area (SOA) & Thermal Characteristics

Safe Operating Area Chart Default safe operating area chart for XC7K325T-1FFG676C Drain-to-Source Voltage (Vds) Drain Current (Id)

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

XC7K325T-1FFG676C is suitable for 6 applications: Software-Defined Radio, High-Performance Computing Acceleration, Video and Image Processing, Wired Communications Infrastructure, Test and Measurement Equipment, Aerospace and Defense.

πŸ“‘

Software-Defined Radio

The XC7K325T-1FFG676C excels in SDR platforms due to its 840 DSP slices and 16 GTX transceivers. The DSP slices handle digital down-conversion, filtering, and modulation, while the transceivers interface with high-speed ADCs/DACs at up to 10.3 Gbps. The 400 I/Os connect to multiple RF front-ends, and the 16.4 Mb block RAM supports large FFT buffers. This combination enables wideband signal processing for military and commercial communications, with the -1 speed grade providing adequate performance while minimizing power in field-deployed systems.

πŸ–₯️

High-Performance Computing Acceleration

In HPC acceleration, the XC7K325T-1FFG676C provides 326K logic cells and 840 DSP slices for custom arithmetic pipelines. Its 16 GTX transceivers enable high-bandwidth data movement between FPGAs or to host processors via PCIe Gen3. The 400 I/Os support wide parallel interfaces to HBM or SRAM. The 28nm process delivers a balance of density and power, making it suitable for rack-mounted accelerators where thermal budgets are tight. The -1 speed grade is often sufficient for integer and fixed-point workloads, reducing cost compared to -2 or -3 grades.

πŸ“Ί

Video and Image Processing

The XC7K325T-1FFG676C is ideal for video processing pipelines, offering 400 I/Os to connect multiple camera sensors or display interfaces. The 840 DSP slices perform real-time filtering, scaling, and color space conversion, while the 16.4 Mb block RAM provides line buffers and frame storage. The GTX transceivers support SDI or 10G Ethernet for video transport. The 28nm process enables high logic density for complex algorithms like H.264 encoding or computer vision, and the -1 speed grade is adequate for 1080p60 or 4K30 processing, balancing performance and power.

🌐

Wired Communications Infrastructure

For wired communications, the XC7K325T-1FFG676C supports PCIe Gen3 and 10G Ethernet natively, making it a strong choice for network interface cards, switches, and routers. The 16 GTX transceivers handle multiple 10G links, while the 400 I/Os connect to PHYs and management interfaces. The 326K logic cells accommodate packet processing, forwarding, and traffic management. The 28nm process provides the performance needed for line-rate processing at 10G, and the -1 speed grade is often sufficient for non-blocking switching fabrics, offering cost savings over higher speed grades.

πŸ”§

Test and Measurement Equipment

The XC7K325T-1FFG676C is well-suited for test and measurement instruments like oscilloscopes, logic analyzers, and signal generators. Its 400 I/Os connect to high-speed ADCs and DACs, while the 840 DSP slices perform real-time signal analysis, triggering, and waveform generation. The 16.4 Mb block RAM supports deep acquisition buffers. The GTX transceivers enable high-speed data streaming to a host PC. The -1 speed grade provides sufficient performance for most benchtop instruments, and the commercial temperature range is adequate for lab environments, keeping cost down.

✈️

Aerospace and Defense

In aerospace and defense, the XC7K325T-1FFG676C is used for radar, electronic warfare, and secure communications. The 840 DSP slices handle pulse compression and beamforming, while the 16 GTX transceivers support high-speed sensor interfaces. The 400 I/Os connect to various avionics buses. The 28nm process offers a good balance of performance and power for airborne platforms. While the commercial temperature grade (C) is limited to 0-85Β°C, the pin-compatible industrial (I) version is available for extended environments. The -1 speed grade is often chosen for its lower power consumption in battery or generator-limited systems.

What is the XC7K325T-1FFG676C?
The XC7K325T-1FFG676C is a Kintex-7 FPGA from AMD (formerly Xilinx) with 326,080 logic cells, 400 I/Os, and 16.4 Mb of block RAM in a 676-pin FCBGA package. It operates from a 1.0V core supply and supports PCIe Gen3 and 10G Ethernet.
What is the price of XC7K325T-1FFG676C?
As of 2026-08-21, the XC7K325T-1FFG676C is priced at approximately $495 for single-unit quantities, dropping to around $350 at 1000 units. Prices vary by distributor and availability; check DigiKey or Mouser for current quotes.
Where can I buy XC7K325T-1FFG676C?
The XC7K325T-1FFG676C is available from major distributors including DigiKey, Mouser, and Octopart-listed suppliers. It is an active product, so stock is generally available, but lead times can extend to 12-20 weeks for large orders due to FPGA supply constraints.
What is the difference between XC7K325T-1FFG676C and XC7K325T-2FFG676C?
The XC7K325T-1FFG676C is the -1 speed grade, while the XC7K325T-2FFG676C is the -2 speed grade. The -2 offers approximately 15-20% higher maximum clock frequency (up to 450 MHz vs 400 MHz) but consumes slightly more power. Both share the same 676-pin FCBGA package and are pin-compatible.
Can XC7K325T-1FFG676C be used for software-defined radio?
Yes, the XC7K325T-1FFG676C is well-suited for software-defined radio (SDR) applications. Its 840 DSP slices handle complex digital down-conversion and filtering, while the 16 GTX transceivers support high-speed ADC/DAC interfaces. The 400 I/Os provide ample connectivity for mixed-signal front-ends.
What is the best drop-in replacement for XC7K325T-1FFG676C?
The best drop-in replacement is the XC7K325T-2FFG676C (same package, higher speed grade) or the XC7K325T-1FFG676I (industrial temperature range). For a domestic alternative, the CWC2P300T-FFG676I from Chengdu Sinochip is a pin-compatible option, but verify timing closure and bitstream compatibility.
Is XC7K325T-1FFG676C the same as XC7K325T-1FFG676I?
No, the XC7K325T-1FFG676C is the commercial temperature grade (0Β°C to 85Β°C), while the XC7K325T-1FFG676I is the industrial grade (-40Β°C to 100Β°C). They are pin-compatible and functionally identical, but the I version is screened for wider temperature operation and costs more.
Where can I download the XC7K325T-1FFG676C datasheet PDF?
The XC7K325T-1FFG676C datasheet is available from AMD's official website under the Kintex-7 FPGA product page, or from distributor sites like DigiKey and Mouser. The full datasheet (DS182) includes detailed specifications, pinout, and packaging information.
What are the key specifications of XC7K325T-1FFG676C that engineers should know?
The XC7K325T-1FFG676C features 326,080 logic cells, 400 user I/Os, 16.4 Mb block RAM, 840 DSP48E1 slices, and 16 GTX transceivers at 10.3 Gbps. It operates at 1.0V core, supports PCIe Gen3, and comes in a 676-pin FCBGA package. Maximum clock frequency is 400 MHz.
When should I choose XC7K325T-1FFG676C over XC7K325T-2FFG676C?
Choose the XC7K325T-1FFG676C when power consumption is a priority and your design can meet timing at 400 MHz. The -1 speed grade consumes less static power than the -2, making it suitable for thermally constrained systems. Choose the -2 if you need the extra 15-20% performance margin for high-speed serial or DSP applications.
What is the lead time for XC7K325T-1FFG676C?
Lead time for XC7K325T-1FFG676C is typically 12-20 weeks from order confirmation, depending on distributor stock levels. As of 2026-08-21, DigiKey and Mouser show limited stock, so for production volumes, plan ahead or consider the -2 speed grade which may have better availability.
Is XC7K325T-1FFG676C suitable for video processing?
Yes, the XC7K325T-1FFG676C is excellent for video processing. Its 400 I/Os support multiple camera inputs, and the 840 DSP slices handle pixel processing, scaling, and color space conversion. The 16.4 Mb block RAM provides line buffering, and the GTX transceivers enable high-bandwidth video transport.
What is the best AMD equivalent for XC7K325T-1FFG676C?
The best AMD equivalent is the XC7K325T-2FFG676C (higher speed grade, same package) or the XC7K325T-1FFG676I (industrial temperature). For a larger device, the XC7K410T-1FFG676C offers 406,720 cells in the same package, but verify pin compatibility as the pinout may differ.
Does XC7K325T-1FFG676C support PCIe Gen3?
Yes, the XC7K325T-1FFG676C includes a hardened PCIe Gen3 block that supports x1, x4, and x8 lane configurations. This integrated block reduces logic utilization and simplifies design, making it ideal for server and storage applications requiring high-speed host interfaces.
What is the power consumption of XC7K325T-1FFG676C?
Typical power consumption for the XC7K325T-1FFG676C is 5-10W depending on utilization and clock frequency. Static power is approximately 1.5W at 1.0V core, while dynamic power scales with logic activity. Use AMD's Power Estimator tool for accurate estimates based on your design.

Engineering reference data for XC7K325T-1FFG676C β€” comparison, design guidance, and compliance information.

Selection Guide

Choose the XC7K325T-1FFG676C when you need a balanced Kintex-7 FPGA with 326K logic cells, 400 I/Os, and 16 GTX transceivers for applications like SDR, video processing, or wired communications. It offers the best price/performance/watt at 28nm, making it ideal for cost-sensitive designs that don't require the highest speed grade. Select the -2 speed grade (XC7K325T-2FFG676C) if you need 15-20% higher clock frequency for high-speed serial or DSP applications. Choose the -1FFG676I for industrial temperature ranges (-40Β°C to 100Β°C) in harsh environments. For extended temperature (-40Β°C to 125Β°C) and maximum performance, the -3FFG676E is the top choice but at a premium. The domestic CWC2P300T-FFG676I is a lower-cost alternative but requires careful verification of timing closure and bitstream compatibility, and may have less mature tool support. For most designs, the -1FFG676C provides the best balance of cost, performance, and power.

Comparison with Alternatives

Parameter This Product XC7K325T-2FFG676C XC7K325T-1FFG676I XC7K325T-3FFG676E XC7K325T-1FBG676C CWC2P300T-FFG676I
Package 676-BBGA, FCBGA 676-BBGA, FCBGA - same 676-BBGA, FCBGA - same 676-BBGA, FCBGA - same 676-BBGA, FCBGA - same 676-BBGA, FCBGA - same
Brand AMD AMD AMD AMD AMD Chengdu Sinochip
Logic Cells 326080 326080 326080 326080 326080 300000
Speed Grade -1 -2 -1 -3 -1 -1
Temperature Range 0Β°C to 85Β°C 0Β°C to 85Β°C -40Β°C to 100Β°C -40Β°C to 125Β°C 0Β°C to 85Β°C -40Β°C to 100Β°C
Max Clock Frequency 400 MHz 450 MHz 400 MHz 500 MHz 400 MHz [DATA_NEEDED]
DSP Slices 840 840 840 840 840 [DATA_NEEDED]
Block RAM 16404480 bits 16404480 bits 16404480 bits 16404480 bits 16404480 bits [DATA_NEEDED]
Transceivers 16 GTX (10.3 Gbps) 16 GTX (10.3 Gbps) 16 GTX (10.3 Gbps) 16 GTX (10.3 Gbps) 16 GTX (10.3 Gbps) [DATA_NEEDED]

Key Differentiators

  • Balanced price/performance/watt at 28nm (vs XC7K325T-2FFG676C)
  • Commercial temperature grade for cost savings (vs XC7K325T-1FFG676I)
  • Native PCIe Gen3 and 10G Ethernet support (vs CWC2P300T-FFG676I)

Design Notes

The XC7K325T-1FFG676C requires a 1.0V core supply (VCCINT) with tight regulation (0.97V to 1.03V). Use a dedicated switching regulator with at least 10A capability and place 100nF and 10uF ceramic capacitors close to each VCCINT pin. The VCCAUX rail (1.8V) and VCCBRAM (1.0V) also need proper decoupling. Refer to AMD's UG583 for detailed power supply design guidelines.

At 50% logic utilization and 400 MHz, the XC7K325T-1FFG676C can dissipate 5-10W. The FCBGA package has a thermal resistance of approximately 8-10Β°C/W (theta_JA) without airflow. For sustained operation, attach a heatsink or provide forced airflow to keep junction temperature below 85Β°C. Use AMD's Power Estimator to calculate exact dissipation for your design.

The 676-pin FCBGA requires a multi-layer PCB with at least 8 layers for proper routing and power integrity. Use 0.8mm via diameter and 0.4mm drill for signal vias. Route high-speed transceiver pairs with controlled impedance (100 ohm differential) and keep them away from clock signals. Follow AMD's PCB design guidelines in UG583 for layout best practices.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS compliant per AMD product page. Not AEC-Q100 qualified (FPGA, not automotive). Lead-free and halogen-free per AMD environmental data.

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