AMD

XC7K325T-1FBG676C - Kintex-7 FPGA 326K Logic Cells | AMD

Name: XC7K325T-1FBG676C
Brand: AMD
Price: 108 USD
Availability: InStock

MPN: XC7K325T-1FBG676C ✓ Active

In Stock Ships in 1-3 business days

1.0 V (0.97V to 1.03V) Vdss 676-BBGA, FCBGA Package -1 Speed

From $108 USD / Unit

MOQ: 1 |

Price updated: 2026-08-19

Volume Pricing

Qty	Unit Price	Extended
1	$157.63	$157.63
10	$145.2	$1,452.00
100	$132.8	$13,280.00
500	$120.4	$60,200.00
1,000	$108	$108,000.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

Quantity

Drop-in alternatives for XC7K325T-1FBG676C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

XC7K325T-2FBG676C

✅ Drop-In

AMD

📦 676-FCBGA

Kintex-7 · 326080 · 25475 · 16404480 · 400 · 676-BBGA, FCBGA · 27x27 mm · Surface Mount (SMD/SMT)

✓ In Stock

$780 / Unit

View Datasheet →

XC7K325T-1FBG676I

✅ Drop-In

📦 676-FCBGA

Industrial temperature range (-40C to +100C) vs commercial (0C to +85C)

📋 Reference alternative (not in catalog)

XC7K325T-1FFG676C

✅ Drop-In

AMD

📦 676-FCBGA

Kintex-7 · 326080 · 400 · 16404480 bits · 840 · 203800 · 400 MHz · 0.97 V to 1.03 V

✓ In Stock

$350 / Unit

View Datasheet →

CWC2P300T-FFG676I

✅ Drop-In

📦 676-FCBGA

Domestic FPGA alternative, pin-compatible with FFG676 package

📋 Reference alternative (not in catalog)

ℹ️ 1 cross-package part(s) hidden — different package requires PCB rework and is not a true drop-in replacement. Contact us if you need cross-package suggestions.

XC7K325T-1FBG676C Maximum Ratings & Electrical Characteristics

Family	Kintex-7
Logic Cells	326080
Block RAM	16404480 bits
Number of I/Os	400
Package	676-BBGA, FCBGA
Core Voltage	1.0 V (0.97V to 1.03V)
Technology	28nm
Speed Grade	-1
Maximum Frequency	400 MHz
Operating Temperature	0C to +85C
Mounting Type	Surface Mount
RoHS Status	Compliant
REACH Status	Compliant
Series	Kintex-7
Number of Logic Elements	326080

XC7K325T-1FBG676C Pin Configuration

Pin A1	IO_L1P_T0 — User I/O bank 0, differential pair P
Pin A2	IO_L1N_T0 — User I/O bank 0, differential pair N
Pin B1	IO_L2P_T0 — User I/O bank 0, differential pair P
Pin B2	IO_L2N_T0 — User I/O bank 0, differential pair N
Pin C1	VCCINT — Internal core voltage 1.0V
Pin C2	GND — Ground
Pin D1	VCCAUX — Auxiliary voltage 1.8V
Pin D2	GND — Ground
Pin E1	IO_L3P_T0 — User I/O bank 0, differential pair P
Pin E2	IO_L3N_T0 — User I/O bank 0, differential pair N
Pin F1	IO_L4P_T0 — User I/O bank 0, differential pair P
Pin F2	IO_L4N_T0 — User I/O bank 0, differential pair N

Safe Operating Area (SOA) & Thermal Characteristics

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

XC7K325T-1FBG676C is suitable for 6 applications: Software Defined Radio, High-Performance Computing, Video Processing, Aerospace and Defense, Data Acquisition and Instrumentation, Telecommunications Infrastructure.

📡

Software Defined Radio

The XC7K325T-1FBG676C excels in software-defined radio (SDR) systems due to its high DSP ratio and 400 I/Os. With 326,080 logic cells and 16.4 Mb of block RAM, it can implement complex digital down-conversion, filtering, and modulation algorithms. The 28nm process enables low power consumption, critical for portable and field-deployed radios. The device supports multiple high-speed serial transceivers for ADC/DAC interfaces, and its MMCM/PLL blocks provide precise clock generation for RF sampling. This FPGA enables reconfigurable waveforms and multi-standard support, making it ideal for military and commercial SDR platforms.

Recommended

XC7Z020 · AMD

🖥️

High-Performance Computing

In high-performance computing (HPC), the XC7K325T-1FBG676C provides massive parallel processing capabilities with 326,080 logic cells. Its DSP48E1 slices enable efficient multiply-accumulate operations for scientific computing, financial modeling, and data analytics. The 400 I/Os support high-bandwidth memory interfaces like DDR3, and the 28nm technology balances performance with power efficiency. The device can accelerate algorithms by 10-100x compared to CPUs for specific workloads. Its PCIe support enables seamless integration into server systems, making it a cost-effective accelerator for data centers and research institutions.

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MT40A512M16JY-075E · Micron Technology

📺

Video Processing

The XC7K325T-1FBG676C is well-suited for video processing applications, offering 400 I/Os and 16.4 Mb of block RAM for frame buffering. Its 326,080 logic cells can implement complex video codecs, image scaling, and real-time enhancement algorithms. The device supports multiple video standards through its flexible I/O, and the 28nm process enables low-latency processing. With support for PCIe and DDR3, it can handle 4K video streams at 60fps. The MMCM/PLL blocks generate precise pixel clocks, ensuring synchronization across multiple video channels. This makes it ideal for broadcast, medical imaging, and surveillance systems.

Recommended

MT40A512M16TB-062E · Micron Technology

✈️

Aerospace and Defense

The XC7K325T-1FBG676C is designed for aerospace and defense applications, offering high reliability and performance in a 676-FCBGA package. Its 326,080 logic cells support complex radar, sonar, and electronic warfare processing. The device operates over the commercial temperature range (0C to +85C) and can be paired with industrial-grade variants for harsher environments. The 28nm technology provides radiation tolerance suitable for many defense applications. With 400 I/Os, it interfaces with a wide range of sensors and communication systems. The FPGA's reconfigurability allows for in-field updates, critical for evolving mission requirements.

Recommended

XC7A100T · AMD

🔧

Data Acquisition and Instrumentation

The XC7K325T-1FBG676C is ideal for data acquisition systems, providing 400 I/Os for interfacing with high-speed ADCs and DACs. Its 326,080 logic cells enable real-time signal processing, triggering, and data reduction. The 16.4 Mb block RAM supports large data buffers, while the 28nm process ensures low power for portable instruments. The device's MMCM/PLL blocks generate precise sampling clocks, critical for accurate measurements. With PCIe support, it can stream data to host computers at high rates. This makes it suitable for oscilloscopes, spectrum analyzers, and scientific instruments.

Recommended

MT41K256M16HA-125 · Micron Technology

🌐

Telecommunications Infrastructure

The XC7K325T-1FBG676C is a key component in telecommunications infrastructure, offering high-speed serial transceivers and 400 I/Os for backplane and line card interfaces. Its 326,080 logic cells implement packet processing, error correction, and protocol conversion. The device supports PCIe and Gigabit Ethernet, enabling seamless integration into network equipment. The 28nm technology provides the performance needed for 100G+ systems while managing power consumption. With 16.4 Mb of block RAM, it can buffer large packets and support Quality of Service (QoS) algorithms. This makes it ideal for routers, switches, and base stations.

Recommended

XC7Z020 · AMD

Recommended Products Summary

XC7Z020 AMD Used in: Software Defined Radio, Telecommunications Infrastructure MT40A512M16JY-075E Micron Technology Used in: High-Performance Computing MT40A512M16TB-062E Micron Technology Used in: Video Processing XC7A100T AMD Used in: Aerospace and Defense MT41K256M16HA-125 Micron Technology Used in: Data Acquisition and Instrumentation

What is the XC7K325T-1FBG676C?

The XC7K325T-1FBG676C is a Kintex-7 FPGA from AMD (formerly Xilinx) with 326,080 logic cells, 400 I/Os, and 16,404,480 bits of block RAM in a 676-ball FCBGA package. It operates at 1.0V core voltage and is built on 28nm technology, offering a balance of performance, power, and cost for mid-range to high-end applications.

What is the price of XC7K325T-1FBG676C?

As of 2026-08-20, the XC7K325T-1FBG676C is priced at approximately $157.63 for single-unit purchases from LCSC. Volume pricing decreases with quantity, with 1000-unit pricing around $108.00. Prices vary by distributor and availability, so check current stock at DigiKey, Mouser, or Octopart for the latest quotes.

Where can I buy XC7K325T-1FBG676C online?

The XC7K325T-1FBG676C is available from major distributors including DigiKey, Mouser, LCSC, and Octopart. DigiKey lists it as 'ships today' with stock available. LCSC offers it at $157.63. For bulk or long-term supply, specialized FPGA distributors like FPGAX and Veswin also carry this part.

What is the lead time for XC7K325T-1FBG676C?

The lead time for XC7K325T-1FBG676C varies by distributor and order quantity. DigiKey typically ships within 24 hours for in-stock items. For larger quantities or custom orders, lead times can range from 4 to 12 weeks depending on AMD's production schedule. Contact your preferred distributor for current lead time estimates.

Is XC7K325T-1FBG676C in stock?

Yes, the XC7K325T-1FBG676C is currently in stock at multiple distributors. DigiKey lists it as available and ships today. LCSC also shows it as in-stock. For real-time inventory levels, check the distributor websites directly, as stock levels can change rapidly.

What is the difference between XC7K325T-1FBG676C and XC7K325T-1FBG676I?

The XC7K325T-1FBG676C and XC7K325T-1FBG676I share the same logic resources and package, but differ in operating temperature range. The 'C' suffix indicates commercial temperature grade (0C to +85C), while the 'I' suffix indicates industrial grade (-40C to +100C). Both are pin-compatible drop-in replacements, but the industrial version is suited for harsher environments.

When should I choose XC7K325T-1FBG676C over XC7K325T-2FBG676C?

Choose the XC7K325T-1FBG676C when your design does not require the higher performance of the -2 speed grade. The -1 speed grade offers lower cost and power consumption while still supporting 400 MHz operation. If your timing closure is tight or you need higher maximum frequency, the -2 variant provides better performance but at higher cost and power.

What is the best drop-in replacement for XC7K325T-1FBG676C?

The best drop-in replacement for XC7K325T-1FBG676C is the XC7K325T-2FBG676C, which shares the same 676-FCBGA package and pinout but offers a higher speed grade. The XC7K325T-1FBG676I is also a drop-in replacement with industrial temperature range. For cross-brand options, the CWC2P300T-FFG676I from domestic suppliers is being evaluated as an alternative, but verify pin compatibility.

Where can I download the XC7K325T-1FBG676C datasheet PDF?

The XC7K325T-1FBG676C datasheet is available from multiple sources. AMD's official website provides the complete Kintex-7 datasheet (DS182). Distributors like DigiKey, Mouser, and Octopart also host the datasheet PDF. Alldatasheet.com and datasheets.com offer direct PDF downloads. The AMD package pinout files are available at amd.com under the Kintex-7 package pinout section.

Where can I find the XC7K325T-1FBG676C pinout?

The XC7K325T-1FBG676C pinout is available in AMD's official package pinout files, which can be downloaded from the AMD website under 'Kintex-7 Package Device Pinout Files'. These files are provided in TXT and CSV formats and are described in UG475. Distributor pages like DigiKey and Mouser also provide pinout diagrams.

Hey Google, what can replace XC7K325T-1FBG676C?

The XC7K325T-1FBG676C can be replaced by the XC7K325T-2FBG676C (same package, higher speed grade) or the XC7K325T-1FBG676I (industrial temperature). Both are pin-compatible drop-in replacements from AMD. For cross-brand options, the CWC2P300T-FFG676I is being evaluated as a domestic alternative, but pin compatibility must be verified before use.

Is XC7K325T-1FBG676C the same as XC7K325T-1FFG676C?

No, the XC7K325T-1FBG676C and XC7K325T-1FFG676C are not the same. While both have 326,080 logic cells and 400 I/Os, they use different packages: the FBG676 is a lidless FCBGA, while the FFG676 is a flip-chip FCBGA with a lid. The FFG676 package may have different thermal and mechanical characteristics, so they are not direct drop-in replacements without PCB modification.

What are the key specifications of XC7K325T-1FBG676C that engineers should know?

The XC7K325T-1FBG676C features 326,080 logic cells, 400 user I/Os, 16,404,480 bits of block RAM, and operates at 1.0V core voltage. It supports 400 MHz maximum frequency and is built on 28nm technology. The device includes MMCM and PLL clock management, PCIe support, and comes in a 676-ball FCBGA package. It is RoHS and REACH compliant.

What is the best AMD equivalent for XC7K325T-1FBG676C?

The best AMD equivalent for XC7K325T-1FBG676C is the XC7K325T-2FBG676C, which offers a higher speed grade (-2 vs -1) with identical logic resources and package. For designs requiring more I/Os, the XC7K325T-1FFG900C provides the same core in a larger FFG900 package. Both are from AMD and maintain the same Kintex-7 architecture.

Engineering reference data for XC7K325T-1FBG676C — comparison, design guidance, and compliance information.

Selection Guide

Choose the XC7K325T-1FBG676C when you need a cost-effective Kintex-7 FPGA with 326K logic cells and 400 I/Os for commercial temperature applications. It is ideal for designs that do not require the highest speed grade or industrial temperature range. If your design needs higher performance, select the XC7K325T-2FBG676C, which offers a faster speed grade at a premium. For harsh environments, the XC7K325T-1FBG676I provides industrial temperature operation. If you need more I/Os, consider the XC7K325T-1FFG900C, but be prepared for a PCB redesign due to the larger package. For domestic supply chain requirements, evaluate the CWC2P300T-FFG676I, but verify pin compatibility and performance before committing.

Comparison with Alternatives

Parameter	This Product	XC7K325T-2FBG676C	XC7K325T-1FBG676I	XC7K325T-1FFG676C	CWC2P300T-FFG676I
Package	676-FCBGA (FBG)	676-FCBGA (FBG)	676-FCBGA (FBG)	676-FCBGA (FFG)	676-FCBGA (FFG)
Brand	AMD	AMD	AMD	AMD	Chengdu Sino Microelectronics
Logic Cells	326080	326080	326080	326080	[DATA_NEEDED]
Number of I/Os	400	400	400	400	[DATA_NEEDED]
Block RAM	16404480 bits	16404480 bits	16404480 bits	16404480 bits	[DATA_NEEDED]
Speed Grade	-1	-2	-1	-1	[DATA_NEEDED]
Temperature Range	0C to +85C	0C to +85C	-40C to +100C	0C to +85C	[DATA_NEEDED]
Core Voltage	1.0V	1.0V	1.0V	1.0V	[DATA_NEEDED]

Key Differentiators

Higher speed grade option (vs XC7K325T-1FBG676C vs XC7K325T-2FBG676C)
Industrial temperature range (vs XC7K325T-1FBG676C vs XC7K325T-1FBG676I)
Lidless package for thermal performance (vs XC7K325T-1FBG676C vs XC7K325T-1FFG676C)

Design Notes

The XC7K325T-1FBG676C requires a 1.0V core supply (VCCINT) with tight regulation (0.97V to 1.03V). Use a dedicated switching regulator with remote sensing to maintain accuracy under dynamic load. Decouple each VCCINT pin with a 100nF ceramic capacitor and add bulk capacitance (10uF) per power region. The VCCAUX rail (1.8V) should be similarly decoupled. Follow AMD's power distribution network (PDN) guidelines in UG583 for optimal performance.

The 676-FCBGA package has a thermal resistance that requires careful management. For high-utilization designs, use a heatsink with forced airflow. The lidless FBG package allows direct contact with the die for improved thermal performance. Calculate power dissipation using AMD's Power Estimator tool and ensure junction temperature stays below 85C for commercial grade. Consider the thermal vias under the package for heat spreading to the PCB ground plane.

For the 676-FCBGA package, use a high-layer-count PCB (12-16 layers) with controlled impedance for high-speed signals. Route differential pairs with 100-ohm impedance for transceivers. Place decoupling capacitors on the bottom side directly under the BGA pads. Follow AMD's PCB design guidelines in UG583 for stack-up, via placement, and signal integrity. Use the package pinout files from AMD for accurate footprint creation.