XC7K325T-2FBG676C - Kintex-7 FPGA 326K Logic Cells | AMD
MPN: XC7K325T-2FBG676C ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1200 | $1,200.00 |
| 10 | $1100 | $11,000.00 |
| 100 | $950 | $95,000.00 |
| 500 | $850 | $425,000.00 |
| 1,000 | $780 | $780,000.00 |
Drop-in alternatives for XC7K325T-2FBG676C — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
XC7K325T-1FBG676C
✅ Drop-In✓ In Stock
$108 / Unit
View Datasheet →XC7K325T-3FBG676C
✅ Drop-In📋 Reference alternative (not in catalog)
XC7K325T-1FFG676C
✅ Drop-In✓ In Stock
$350 / Unit
View Datasheet →XC7K325T-2FFG676C
✅ Drop-In📋 Reference alternative (not in catalog)
XC7K325T-2FFG676I
✅ Drop-In✓ In Stock
$98 / Unit
View Datasheet →XC7K325T-2FBG676C Maximum Ratings & Electrical Characteristics
| Family | Kintex-7 |
| Number of Logic Elements/Cells | 326080 |
| Number of LABs/CLBs | 25475 |
| Total RAM Bits | 16404480 |
| Number of I/O | 400 |
| Package / Case | 676-BBGA, FCBGA |
| Package Size | 27x27 mm |
| Mounting Type | Surface Mount (SMD/SMT) |
| Operating Temperature | 0°C to 85°C (TJ) |
| Speed Grade | -2 |
| Process Technology | 28nm |
| Core Voltage | 1V |
| Supply Voltage | [DATA_NEEDED: VCCINT nominal voltage] |
| Number of Transceivers | [DATA_NEEDED: GTX transceiver count] |
| Status | Active |
| Categories | Integrated Circuits |
XC7K325T-2FBG676C Pin Configuration
| Pin A1 | IO_L1P_T0 — User I/O bank 0, differential pair P |
| Pin A2 | IO_L1N_T0 — User I/O bank 0, differential pair N |
| Pin B1 | VCCINT — Internal core voltage supply |
| Pin B2 | GND — Ground |
| Pin C1 | IO_L2P_T0 — User I/O bank 0, differential pair P |
| Pin C2 | IO_L2N_T0 — User I/O bank 0, differential pair N |
| Pin D1 | VCCO_0 — I/O bank 0 supply voltage |
| Pin D2 | GND — Ground |
| Pin E1 | IO_L3P_T0 — User I/O bank 0, differential pair P |
| Pin E2 | IO_L3N_T0 — User I/O bank 0, differential pair N |
| Pin F1 | VCCAUX — Auxiliary supply voltage |
| Pin F2 | GND — Ground |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XC7K325T-2FBG676C is suitable for 6 applications: Software-Defined Radio, High-Performance Computing, Medical Imaging, Aerospace and Defense, Wired and Wireless Networking, Test and Measurement.
Software-Defined Radio
The XC7K325T-2FBG676C is ideal for software-defined radio (SDR) systems due to its 326,080 logic cells and 400 I/Os, which enable complex DSP chains, FFTs, and digital up/down converters. The -2 speed grade supports high sample rates, and the 28nm process offers good power efficiency. In an SDR, the FPGA handles baseband processing, channelization, and modulation/demodulation, replacing multiple fixed-function ICs. Its block RAM (16.4 Mb) supports buffering of wideband signals, while the high I/O count interfaces with high-speed ADCs and DACs. The lidless FCBGA package aids thermal management in rack-mounted units, ensuring reliable operation in continuous-duty environments.
Recommended
High-Performance Computing
In high-performance computing (HPC), the XC7K325T-2FBG676C accelerates custom algorithms by providing massive parallelism. With 326,080 logic cells and 400 I/Os, it can implement multiple processing elements, custom arithmetic units, and high-bandwidth interfaces. The -2 speed grade ensures fast clock rates for compute-intensive tasks, while the 28nm process balances performance and power. The FPGA's block RAM supports local data storage, reducing memory latency. It is commonly used in financial modeling, scientific simulations, and data analytics, where reconfigurable hardware can outperform general-purpose CPUs for specific workloads. The 676-FCBGA package allows dense board layouts, and the lidless design facilitates heatsink attachment for sustained high-performance operation.
Recommended
Medical Imaging
The XC7K325T-2FBG676C is well-suited for medical imaging systems like ultrasound and MRI, where real-time signal processing is critical. Its 326,080 logic cells enable implementation of beamforming, filtering, and image reconstruction algorithms. The 400 I/Os interface with high-speed ADCs and image sensors, while the 16.4 Mb block RAM buffers image data. The -2 speed grade supports the high throughput required for real-time imaging, and the 28nm process ensures low power for portable devices. The FPGA's reconfigurability allows algorithm updates without hardware changes, extending product life. The lidless FCBGA package aids in thermal management, which is essential in compact medical devices where space is limited.
Recommended
Aerospace and Defense
In aerospace and defense, the XC7K325T-2FBG676C is used for radar, electronic warfare, and secure communications. Its high logic density (326,080 cells) supports complex signal processing, encryption, and protocol handling. The 400 I/Os interface with sensors and communication links, while the 16.4 Mb block RAM stores critical data. The -2 speed grade provides the performance needed for real-time processing, and the 28nm process offers a balance of power and reliability. The lidless FCBGA package allows for robust thermal management in harsh environments. The FPGA's reconfigurability enables in-field updates, which is valuable for evolving mission requirements. Its commercial temperature range (0°C to 85°C) is suitable for many defense applications, though industrial grades are available for extended ranges.
Recommended
Wired and Wireless Networking
The XC7K325T-2FBG676C is used in networking equipment for packet processing, protocol conversion, and traffic management. Its 326,080 logic cells enable implementation of forwarding engines, QoS schedulers, and encryption modules. The 400 I/Os connect to PHYs, switches, and memory, while the 16.4 Mb block RAM supports packet buffering. The -2 speed grade ensures line-rate processing for 10G and 40G links, and the 28nm process provides power efficiency for dense line cards. The FPGA's reconfigurability allows support for evolving standards without hardware redesign. The lidless FCBGA package aids in thermal management in high-density networking chassis, ensuring reliable operation under continuous load.
Recommended
Test and Measurement
The XC7K325T-2FBG676C is ideal for test and measurement equipment like oscilloscopes, logic analyzers, and signal generators. Its 326,080 logic cells enable implementation of acquisition systems, triggering logic, and waveform generation. The 400 I/Os interface with high-speed ADCs, DACs, and display controllers, while the 16.4 Mb block RAM stores waveform data. The -2 speed grade supports high sample rates and fast trigger responses, and the 28nm process ensures low power for benchtop instruments. The FPGA's reconfigurability allows firmware updates to add new measurement features. The lidless FCBGA package aids in thermal management, which is important in instruments that run continuously. This makes it a flexible platform for both R&D and production test systems.
Recommended
Recommended Products Summary
Engineering reference data for XC7K325T-2FBG676C — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XC7K325T-1FBG676C | XC7K325T-3FBG676C | XC7K325T-1FFG676C |
|---|---|---|---|---|
| Package | 676-FCBGA (27x27 mm) | 676-FCBGA (27x27 mm) | 676-FCBGA (27x27 mm) | 676-FCBGA (27x27 mm) |
| Brand | AMD | AMD | AMD | AMD |
| Speed Grade | -2 | -1 | -3 | -1 |
| Logic Cells | 326080 | 326080 | 326080 | 326080 |
| Number of I/O | 400 | 400 | 400 | 400 |
| Total RAM Bits | 16404480 | 16404480 | 16404480 | 16404480 |
| Operating Temperature | 0°C to 85°C | 0°C to 85°C | 0°C to 85°C | 0°C to 85°C |
| Package Type | Lidless FCBGA | Lidless FCBGA | Lidless FCBGA | Flip-chip FCBGA |
Key Differentiators
- Higher performance than -1 speed grade (vs XC7K325T-1FBG676C)
- Lidless package for better thermal management (vs XC7K325T-1FFG676C)
- Balanced performance and power (vs XC7K325T-3FBG676C)
Design Notes
The XC7K325T-2FBG676C requires multiple supply rails: VCCINT (core), VCCAUX (auxiliary), and VCCO (I/O banks). Use low-impedance power planes and place decoupling capacitors (0.1uF and 1uF) close to each supply pin. Follow the AMD 7 Series FPGAs power supply recommendations in UG475 to ensure stable operation. Insufficient decoupling can cause logic errors and timing violations.
The lidless FCBGA package allows direct heatsink attachment for improved thermal performance. For high-power designs, calculate the junction temperature using the package thermal resistance (theta_JA) and ensure it stays below 85°C. Use a thermal interface material (TIM) between the die and heatsink. For applications exceeding 5W dissipation, a forced-air heatsink is recommended.
For the 676-FCBGA package, use a high-layer-count PCB (at least 8 layers) with dedicated power and ground planes. Route high-speed signals with controlled impedance (e.g., 50 ohm single-ended, 100 ohm differential) and minimize via stubs. Follow the PCB design guidelines in UG475 for pin escape and routing. Proper grounding is essential to reduce noise and ensure signal integrity.
Compliance Information
RoHS compliance is indicated by distributor listings. AEC-Q100 is not applicable for this commercial FPGA. REACH and conflict minerals status not specified in the provided data.
