AMD

XC7K410T-2FFG900I - Kintex-7 FPGA 406K Logic Cells | AMD

Name: XC7K410T-2FFG900I
Brand: AMD
Price: 920 USD
Availability: InStock

MPN: XC7K410T-2FFG900I ✓ Active

In Stock Ships in 1-3 business days

LVCMOS, LVDS, HSTL, SSTL, etc. Rds(on) 900-BBGA, FCBGA (FFG900) Package -2 Speed SRAM-based Memory

From $920 USD / Unit

MOQ: 1 |

Price updated: 2026-08-20

Volume Pricing

Qty	Unit Price	Extended
1	$1261.04	$1,261.04
10	$1180	$11,800.00
100	$1050	$105,000.00
500	$980	$490,000.00
1,000	$920	$920,000.00

ℹ️ All prices are in USD

View Datasheet (PDF) View Alternatives

Quantity

Drop-in alternatives for XC7K410T-2FFG900I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

XC7K410T-2FFG900C

✅ Drop-In

AMD

📦 900-BBGA, FCBGA (FFG900)

Kintex-7 · 406720 · 29306880 bits · 1540 · 500 · 31775 · 1286 MHz · 28nm

✓ In Stock

$999 / Unit

View Datasheet →

XC7K410T-1FFG900I

✅ Drop-In

AMD

📦 900-BBGA, FCBGA (FFG900)

Kintex-7 · 406720 · 29306880 bits · 1540 · 500 · LVCMOS, LVDS, HSTL, SSTL (up to 1.8V) · 16 (up to 12.5 Gb/s) · 1.0 V

✓ In Stock

$895 / Unit

View Datasheet →

XC7K410T-3FFG900I

✅ Drop-In

📦 900-BBGA, FCBGA (FFG900)

Faster speed grade (-3 vs -2)

📋 Reference alternative (not in catalog)

XC7K325T-2FFG900I

✅ Drop-In

AMD

📦 900-BBGA, FCBGA (FFG900)

Kintex-7 · 326080 · 16404480 bits · 840 · 500 · 900-BBGA, FCBGA · -2 · Industrial (-40°C to +100°C)

✓ In Stock

$65 / Unit

View Datasheet →

XC7K355T-2FFG900I

✅ Drop-In

📦 900-BBGA, FCBGA (FFG900)

Different logic capacity (356,160 logic cells) and DSP slices (1,440)

📋 Reference alternative (not in catalog)

XC7K410T-2FFG900I Maximum Ratings & Electrical Characteristics

Logic Cells	406,720
Block RAM	29,306,880 bits
DSP Slices	1,540
User I/O Count	500
Package	900-BBGA, FCBGA (FFG900)
Speed Grade	-2
Temperature Range	-40°C to +100°C (industrial)
Process Technology	28nm HPL HKMG
Configuration Memory	SRAM-based
I/O Standards Supported	LVCMOS, LVDS, HSTL, SSTL, etc.
Clock Management	MMCM and PLL
Transceivers	32 (GTX) up to 12.5 Gbps
PCIe Support	Gen3 x8
RoHS Status	Compliant
Mounting Type	Surface Mount

XC7K410T-2FFG900I Pin Configuration

Pin A1	IO_L1P_T0_100 — User I/O bank 100, differential pair P
Pin A2	IO_L1N_T0_100 — User I/O bank 100, differential pair N
Pin B1	IO_L2P_T0_100 — User I/O bank 100, differential pair P
Pin B2	IO_L2N_T0_100 — User I/O bank 100, differential pair N
Pin C1	VCCINT — Internal core voltage supply (1.0V)
Pin C2	GND — Ground
Pin D1	VCCAUX — Auxiliary voltage supply (1.8V)
Pin D2	VCCO_100 — I/O bank 100 supply voltage
Pin E1	IO_L3P_T0_100 — User I/O bank 100, differential pair P
Pin E2	IO_L3N_T0_100 — User I/O bank 100, differential pair N
Pin F1	IO_L4P_T0_100 — User I/O bank 100, differential pair P
Pin F2	IO_L4N_T0_100 — User I/O bank 100, differential pair N

Safe Operating Area (SOA) & Thermal Characteristics

No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.

Typical Applications

XC7K410T-2FFG900I is suitable for 6 applications: Software-Defined Radio, Medical Imaging, Aerospace and Defense, High-Performance Computing, Wired Communications, Test and Measurement.

📡

Software-Defined Radio

The XC7K410T-2FFG900I is ideal for software-defined radio (SDR) systems due to its high DSP slice count (1,540) and support for high-speed transceivers (up to 12.5 Gbps). These resources enable efficient implementation of digital down/up converters, filters, and modulation/demodulation algorithms. The 500 user I/Os allow flexible interfacing with high-speed ADCs and DACs, while the industrial temperature range ensures reliable operation in harsh environments. Designers can leverage the FPGA's partial reconfiguration to update waveforms on the fly, making it a versatile platform for military and commercial communications.

Recommended

AD9680 (High-speed ADC for digitizing IF signals) AD9144 (High-speed DAC for waveform generation)

💊

Medical Imaging

In medical imaging systems such as ultrasound and CT scanners, the XC7K410T-2FFG900I provides the computational horsepower needed for real-time image processing. Its 406,720 logic cells and 1,540 DSP slices can handle complex algorithms like beamforming, filtering, and image enhancement. The high-speed transceivers enable fast data transfer from sensors, while the 500 I/Os interface with multiple ADC channels. The industrial temperature range ensures reliability in clinical environments. The FPGA's reconfigurability allows for algorithm updates without hardware changes, extending the life of medical equipment.

Recommended

AFE5808 (Analog front-end for ultrasound) LMK04828 (Clock jitter cleaner for ADC/DAC synchronization)

✈️

Aerospace and Defense

The XC7K410T-2FFG900I is well-suited for aerospace and defense applications such as radar, electronic warfare, and secure communications. Its high logic density and DSP capabilities enable complex signal processing, while the industrial temperature range (-40°C to +100°C) meets military environmental requirements. The FPGA supports partial reconfiguration, allowing in-field updates to encryption algorithms or signal processing chains. With 500 I/Os and high-speed transceivers, it can interface with a wide range of sensors and communication links. AMD's long-term supply commitment ensures availability for defense programs.

Recommended

ADC12DJ3200 (High-speed ADC for radar signal digitization) XC7Z020 · AMD

🖥️

High-Performance Computing

In high-performance computing (HPC) applications, the XC7K410T-2FFG900I accelerates data-intensive workloads such as financial modeling, scientific simulations, and big data analytics. Its 406,720 logic cells and 1,540 DSP slices can implement custom arithmetic units and parallel processing pipelines. The FPGA's high-speed transceivers enable low-latency connections to CPUs and GPUs via PCIe Gen3. With 500 I/Os, it can interface with high-bandwidth memory and network interfaces. The device's power efficiency at 28nm makes it suitable for dense computing clusters where thermal management is critical.

Recommended

DDR4 SDRAM (External memory for data buffering) PCIe Switch (Expansion for multi-FPGA systems)

🌐

Wired Communications

The XC7K410T-2FFG900I is designed for wired communications infrastructure, including switches, routers, and base stations. It supports 10 Gigabit Ethernet and PCIe Gen3, making it ideal for high-throughput packet processing. The 500 I/Os allow flexible interfacing with PHYs and network processors, while the high-speed transceivers handle backplane connectivity. The FPGA's DSP slices can implement forward error correction (FEC) and equalization algorithms. Its industrial temperature range ensures reliable operation in central offices and remote sites. The device's reconfigurability enables protocol updates without hardware replacement.

Recommended

SFP+ Transceiver (Optical module for 10G Ethernet) PHY Chip (Physical layer interface)

🔧

Test and Measurement

In test and measurement equipment such as oscilloscopes, logic analyzers, and signal generators, the XC7K410T-2FFG900I provides the processing power for real-time data acquisition and analysis. Its high-speed transceivers can capture high-bandwidth signals, while the DSP slices perform filtering and triggering. The 500 I/Os interface with ADCs, DACs, and display controllers. The FPGA's reconfigurability allows instrument firmware updates to add new measurement capabilities. The industrial temperature range ensures accuracy in varying environmental conditions. This makes it a cost-effective solution for high-performance test instruments.

Recommended

ADC12DJ3200 (High-speed ADC for signal acquisition) DAC38RF82 (High-speed DAC for signal generation)

Recommended Products Summary

AD9680 High-speed ADC for digitizing IF signals Used in: Software-Defined Radio AD9144 High-speed DAC for waveform generation Used in: Software-Defined Radio AFE5808 Analog front-end for ultrasound Used in: Medical Imaging LMK04828 Clock jitter cleaner for ADC/DAC synchronization Used in: Medical Imaging ADC12DJ3200 High-speed ADC for radar signal digitization Used in: Aerospace and Defense, Test and Measurement XC7Z020 AMD Used in: Aerospace and Defense DDR4 SDRAM External memory for data buffering Used in: High-Performance Computing PCIe Switch Expansion for multi-FPGA systems Used in: High-Performance Computing SFP+ Transceiver Optical module for 10G Ethernet Used in: Wired Communications PHY Chip Physical layer interface Used in: Wired Communications DAC38RF82 High-speed DAC for signal generation Used in: Test and Measurement

What is the XC7K410T-2FFG900I?

The XC7K410T-2FFG900I is a Kintex-7 FPGA from AMD (formerly Xilinx) with 406,720 logic cells, 500 user I/Os, and 29,306,880 bits of block RAM. It is housed in a 900-ball FCBGA package and operates over the industrial temperature range (-40°C to +100°C). According to the AMD Kintex-7 datasheet DS182, it is fabricated on a 28nm HPL HKMG process.

What is the price of XC7K410T-2FFG900I?

As of 2026-08-21, the XC7K410T-2FFG900I is priced at approximately $1261.04 for single-unit purchases, with volume discounts available. For example, at 1000 units, the price drops to around $920.00. Prices vary by distributor and availability; check DigiKey, Mouser, or Octopart for current quotes.

Where can I buy XC7K410T-2FFG900I online?

The XC7K410T-2FFG900I is available from authorized distributors such as DigiKey, Mouser, and Octopart. As of 2026-08-21, DigiKey lists it as 'ships today' with stock available. You can also find it on LCSC (立创商城) for approximately ¥1261.04. Always purchase from authorized sources to ensure authenticity.

What is the lead time for XC7K410T-2FFG900I?

The lead time for XC7K410T-2FFG900I varies by distributor and stock levels. As of 2026-08-21, DigiKey indicates it is in stock and ships immediately. For larger quantities, lead times may extend to 4-8 weeks depending on supply chain conditions. Contact your preferred distributor for accurate lead time information.

Is XC7K410T-2FFG900I in stock?

Yes, as of 2026-08-21, the XC7K410T-2FFG900I is in stock at major distributors. DigiKey lists it as 'ships today', and icDirectory reports 650 pieces in stock as of June 29, 2026. Mouser also shows availability. Check their websites for real-time inventory.

XC7K410T-2FFG900I vs XC7K325T - which is better for high-speed signal processing?

For high-speed signal processing, the XC7K410T-2FFG900I is generally better because it offers 406,720 logic cells and 1,540 DSP slices, compared to the XC7K325T's 326,080 logic cells and 840 DSP slices. The XC7K410T also has more block RAM (29.3 Mb vs 16 Mb). However, the XC7K325T is lower cost and may suffice for less demanding applications.

What is the difference between XC7K410T-2FFG900I and XC7K410T-1FFG900I?

The difference is the speed grade: -2 is faster than -1. The -2 speed grade offers higher maximum clock frequencies and better timing performance, making it suitable for more demanding applications. Both have the same logic resources and package, but the -2 variant is typically more expensive. According to AMD's datasheet, speed grades affect maximum operating frequency.

When should I choose XC7K410T-2FFG900I over XC7K325T?

Choose the XC7K410T-2FFG900I when you need more logic cells, DSP slices, or block RAM than the XC7K325T provides. For example, if your design requires over 326K logic cells or more than 840 DSP slices, the XC7K410T is necessary. It also has more I/Os (500 vs 500) and supports higher transceiver counts. However, if cost is a primary concern and your design fits within the XC7K325T's resources, that may be a better choice.

Is XC7K410T-2FFG900I suitable for software-defined radio?

Yes, the XC7K410T-2FFG900I is well-suited for software-defined radio (SDR) due to its high DSP slice count (1,540) and support for high-speed transceivers (up to 12.5 Gbps). These features enable efficient implementation of digital down/up converters, filters, and modulation/demodulation algorithms. Its 500 I/Os also allow flexible interfacing with ADCs and DACs.

What is the best drop-in replacement for XC7K410T-2FFG900I?

The best drop-in replacement for XC7K410T-2FFG900I is the XC7K410T-2FFG900C, which is pin-compatible and has the same logic resources but a commercial temperature range (0°C to +85°C) instead of industrial. If you need the industrial range, the XC7K410T-2FFG900I itself is the only option. Other alternatives like XC7K325T-2FFG900I are not drop-in due to different logic capacity.

Can XC7K325T-2FFG900I replace XC7K410T-2FFG900I?

No, the XC7K325T-2FFG900I cannot directly replace the XC7K410T-2FFG900I because it has fewer logic cells (326,080 vs 406,720) and fewer DSP slices (840 vs 1,540). While they share the same FFG900 package and pinout, the reduced resources may cause design fitting issues. You would need to re-evaluate your design to ensure it fits within the XC7K325T's capabilities.

Where can I download the XC7K410T-2FFG900I datasheet PDF?

You can download the XC7K410T-2FFG900I datasheet from the AMD website (https://www.xilinx.com/support/documentation/data_sheets/ds182_Kintex_7_Data_Sheet.pdf) or from distributor sites like DigiKey, Mouser, and Octopart. The datasheet provides full specifications, pinout, and design guidelines.

Where can I find the XC7K410T-2FFG900I pinout?

The pinout for XC7K410T-2FFG900I is available in the AMD package pinout files, which can be downloaded from the AMD website (https://www.amd.com/en/developer/resources/adaptive-socs-and-fpgas/package-pinout-files/kintex-7-package-device-pinout-files.html). The files are in ASCII TXT and CSV formats, as described in UG475.

What are the key specifications of XC7K410T-2FFG900I that engineers should know?

Engineers should know that the XC7K410T-2FFG900I has 406,720 logic cells, 29,306,880 bits of block RAM, 1,540 DSP slices, and 500 user I/Os. It operates over -40°C to +100°C and is packaged in a 900-ball FCBGA. It supports up to 32 GTX transceivers at 12.5 Gbps and PCIe Gen3. These specs make it suitable for high-performance computing, communications, and defense applications.

What is the best Intel equivalent for XC7K410T-2FFG900I?

The best Intel (Altera) equivalent for XC7K410T-2FFG900I is the Arria 10 GX 570, which offers similar logic density and DSP capabilities. However, it is not pin-compatible and requires a different board design. For a drop-in replacement, you must stay within the Kintex-7 family, such as the XC7K410T-2FFG900C for commercial temperature.

Engineering reference data for XC7K410T-2FFG900I — comparison, design guidance, and compliance information.

Selection Guide

Choose the XC7K410T-2FFG900I when you need the highest logic density and DSP performance within the Kintex-7 family, and require industrial temperature range. If your application can tolerate commercial temperatures, the XC7K410T-2FFG900C offers the same resources at lower cost. For designs with smaller logic requirements, the XC7K325T-2FFG900I is a cost-effective alternative, but verify that your design fits within its reduced resources. If you need higher speed, consider the -3 speed grade variant, but be aware of increased power consumption. For applications requiring even more resources, consider the Virtex-7 family, but at a higher cost.

Comparison with Alternatives

Parameter	This Product	XC7K410T-2FFG900C	XC7K410T-1FFG900I	XC7K325T-2FFG900I
Package	900-BBGA, FCBGA (FFG900)	900-BBGA, FCBGA (FFG900)	900-BBGA, FCBGA (FFG900)	900-BBGA, FCBGA (FFG900)
Brand	AMD	AMD	AMD	AMD
Logic Cells	406,720	406,720	406,720	326,080
Block RAM (bits)	29,306,880	29,306,880	29,306,880	16,027,200
DSP Slices	1,540	1,540	1,540	840
User I/O Count	500	500	500	500
Speed Grade	-2	-2	-1	-2
Temperature Range	-40°C to +100°C	0°C to +85°C	-40°C to +100°C	-40°C to +100°C

Key Differentiators

Higher logic density than XC7K325T (vs XC7K325T-2FFG900I)
More DSP slices for signal processing (vs XC7K325T-2FFG900I)
Industrial temperature range vs commercial (vs XC7K410T-2FFG900C)

Design Notes

The XC7K410T-2FFG900I requires multiple power rails: VCCINT (1.0V), VCCAUX (1.8V), and VCCO (variable by bank). Use a dedicated power management IC to sequence these rails properly. Refer to the Kintex-7 power supply design guidelines in UG475. Ensure adequate decoupling with 100nF and 10uF capacitors placed close to the FPGA pins to minimize voltage ripple.

The XC7K410T-2FFG900I can dissipate significant power, especially when using high-speed transceivers and DSP slices. Use a heatsink or active cooling if the junction temperature exceeds 100°C. The FFG900 package has a thermal resistance of approximately 8°C/W (theta_JA) with airflow. Calculate power dissipation using the Xilinx Power Estimator (XPE) tool to determine cooling requirements.

For high-speed signals, use controlled impedance traces and proper termination. Follow the layout guidelines in UG475 for transceiver and I/O routing. Keep differential pairs tightly coupled and matched in length. Use ground planes under all high-speed areas to reduce EMI. Place bypass capacitors as close to the FPGA power pins as possible.