XC7K410T-2FFG900I - Kintex-7 FPGA 406K Logic Cells | AMD
Référence : XC7K410T-2FFG900I ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1261.04 | $1 261,04 |
| 10 | $1180 | $11 800,00 |
| 100 | $1050 | $105 000,00 |
| 500 | $980 | $490 000,00 |
| 1 000 | $920 | $920 000,00 |
XC7K410T-2FFG900I Présentation
An FPGA (Field Programmable Gate Array) is an integrated circuit that can be configured by the customer or designer after manufacturing—hence 'field-programmable'. It consists of an array of programmable logic blocks, interconnects, and I/O blocks that can be programmed to implement complex digital functions. FPGAs are a subset of programmable logic devices (PLDs) and are widely used in prototyping, signal processing, and high-speed interfacing where ASIC development is impractical.
Key features of the XC7K410T-2FFG900I include 500 user I/Os, 29,306,880 bits of block RAM, and 1,540 DSP slices (DSP48E1). It supports multiple I/O standards including LVCMOS, LVDS, and HSTL, and includes advanced clock management through MMCM (Mixed-Mode Clock Manager) and PLL (Phase-Locked Loop) blocks. The device also supports partial reconfiguration, enabling dynamic updates to logic functions without powering down.
From a technical perspective, the Kintex-7 family balances performance and power efficiency, making it suitable for cost-sensitive, high-volume applications. The -2 speed grade indicates a mid-range performance level, with the 'I' suffix denoting an industrial temperature range (-40°C to +100°C). The FFG900 package provides a 900-ball footprint with a 31x31 mm body, offering excellent thermal and electrical characteristics for high-density designs.
Typical applications include software-defined radio, medical imaging, aerospace and defense systems, and high-performance computing. The device's high DSP ratio and support for 10 Gigabit Ethernet make it ideal for communications infrastructure and data acquisition systems.
When designing with this FPGA, careful attention must be paid to power supply decoupling and thermal management. The device requires multiple supply rails (VCCINT, VCCAUX, VCCO) and a robust power distribution network. Adequate PCB layout with proper grounding and bypass capacitors is essential for reliable operation at high speeds.
Alternatives de remplacement direct pour XC7K410T-2FFG900I — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec XC7K410T-2FFG900I (même facteur de forme et même empreinte) — différant par Block RAM, DSP Slices, Logic Cells, Package, Process Technology.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
XC7K410T-2FFG900C
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$999 / unité
Voir la fiche technique →XC7K410T-1FFG900I
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$895 / unité
Voir la fiche technique →XC7K410T-3FFG900I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7K325T-2FFG900I
✅ Remplacement direct✓ En stock
$65 / unité
Voir la fiche technique →XC7K355T-2FFG900I
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
XC7K410T-2FFG900I Valeurs maximales et caractéristiques électriques
| Logic Cells | 406,720 |
| Block RAM | 29,306,880 bits |
| DSP Slices | 1,540 |
| User I/O Count | 500 |
| Boîtier | 900-BBGA, FCBGA (FFG900) |
| Speed Grade | -2 |
| Temperature Range | -40°C to +100°C (industrial) |
| Process Technology | 28nm HPL HKMG |
| Configuration Memory | SRAM-based |
| I/O Standards Supported | LVCMOS, LVDS, HSTL, SSTL, etc. |
| Clock Management | MMCM and PLL |
| Transceivers | 32 (GTX) up to 12.5 Gbps |
| PCIe Support | Gen3 x8 |
| Statut RoHS | Compliant |
| Type de montage | Surface Mount |
Configuration des broches de XC7K410T-2FFG900I
| Broche A1 | IO_L1P_T0_100 — User I/O bank 100, differential pair P |
| Broche A2 | IO_L1N_T0_100 — User I/O bank 100, differential pair N |
| Broche B1 | IO_L2P_T0_100 — User I/O bank 100, differential pair P |
| Broche B2 | IO_L2N_T0_100 — User I/O bank 100, differential pair N |
| Broche C1 | VCCINT — Internal core voltage supply (1.0V) |
| Broche C2 | GND — Ground |
| Broche D1 | VCCAUX — Auxiliary voltage supply (1.8V) |
| Broche D2 | VCCO_100 — I/O bank 100 supply voltage |
| Broche E1 | IO_L3P_T0_100 — User I/O bank 100, differential pair P |
| Broche E2 | IO_L3N_T0_100 — User I/O bank 100, differential pair N |
| Broche F1 | IO_L4P_T0_100 — User I/O bank 100, differential pair P |
| Broche F2 | IO_L4N_T0_100 — User I/O bank 100, differential pair N |
Applications typiques
XC7K410T-2FFG900I convient pour 6 applications: Software-Defined Radio, Medical Imaging, Aerospace and Defense, High-Performance Computing, Wired Communications, Test and Measurement.
Software-Defined Radio
The XC7K410T-2FFG900I is ideal for software-defined radio (SDR) systems due to its high DSP slice count (1,540) and support for high-speed transceivers (up to 12.5 Gbps). These resources enable efficient implementation of digital down/up converters, filters, and modulation/demodulation algorithms. The 500 user I/Os allow flexible interfacing with high-speed ADCs and DACs, while the industrial temperature range ensures reliable operation in harsh environments. Designers can leverage the FPGA's partial reconfiguration to update waveforms on the fly, making it a versatile platform for military and commercial communications.
Recommandé
Medical Imaging
In medical imaging systems such as ultrasound and CT scanners, the XC7K410T-2FFG900I provides the computational horsepower needed for real-time image processing. Its 406,720 logic cells and 1,540 DSP slices can handle complex algorithms like beamforming, filtering, and image enhancement. The high-speed transceivers enable fast data transfer from sensors, while the 500 I/Os interface with multiple ADC channels. The industrial temperature range ensures reliability in clinical environments. The FPGA's reconfigurability allows for algorithm updates without hardware changes, extending the life of medical equipment.
Recommandé
Aerospace and Defense
The XC7K410T-2FFG900I is well-suited for aerospace and defense applications such as radar, electronic warfare, and secure communications. Its high logic density and DSP capabilities enable complex signal processing, while the industrial temperature range (-40°C to +100°C) meets military environmental requirements. The FPGA supports partial reconfiguration, allowing in-field updates to encryption algorithms or signal processing chains. With 500 I/Os and high-speed transceivers, it can interface with a wide range of sensors and communication links. AMD's long-term supply commitment ensures availability for defense programs.
Recommandé
High-Performance Computing
In high-performance computing (HPC) applications, the XC7K410T-2FFG900I accelerates data-intensive workloads such as financial modeling, scientific simulations, and big data analytics. Its 406,720 logic cells and 1,540 DSP slices can implement custom arithmetic units and parallel processing pipelines. The FPGA's high-speed transceivers enable low-latency connections to CPUs and GPUs via PCIe Gen3. With 500 I/Os, it can interface with high-bandwidth memory and network interfaces. The device's power efficiency at 28nm makes it suitable for dense computing clusters where thermal management is critical.
Recommandé
Wired Communications
The XC7K410T-2FFG900I is designed for wired communications infrastructure, including switches, routers, and base stations. It supports 10 Gigabit Ethernet and PCIe Gen3, making it ideal for high-throughput packet processing. The 500 I/Os allow flexible interfacing with PHYs and network processors, while the high-speed transceivers handle backplane connectivity. The FPGA's DSP slices can implement forward error correction (FEC) and equalization algorithms. Its industrial temperature range ensures reliable operation in central offices and remote sites. The device's reconfigurability enables protocol updates without hardware replacement.
Recommandé
Test and Measurement
In test and measurement equipment such as oscilloscopes, logic analyzers, and signal generators, the XC7K410T-2FFG900I provides the processing power for real-time data acquisition and analysis. Its high-speed transceivers can capture high-bandwidth signals, while the DSP slices perform filtering and triggering. The 500 I/Os interface with ADCs, DACs, and display controllers. The FPGA's reconfigurability allows instrument firmware updates to add new measurement capabilities. The industrial temperature range ensures accuracy in varying environmental conditions. This makes it a cost-effective solution for high-performance test instruments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour XC7K410T-2FFG900I — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | XC7K410T-2FFG900C | XC7K410T-1FFG900I | XC7K325T-2FFG900I |
|---|---|---|---|---|
| Package | 900-BBGA, FCBGA (FFG900) | 900-BBGA, FCBGA (FFG900) | 900-BBGA, FCBGA (FFG900) | 900-BBGA, FCBGA (FFG900) |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 406,720 | 406,720 | 406,720 | 326,080 |
| Block RAM (bits) | 29,306,880 | 29,306,880 | 29,306,880 | 16,027,200 |
| DSP Slices | 1,540 | 1,540 | 1,540 | 840 |
| User I/O Count | 500 | 500 | 500 | 500 |
| Speed Grade | -2 | -2 | -1 | -2 |
| Temperature Range | -40°C to +100°C | 0°C to +85°C | -40°C to +100°C | -40°C to +100°C |
Principaux différenciateurs
- Higher logic density than XC7K325T (vs XC7K325T-2FFG900I)
- More DSP slices for signal processing (vs XC7K325T-2FFG900I)
- Industrial temperature range vs commercial (vs XC7K410T-2FFG900C)
Notes de conception
The XC7K410T-2FFG900I requires multiple power rails: VCCINT (1.0V), VCCAUX (1.8V), and VCCO (variable by bank). Use a dedicated power management IC to sequence these rails properly. Refer to the Kintex-7 power supply design guidelines in UG475. Ensure adequate decoupling with 100nF and 10uF capacitors placed close to the FPGA pins to minimize voltage ripple.
The XC7K410T-2FFG900I can dissipate significant power, especially when using high-speed transceivers and DSP slices. Use a heatsink or active cooling if the junction temperature exceeds 100°C. The FFG900 package has a thermal resistance of approximately 8°C/W (theta_JA) with airflow. Calculate power dissipation using the Xilinx Power Estimator (XPE) tool to determine cooling requirements.
For high-speed signals, use controlled impedance traces and proper termination. Follow the layout guidelines in UG475 for transceiver and I/O routing. Keep differential pairs tightly coupled and matched in length. Use ground planes under all high-speed areas to reduce EMI. Place bypass capacitors as close to the FPGA power pins as possible.
Informations de conformité
RoHS compliant per AMD product page. Not AEC-Q100 qualified as it is not an automotive part.
