XCZU15EG-1FFVB1156E - Zynq UltraScale+ MPSoC EG | AMD
MPN: XCZU15EG-1FFVB1156E ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1200 | $1,200.00 |
| 10 | $1100 | $11,000.00 |
| 100 | $950 | $95,000.00 |
| 500 | $850 | $425,000.00 |
| 1,000 | $750 | $750,000.00 |
Drop-in alternatives for XCZU15EG-1FFVB1156E — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
XCZU15EG-1FFVB1156I
✅ Drop-In📋 Reference alternative (not in catalog)
XCZU15EG-2FFVB1156I
✅ Drop-In✓ In Stock
$327.94 / Unit
View Datasheet →XCZU15EG-L1FFVB1156I
✅ Drop-In📋 Reference alternative (not in catalog)
XCZU15EG-1FFVC900I
✅ Drop-In📋 Reference alternative (not in catalog)
XCZU15EG-2FFVB1156E
✅ Drop-In📋 Reference alternative (not in catalog)
XCZU15EG-1FFVB1156E Maximum Ratings & Electrical Characteristics
| Family | Zynq UltraScale+ MPSoC EG |
| Core Processor | Quad ARM Cortex-A53 MPCore with CoreSight, Dual ARM Cortex-R5 with CoreSight, ARM Mali-400 MP2 |
| Logic Cells | 747K+ |
| Number of I/O | 328 |
| RAM Size | 256KB |
| Package | 1156-FCBGA (35x35 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | 0°C to +100°C |
| Core Voltage | 0.85V (nominal), 0.825V min, 0.876V max |
| Technology | 20nm |
| Speed Grade | -1 (standard) |
| Clock Speed | 500MHz (Cortex-R5), 600MHz (Cortex-A53), 1.2GHz (Mali-400) |
| MSL Level | 4 (72 Hours) |
| Manufacturer Pack Quantity | 1 |
| Supply Voltage | 0.85V |
XCZU15EG-1FFVB1156E Pin Configuration
| Pin A1 | GND — Ground |
| Pin A2 | VCCINT — Internal core voltage (0.85V) |
| Pin A3 | IO_L1P_T0 — User I/O bank 0 |
| Pin B1 | VCCAUX — Auxiliary voltage (1.8V) |
| Pin B2 | GND — Ground |
| Pin C1 | IO_L2N_T0 — User I/O bank 0 |
| Pin C2 | VCCBRAM — Block RAM voltage |
| Pin D1 | IO_L3P_T1 — User I/O bank 1 |
| Pin D2 | GND — Ground |
| Pin E1 | IO_L4N_T1 — User I/O bank 1 |
| Pin E2 | VCCINT — Internal core voltage (0.85V) |
| Pin F1 | IO_L5P_T2 — User I/O bank 2 |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
XCZU15EG-1FFVB1156E is suitable for 6 applications: Software-Defined Radio, Medical Imaging, Aerospace and Defense, Industrial Automation, Data Center and Networking, Automotive Driver Assistance.
Software-Defined Radio
The XCZU15EG-1FFVB1156E is ideal for software-defined radio (SDR) systems. Its 747K+ logic cells can implement complex digital signal processing (DSP) chains, including filters, FFTs, and modulation/demodulation. The quad-core Cortex-A53 runs protocol stacks and control software, while the dual-core Cortex-R5 handles real-time tasks. The Mali-400 GPU can support spectrum visualization. The device's high-speed transceivers enable wideband RF interfaces. The 0.85V core voltage and 20nm process provide a good balance of performance and power efficiency for portable or fixed SDR platforms.
Recommended
Medical Imaging
In medical imaging systems like ultrasound or CT scanners, the XCZU15EG-1FFVB1156E provides the computational power needed for real-time image processing. The FPGA fabric can accelerate beamforming, filtering, and image reconstruction algorithms, while the ARM cores manage system control and user interfaces. The Mali-400 GPU can render 2D/3D images. The device's 328 I/O pins allow interfacing with high-speed ADCs and sensors. The extended temperature range (0°C to +100°C) is suitable for controlled clinical environments. The 256KB on-chip RAM supports low-latency data buffering.
Recommended
Aerospace and Defense
The XCZU15EG-1FFVB1156E is well-suited for aerospace and defense applications such as radar, electronic warfare, and secure communications. The combination of ARM cores and FPGA fabric allows for flexible, reconfigurable processing. The device's 747K+ logic cells can implement complex beamforming and signal intelligence algorithms. The dual-core Cortex-R5 provides deterministic real-time control. The 1156-FCBGA package is robust for harsh environments. The 'E' temperature grade (0°C to +100°C) is suitable for many defense platforms, though the 'I' variant is available for wider ranges. The 20nm technology offers a good balance of performance and power.
Recommended
Industrial Automation
For industrial automation and control systems, the XCZU15EG-1FFVB1156E provides a powerful platform for machine vision, motion control, and real-time networking. The FPGA fabric can implement custom motor control loops, vision processing, and industrial Ethernet protocols (e.g., EtherCAT). The ARM cores run Linux or RTOS for system management and HMI. The device's 328 I/O pins interface with sensors, actuators, and encoders. The 0.85V core voltage and 20nm process ensure efficient operation. The extended temperature range (0°C to +100°C) covers most factory environments. The Mali-400 GPU can support graphical HMIs.
Recommended
Data Center and Networking
The XCZU15EG-1FFVB1156E can be used in data center and networking equipment for packet processing, security, and acceleration. The FPGA fabric can implement custom packet parsers, encryption engines, and load balancers. The ARM cores handle control plane functions and management. The device's high-speed transceivers support 10/25/40/100G Ethernet. The 747K+ logic cells provide ample resources for complex networking algorithms. The 256KB on-chip RAM reduces latency for time-critical operations. The 0.85V core voltage and 20nm process offer competitive power efficiency for rack-mounted equipment.
Recommended
Automotive Driver Assistance
In automotive advanced driver assistance systems (ADAS), the XCZU15EG-1FFVB1156E can process sensor data from cameras, radar, and LiDAR. The FPGA fabric can implement real-time image processing, object detection, and sensor fusion algorithms. The ARM cores run the application software and communicate with vehicle networks. The Mali-400 GPU can support display rendering for driver information. The device's 328 I/O pins interface with various sensors. The extended temperature range (0°C to +100°C) is suitable for passenger cabin applications. The 20nm process provides a balance of performance and power for automotive electronics.
Recommended
Recommended Products Summary
Engineering reference data for XCZU15EG-1FFVB1156E — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | XCZU15EG-1FFVB1156I | XCZU15EG-2FFVB1156I | XCZU15EG-L1FFVB1156I |
|---|---|---|---|---|
| Package | 1156-FCBGA (35x35 mm) | 1156-FCBGA (35x35 mm) - same | 1156-FCBGA (35x35 mm) - same | 1156-FCBGA (35x35 mm) - same |
| Brand | AMD | AMD | AMD | AMD |
| Logic Cells | 747K+ | 747K+ | 747K+ | 747K+ |
| Temperature Range | 0°C to +100°C | -40°C to +100°C | -40°C to +100°C | -40°C to +100°C |
| Speed Grade | -1 | -1 | -2 | -1 |
| Core Voltage | 0.85V | 0.85V | 0.85V | 0.85V |
| Number of I/O | 328 | 328 | 328 | 328 |
| RAM Size | 256KB | 256KB | 256KB | 256KB |
Key Differentiators
- Extended temperature range (0°C to +100°C) (vs XCZU15EG-1FFVB1156I)
- Standard speed grade (-1) (vs XCZU15EG-2FFVB1156I)
- Standard power variant (vs XCZU15EG-L1FFVB1156I)
Design Notes
The XCZU15EG-1FFVB1156E requires multiple power rails: VCCINT (0.85V), VCCAUX (1.8V), and VCCBRAM. Use a dedicated power management IC (PMIC) like the TPS650864 to sequence these rails correctly. Ensure proper decoupling with 100nF and 10uF capacitors close to each power pin. The core voltage must be within 0.825V to 0.876V for reliable operation.
The 1156-FCBGA package can dissipate significant power under heavy logic utilization. Use a heatsink or active cooling for applications exceeding 10W. The thermal resistance (theta_JA) is [DATA_NEEDED: theta_JA]. Ensure adequate airflow in the enclosure. The operating temperature range is 0°C to +100°C, so monitor junction temperature to avoid exceeding the maximum.
The 1156-FCBGA package requires a multi-layer PCB with dedicated power and ground planes. Use at least 8 layers for routing. Follow AMD's layout guidelines for high-speed transceivers and DDR interfaces. Place the device on a 35x35 mm footprint with proper solder mask and stencil design. MSL level 4 (72 hours) requires baking before reflow if exposed to humidity.
Compliance Information
RoHS compliant per AMD product page. Not AEC-Q100 qualified - this is a commercial-grade SoC.
