YZ48G16V-F9HPI-M - 8Gb DDR4 SDRAM x16 FBGA96 | Loongtion
Teilenummer: YZ48G16V-F9HPI-M ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $12.5 | $12,50 |
| 10 | $11.2 | $112,00 |
| 100 | $10.1 | $1.010,00 |
| 500 | $9.3 | $4.650,00 |
| 1.000 | $8.6 | $8.600,00 |
YZ48G16V-F9HPI-M Übersicht
DDR4 SDRAM (Double Data Rate 4 Synchronous Dynamic Random-Access Memory) is a type of volatile memory that transfers data on both rising and falling edges of the clock signal, effectively doubling the data rate. It is the fourth generation of DDR memory, succeeding DDR3, and offers higher speed, lower power consumption, and increased density. DDR4 operates at a standard voltage of 1.2V, compared to 1.5V for DDR3, reducing power consumption by up to 40%. In the memory hierarchy, DDR4 SDRAM sits as the main system memory, directly interfacing with the memory controller on the CPU or SoC, and is essential for storing active data and instructions.
Key features of the YZ48G16V-F9HPI-M include its 8Gb density, x16 organization, and FBGA96 package, which is pin-to-pin compatible with Samsung K4A8G165WC-BCWE and Micron MT40A512M16JY-07EAIT:B. The device supports a wide temperature range of -40°C to +85°C, ensuring reliable operation in extreme conditions. It also offers high-speed data transfer up to 3200 MT/s, enabling high-bandwidth applications. The industrial-grade qualification ensures robust performance and longevity in demanding environments.
Technically, the YZ48G16V-F9HPI-M utilizes advanced DDR4 architecture with on-die ECC and data bus inversion to enhance signal integrity. The FBGA96 package provides a compact footprint while maintaining excellent thermal and electrical characteristics. The device is designed to meet JEDEC DDR4 standards, ensuring compatibility with standard memory controllers. The wide-temperature operation is achieved through rigorous testing and selection of components, making it a reliable choice for industrial applications.
Typical applications include embedded systems, networking equipment, industrial PCs, and edge computing devices that require high-capacity, high-speed memory in harsh environments. The YZ48G16V-F9HPI-M is particularly suited for outdoor telecom base stations, oil & gas monitoring systems, and industrial automation controllers where temperature extremes are common.
When designing with this device, ensure proper decoupling capacitors are placed near the power pins to minimize noise. Also, verify the memory controller supports the x16 organization and FBGA96 package. The wide-temperature range should be considered in thermal design to ensure the device operates within its specified limits.
Drop-in-Alternativen für YZ48G16V-F9HPI-M – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit YZ48G16V-F9HPI-M (gleiche Bauform und Footprint) – abweichend in Package, Data Rate, Interface, Memory Size, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
K4A8G165WC-BCWE
✅ Drop-In✓ Auf Lager
$38 / Stück
Datenblatt ansehen →MT40A512M16JY-07EAIT:B
✅ Drop-In✓ Auf Lager
$8.1 / Stück
Datenblatt ansehen →K4A8G165WB-BCTD
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$37 / Stück
Datenblatt ansehen →K4A8G165WB-BIWE
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$14.22 / Stück
Datenblatt ansehen →MT40A512M16TB-062E:R
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$60 / Stück
Datenblatt ansehen →H5AN8G6NDJR-XNC
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$55.6818 / Stück
Datenblatt ansehen →YZ48G16V-F9HPI-M Technische Daten
| Speichertyp | DDR4 SDRAM |
| Density | 8 Gb |
| Speicherorganisation | 512M x 16 |
| Datenrate | 3200 MT/s |
| Gehäuse | FBGA96 |
| Betriebstemperaturbereich | -40°C to +85°C |
| Versorgungsspannung | 1.2 V |
| Schnittstelle | DDR4 |
| Pin-Anzahl | 96 |
| Montageart | Surface Mount |
| RoHS-Status | Compliant |
| Industrial Grade | Yes |
| Compatible with | Samsung K4A8G165WC-BCWE, Micron MT40A512M16JY-07EAIT:B |
| Datenbusbreite | 16 bits |
| Refresh | Auto-refresh |
YZ48G16V-F9HPI-M Pin-Konfiguration
| Pin A1 | VDD — Power supply |
| Pin A2 | DQ0 — Data input/output 0 |
| Pin A3 | DQ1 — Data input/output 1 |
| Pin B1 | VSS — Ground |
| Pin B2 | DQ2 — Data input/output 2 |
| Pin B3 | DQ3 — Data input/output 3 |
| Pin C1 | VDDQ — I/O power supply |
| Pin C2 | DQ4 — Data input/output 4 |
| Pin C3 | DQ5 — Data input/output 5 |
| Pin D1 | VSSQ — I/O ground |
| Pin D2 | DQ6 — Data input/output 6 |
| Pin D3 | DQ7 — Data input/output 7 |
| Pin E1 | VDD — Power supply |
| Pin E2 | DQS0 — Data strobe 0 |
| Pin E3 | DQS0# — Data strobe 0 complement |
Typische Anwendungen
YZ48G16V-F9HPI-M ist geeignet für 6 Anwendungs: Industrial Edge Computing, Outdoor Telecom Base Stations, Oil & Gas Monitoring Systems, Embedded Systems, Networking Equipment, Test & Measurement Instruments.
Industrial Edge Computing
The YZ48G16V-F9HPI-M provides high-density, high-speed memory for industrial edge servers and gateways. Its wide-temperature range (-40°C to +85°C) ensures reliable operation in unenclosed or outdoor installations. With 8Gb density and 3200 MT/s data rate, it supports real-time data processing and analytics at the edge. The FBGA96 package allows compact PCB designs, and its pin-to-pin compatibility with Samsung and Micron parts simplifies BOM management. When used in edge computing, the memory must handle frequent read/write cycles; the industrial-grade design ensures endurance and stability. Proper thermal management is essential to keep the device within its operating range, especially in high-ambient-temperature environments.
Empfohlen
Outdoor Telecom Base Stations
In outdoor telecom base stations, the YZ48G16V-F9HPI-M offers reliable memory for baseband processing and network management. Its wide-temperature operation is critical for equipment exposed to extreme weather conditions. The 8Gb density supports large routing tables and buffering, while 3200 MT/s ensures low-latency data transfer. The FBGA96 package is ideal for space-constrained boards. The device's compatibility with standard DDR4 controllers simplifies integration. For telecom applications, signal integrity is paramount; proper PCB layout with controlled impedance and decoupling capacitors is recommended. The industrial-grade reliability reduces downtime in remote installations.
Empfohlen
Oil & Gas Monitoring Systems
The YZ48G16V-F9HPI-M is designed for oil & gas monitoring systems that operate in harsh environments with extreme temperatures and vibrations. Its wide-temperature range ensures reliable data logging and processing in downhole or surface equipment. The 8Gb density allows storage of large sensor datasets, and the high data rate supports real-time analysis. The FBGA96 package provides a robust connection, and the industrial-grade construction withstands mechanical stress. In such applications, the memory must maintain data integrity over long periods; the device's design ensures low error rates. Proper conformal coating may be required for protection against moisture and contaminants.
Empfohlen
Embedded Systems
The YZ48G16V-F9HPI-M is an excellent choice for embedded systems requiring high-capacity, high-speed memory in a compact form factor. Its 8Gb density and x16 organization provide ample memory for complex applications like real-time control and multimedia processing. The wide-temperature range makes it suitable for embedded systems in automotive, aerospace, and industrial settings. The FBGA96 package is ideal for space-constrained PCBs. The device's compatibility with standard DDR4 controllers simplifies design. For embedded systems, power efficiency is crucial; the 1.2V operation reduces power consumption. Designers should ensure proper power sequencing and decoupling to maintain stability.
Empfohlen
Networking Equipment
In networking equipment such as routers and switches, the YZ48G16V-F9HPI-M provides high-bandwidth memory for packet buffering and forwarding tables. Its 3200 MT/s data rate ensures low-latency processing, while the 8Gb density supports large routing tables. The wide-temperature range is beneficial for equipment deployed in uncontrolled environments. The FBGA96 package allows high-density board designs. The device's compatibility with standard DDR4 interfaces ensures seamless integration with network processors. For networking applications, reliability is critical; the industrial-grade design ensures long-term operation. Proper thermal management is essential to prevent overheating in high-throughput scenarios.
Empfohlen
Test & Measurement Instruments
The YZ48G16V-F9HPI-M is suitable for test and measurement instruments that require high-speed data acquisition and processing. Its 8Gb density allows storage of large waveforms, and the 3200 MT/s data rate enables fast data transfer. The wide-temperature range ensures accuracy in varying environmental conditions. The FBGA96 package is compact, fitting into portable instruments. The device's compatibility with standard DDR4 controllers simplifies design. For test equipment, signal integrity is crucial; proper PCB layout and decoupling are essential. The industrial-grade reliability ensures consistent performance in demanding measurement applications.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für YZ48G16V-F9HPI-M – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | K4A8G165WC-BCWE | MT40A512M16JY-07EAIT:B | K4A8G165WB-BCTD | K4A8G165WB-BIWE | MT40A512M16TB-062E:R | H5AN8G6NDJR-XNC |
|---|---|---|---|---|---|---|---|
| Package | FBGA96 | FBGA96 | FBGA96 | FBGA96 | FBGA96 | FBGA96 | FBGA96 |
| Brand | Loongtion | Samsung | Micron | Samsung | Samsung | Micron | SK Hynix |
| Density | 8 Gb | 8 Gb | 8 Gb | 8 Gb | 8 Gb | 8 Gb | 8 Gb |
| Organization | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 | 512M x 16 |
| Data Rate | 3200 MT/s | 3200 MT/s | 3200 MT/s | 3200 MT/s | 3200 MT/s | 3200 MT/s | 3200 MT/s |
| Operating Temperature Range | -40°C to +85°C | 0°C to +95°C | -40°C to +95°C | 0°C to +95°C | -40°C to +95°C | 0°C to +95°C | 0°C to +95°C |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Industrial Grade | Yes | No | Yes | No | Yes | No | No |
Wichtigste Unterscheidungsmerkmale
- Wide-temperature range (-40°C to +85°C) (vs. Samsung K4A8G165WC-BCWE)
- Pin-to-pin compatible with Samsung and Micron (vs. Samsung K4A8G165WC-BCWE)
- Industrial-grade qualification (vs. SK Hynix H5AN8G6NDJR-XNC)
Designhinweise
Ensure proper decoupling capacitors (0.1uF and 1uF) are placed close to each VDD and VDDQ pin to minimize power supply noise. Use a solid ground plane and route DDR4 signals with controlled impedance (typically 40-50 ohms single-ended, 80-100 ohms differential) to maintain signal integrity at 3200 MT/s.
The YZ48G16V-F9HPI-M operates over -40°C to +85°C. In high-ambient-temperature environments, ensure adequate airflow or heatsinking to keep the device within its specified range. The FBGA96 package has a thermal resistance that should be considered in thermal design. For outdoor applications, consider conformal coating to protect against moisture.
Do not mix x8 (FBGA78) and x16 (FBGA96) parts on the same board as they have different ball maps. Verify the memory controller supports x16 organization and the FBGA96 package. Also, ensure the power supply sequence meets DDR4 JEDEC specifications to avoid latch-up or damage.
Compliance-Informationen
RoHS compliant per Loongtion product page. Not AEC-Q100 qualified. Other compliance data not specified.
