YZ38F16SBB-9MFD-M - 4Gb DDR3L Industrial DRAM | Loongtion
Teilenummer: YZ38F16SBB-9MFD-M ✓ Aktiv| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $12.5 | $12,50 |
| 10 | $11.2 | $112,00 |
| 100 | $9.8 | $980,00 |
| 500 | $8.5 | $4.250,00 |
| 1.000 | $7.2 | $7.200,00 |
YZ38F16SBB-9MFD-M Übersicht
DDR3 SDRAM (Double Data Rate 3 Synchronous Dynamic Random-Access Memory) is a type of volatile memory that transfers data on both edges of the clock, achieving high bandwidth. It is the third generation of DDR memory, succeeding DDR2, and is widely used in computing, networking, and embedded systems. DDR3L is a low-voltage variant that operates at 1.35V, reducing power consumption by about 20% compared to standard 1.5V DDR3, making it ideal for power-sensitive applications.
Key features include a 4Gb density (256M x 16), 96-ball FBGA package, industrial temperature range of -40°C to +85°C, and support for both 1.35V and 1.5V operation. The device meets JEDEC standards for DDR3 and DDR3L, including ZQ calibration with an external 240Ω ±1% resistor. It is designed for reliable operation in harsh environments, with wide-temperature screening and testing.
The YZ38F16SBB-9MFD-M is manufactured using a domestic (Chinese) supply chain, offering a secure and controllable source for critical applications. It is compatible with domestic platforms such as Fudan Micro, Phytium, Loongson, and Rockchip, and is available with development boards for evaluation. The device is also certified with ZZKK (domestic autonomous controllable) and WBK (pseudo-empty package) certifications, ensuring authenticity and quality.
Typical applications include industrial automation, embedded computing, networking equipment, and military/aerospace systems where long-term availability and wide-temperature operation are critical. The pin-to-pin compatibility with industry-standard DDR3 parts simplifies BOM management and reduces supply chain risk.
When designing with this device, ensure proper decoupling and signal integrity practices are followed, including placing 0.1µF and 10µF capacitors near the power pins and maintaining controlled impedance for the data and address lines. The device supports standard DDR3 termination and calibration schemes, so follow the JEDEC guidelines for layout and routing.
Drop-in-Alternativen für YZ38F16SBB-9MFD-M – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit YZ38F16SBB-9MFD-M (gleiche Bauform und Footprint) – abweichend in Data Rate, Package, Supply Voltage, Interface, Operating Temperature.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MT41K256M16HA-125IT:E
✅ Drop-In✓ Auf Lager
$4.5 / Stück
Datenblatt ansehen →MT41K256M16HA-125
✅ Drop-In✓ Auf Lager
$6.3636 / Stück
Datenblatt ansehen →K4B4G1646E-BYMA
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$14.3182 / Stück
Datenblatt ansehen →H5TC4G63AFR-PBA
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$3.9773 / Stück
Datenblatt ansehen →IS43TR16256A-125KBLA2
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
W634GU6RB-11
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$13.5227 / Stück
Datenblatt ansehen →YZ38F16SBB-9MFD-M Technische Daten
| Speichertyp | DDR3L SDRAM |
| Density | 4Gb |
| Speicherorganisation | 256M x 16 |
| Gehäuse | 96-ball FBGA |
| Versorgungsspannung | 1.35V / 1.5V |
| Speed Grade | -9 (DDR3-1866) |
| Betriebstemperatur | -40°C to +85°C |
| Schnittstelle | JEDEC DDR3 |
| ZQ Calibration | External 240Ω ±1% resistor |
| RoHS | Compliant |
| Lead-Free | Yes |
| Montageart | Surface Mount |
| Pin-Anzahl | 96 |
| Datenrate | 1866 Mbps |
YZ38F16SBB-9MFD-M Pin-Konfiguration
| Pin A1 | VDD — Power supply (1.35V/1.5V) |
| Pin A2 | DQ0 — Data input/output 0 |
| Pin A3 | DQ1 — Data input/output 1 |
| Pin A4 | VSS — Ground |
| Pin A5 | DQ2 — Data input/output 2 |
| Pin A6 | DQ3 — Data input/output 3 |
| Pin A7 | VDD — Power supply |
| Pin A8 | DQ4 — Data input/output 4 |
| Pin A9 | DQ5 — Data input/output 5 |
| Pin A10 | VSS — Ground |
| Pin A11 | DQ6 — Data input/output 6 |
| Pin A12 | DQ7 — Data input/output 7 |
Typische Anwendungen
YZ38F16SBB-9MFD-M ist geeignet für 6 Anwendungs: Industrial Automation, Embedded Computing, Networking Equipment, Military & Aerospace, Automotive Infotainment, Medical Devices.
Industrial Automation
The YZ38F16SBB-9MFD-M is ideal for industrial automation systems that require reliable memory operation in harsh environments. Its wide temperature range (-40°C to +85°C) ensures stable performance in factory floors, while the 4Gb density supports complex control algorithms and data logging. The pin-to-pin compatibility with standard DDR3 parts simplifies BOM management and allows for easy upgrades in existing designs.
Empfohlen
Embedded Computing
In embedded computing, the YZ38F16SBB-9MFD-M provides high-bandwidth memory for processors and FPGAs. Its 1866 Mbps data rate supports fast data processing, while the low-voltage operation (1.35V) reduces power consumption in portable and fanless systems. The FBGA96 package is compact, saving board space, and the industrial temperature grade ensures reliability in rugged embedded applications.
Empfohlen
Networking Equipment
Networking equipment such as routers and switches require high-speed memory for packet buffering and routing tables. The YZ38F16SBB-9MFD-M offers the necessary bandwidth and density, with a wide temperature range for outdoor or industrial networking gear. Its compatibility with standard DDR3 parts allows for easy integration into existing designs, and the domestic supply chain ensures long-term availability.
Empfohlen
Military & Aerospace
The YZ38F16SBB-9MFD-M is suitable for military and aerospace applications that demand high reliability and wide temperature operation. Its industrial temperature range and robust design make it ideal for avionics, radar, and communication systems. The domestic sourcing provides supply chain security, and the pin-to-pin compatibility with standard parts allows for easy replacement in legacy systems.
Empfohlen
Automotive Infotainment
In automotive infotainment systems, the YZ38F16SBB-9MFD-M provides reliable memory for navigation, multimedia, and connectivity features. Its wide temperature range (-40°C to +85°C) covers automotive cabin environments, and the low-voltage operation reduces power consumption. The FBGA96 package is suitable for space-constrained head units, and the compatibility with standard DDR3 parts simplifies sourcing.
Empfohlen
Medical Devices
Medical devices such as patient monitors and diagnostic equipment require reliable memory for data acquisition and processing. The YZ38F16SBB-9MFD-M offers high density and speed, with a wide temperature range for various clinical environments. Its low power consumption is beneficial for battery-powered devices, and the long-term availability ensures product longevity.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für YZ38F16SBB-9MFD-M – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MT41K256M16HA-125IT | K4B4G1646E-BYMA | H5TC4G63AFR-PBA |
|---|---|---|---|---|
| Package | FBGA96 | FBGA96 | FBGA96 | FBGA96 |
| Brand | Loongtion | Micron | Samsung | SK hynix |
| Density | 4Gb | 4Gb | 4Gb | 4Gb |
| Organization | 256M x 16 | 256M x 16 | 256M x 16 | 256M x 16 |
| Voltage | 1.35V/1.5V | 1.35V/1.5V | 1.35V/1.5V | 1.35V/1.5V |
| RoHS | Compliant | Compliant | Compliant | Compliant |
Wichtigste Unterscheidungsmerkmale
- Wide temperature range (-40°C to +85°C) (vs. MT41K256M16HA-125IT)
- Domestic supply chain (China) (vs. MT41K256M16HA-125IT)
- Pin-to-pin compatibility with major brands (vs. K4B4G1646E-BYMA)
Designhinweise
Ensure proper decoupling: place 0.1µF and 10µF capacitors close to the VDD and VDDQ pins. Use a solid ground plane and maintain controlled impedance for data and address lines (typically 50Ω single-ended, 100Ω differential). Follow JEDEC layout guidelines for DDR3 to minimize signal integrity issues.
The device is rated for -40°C to +85°C. Ensure adequate airflow or heatsinking if the device is placed near other heat sources. The FBGA96 package has a thermal resistance that should be considered; refer to the datasheet for theta_JA values. For high-temperature environments, verify junction temperature stays within limits.
Verify the speed grade and voltage compatibility with your controller. The -9 grade supports DDR3-1866, but if your system is designed for DDR3-1600, it will still work. Ensure the ZQ calibration resistor (240Ω ±1%) is connected to the ZQ pin. Do not mix 1.5V and 1.35V operation without proper configuration.
Compliance-Informationen
RoHS compliant per JLCPCB listing. Other compliance data not explicitly stated in provided data.
