10M25SAE144C8G vs 10M08SAE144C8G Comparación
Comparación detallada lado a lado de 10M25SAE144C8G por Intel y 10M08SAE144C8G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
10M08SAE144C8G - MAX 10 FPGA 8K LE, 144-EQFP | Intel | Industrial Control
10M08SAE144C8G ✓ ActivoComparación de especificaciones
| Parámetro | 10M25SAE144C8G | 10M08SAE144C8G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $32,40 | $16,25 |
| Family | MAX 10 | MAX 10 |
| Logic Elements | 25,000 (25K LE) | — |
| Maximum User I/Os | 101 | — |
| Embedded Memory | 1,638 Kbit | — |
| Embedded 18x18 Multipliers | 54 | 24 |
| PLLs | 4 (fractional) | 2 analog front-end PLLs |
| User Flash | 1.638 Mbit on-chip | — |
| ADC | 12-bit, 1 Msps, 17 analog inputs | — |
| Encapsulado | 144-LQFP Exposed Pad (EQFP-144), 22 x 22 mm, 0.5 mm pitch | 144-LQFP Exposed Pad (EQFP) |
| Tipo de montaje | Surface Mount | Surface Mount (LQFP) |
| Configuration | Non-volatile on-chip flash, dual-boot capable | — |
| Tensión de alimentación | Single or dual supply (core and I/O) | — |
| Temperatura de funcionamiento | -40C to +85C (industrial) | — |
| Speed Grade | C8 | — |
| Estado RoHS | Compliant | Compliant |
| Programming Interface | JTAG | — |
| Logic Elements (LE) | — | 8000 |
| Adaptive Logic Modules (ALM) | — | Not applicable (MAX 10 uses LE architecture, not ALM) |
| M9K Embedded Memory Blocks | — | 378 Kb total |
| MLAB Memory | — | [DATA_NEEDED: MLAB capacity] |
| User I/O Pins | — | 101 |
| Process Technology | — | 55 nm flash-based CMOS |
| Configuration Memory | — | Internal flash, dual-image |
| Integrated ADC | — | 12-bit, 1 MSa/s, up to 17 analog inputs |
| Maximum User I/O Voltage | — | 3.3 V (LVCMOS/LVTTL); LVDS supported |
| External Memory Interface | — | DDR3, DDR2, LPDDR2 |
| Temperatura de unión de funcionamiento | — | 0C to 85C (commercial) |
| Nivel MSL | — | [DATA_NEEDED: MSL rating] |
| Lead-Free | — | Yes |
| Sin halógenos | — | [DATA_NEEDED: halogen status] |