A3PE3000L-FGG324 vs A3PE3000L-FGG324I Comparación
Comparación detallada lado a lado de A3PE3000L-FGG324 por Microchip Technology y A3PE3000L-FGG324I por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
A3PE3000L-FGG324 - ProASIC3L FPGA 3M Gates 221 I/O | Microchip
A3PE3000L-FGG324 ✓ ActivoMicrochip Technology
A3PE3000L-FGG324I - ProASIC3L Flash FPGA 3M Gates | Microchip
A3PE3000L-FGG324I ✓ ActivoComparación de especificaciones
| Parámetro | A3PE3000L-FGG324 | A3PE3000L-FGG324I |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $86,15 | $62,65 |
| Manufacturer Part Number | A3PE3000L-FGG324 | — |
| Family | ProASIC3L (Flash-based FPGA) | ProASIC3L (Flash FPGA) |
| System Gates | 3,000,000 | 3,000,000 |
| Logic Cells (CLBs) | 75264 | — |
| User I/O | 221 | 221 |
| Configuration Memory | On-chip Flash (single-chip, nonvolatile) | — |
| Core Voltage Range | 1.2 V to 1.5 V | — |
| Tensión de alimentación de funcionamiento | 1.5 V | — |
| Maximum Operating Frequency | 250 MHz | — |
| Special Features | Flash*Freeze Technology, Schmitt Trigger inputs, weak pull-up/down | — |
| Boundary Scan | IEEE 1149.1 (JTAG) | — |
| Encapsulado | 324-BGA / FBGA (FGG324) | 324-BGA FBGA (19x19 mm) |
| Estilo de montaje | SMD/SMT | — |
| Temperatura de funcionamiento | 0 C to +70 C (commercial) | -40C to +100C (industrial) |
| Packaging | Tray | Tray |
| Embedded RAM | [DATA_NEEDED: embedded RAM capacity] | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | RoHS Compliant |
| Total RAM Bits | — | 516096 |
| Core Voltage | — | 1.2 V to 1.5 V |
| Process Technology | — | 130 nm CMOS |
| Tipo de montaje | — | Surface Mount (SMD) |
| Technology Features | — | Nonvolatile Flash, Instant On, Flash*Freeze |
| Configuration | — | Single-chip, no external boot PROM |
| Lead Free Status | — | Lead Free |
| Number of Package Balls | — | 324 |