A3PE3000L-FGG324 vs A3PE3000L-FGG324I 对比

详细并排对比 A3PE3000L-FGG324 出自 Microchip Technology 和 A3PE3000L-FGG324I 出自 Microchip Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Microchip Technology
A3PE3000L-FGG324 A3PE3000L-FGG324 - ProASIC3L FPGA 3M Gates 221 I/O | Microchip

A3PE3000L-FGG324 - ProASIC3L FPGA 3M Gates 221 I/O | Microchip

A3PE3000L-FGG324 ✓ 量产中
Microchip Technology
A3PE3000L-FGG324I A3PE3000L-FGG324I - ProASIC3L Flash FPGA 3M Gates | Microchip

A3PE3000L-FGG324I - ProASIC3L Flash FPGA 3M Gates | Microchip

A3PE3000L-FGG324I ✓ 量产中

规格对比

参数 A3PE3000L-FGG324 A3PE3000L-FGG324I
品牌 Microchip Technology Microchip Technology
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $86.15 $62.65
Manufacturer Part Number A3PE3000L-FGG324 —
Family ProASIC3L (Flash-based FPGA) ProASIC3L (Flash FPGA)
System Gates 3,000,000 3,000,000
Logic Cells (CLBs) 75264 —
User I/O 221 221
Configuration Memory On-chip Flash (single-chip, nonvolatile) —
Core Voltage Range 1.2 V to 1.5 V —
工作电源电压 1.5 V —
Maximum Operating Frequency 250 MHz —
Special Features Flash*Freeze Technology, Schmitt Trigger inputs, weak pull-up/down —
Boundary Scan IEEE 1149.1 (JTAG) —
封装 324-BGA / FBGA (FGG324) 324-BGA FBGA (19x19 mm)
安装方式 SMD/SMT —
工作温度 0 C to +70 C (commercial) -40C to +100C (industrial)
Packaging Tray Tray
Embedded RAM [DATA_NEEDED: embedded RAM capacity] —
RoHS 状态 [DATA_NEEDED: RoHS status] RoHS Compliant
Total RAM Bits — 516096
Core Voltage — 1.2 V to 1.5 V
Process Technology — 130 nm CMOS
安装类型 — Surface Mount (SMD)
Technology Features — Nonvolatile Flash, Instant On, Flash*Freeze
Configuration — Single-chip, no external boot PROM
Lead Free Status — Lead Free
Number of Package Balls — 324

数据手册与资源

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