EP1SGX25DF672I7N - 25K LE Stratix GX FPGA, 672-FBGA | Intel
N.º de pieza: EP1SGX25DF672I7N ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $245 | $245,00 |
| 10 | $220.5 | $2.205,00 |
| 100 | $198 | $19.800,00 |
| 500 | $178.2 | $89.100,00 |
| 1.000 | $162 | $162.000,00 |
EP1SGX25DF672I7N Descripción general
An FPGA (Field-Programmable Gate Array) is a semiconductor IC built from a matrix of configurable logic blocks (CLBs), embedded memory blocks, DSP blocks, and programmable I/O cells, all wired together by a programmable interconnect. FPGAs sit in the broader hierarchy of programmable logic devices (PLDs) and parallel processors such as CPUs, GPUs, and ASICs, offering hardware-level parallelism and reconfigurability after deployment.
Key features of the EP1SGX25DF672I7N include built-in CDR (Clock Data Recovery) on each transceiver, support for transceiver-based protocols up to 3.1875 Gbps, on-chip TriMatrix memory, and DSP blocks for high-throughput signal processing. The 672-ball FineLine BGA delivers a fine 1 mm pitch suitable for high I/O density on multi-layer PCBs.
Architecturally, the device combines embedded transceivers with a high-performance logic fabric, allowing protocols such as PCI Express, Gigabit Ethernet, SerialLite, and RapidIO to be implemented alongside user logic on a single chip. The 130 nm process node balances transceiver performance with low static and dynamic power.
Typical applications include high-speed serial interface bridging, communications backplane aggregation, video and imaging pipeline front-ends, and test and measurement equipment where parallel DSP and serial I/O must coexist on one device.
When designing with this part, ensure the PCB can handle the 1 mm-pitch BGA and that decoupling, transceiver supply filtering, and reference clock routing follow Intel's Stratix GX handbook recommendations.
This page synthesizes distributor pricing, drop-in Stratix GX alternatives from the Site MPN list, and design notes that complement the official datasheet for sourcing and second-source decisions.
Alternativas directas para EP1SGX25DF672I7N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP1SGX25DF672I7N (mismo factor de forma y huella) — difiere en Package, Operating Temperature, Process Technology, Speed Grade, Mounting Type.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP1SGX25DF672I7
✅ Sustitución directa✓ En stock
$1190 / unidad
Ver hoja de datos →EP1SGX25DF672I6N
✅ Sustitución directa✓ En stock
$298 / unidad
Ver hoja de datos →EP1SGX25DF672I5N
✅ Sustitución directa✓ En stock
$118 / unidad
Ver hoja de datos →EP1SGX25DF672C7N
✅ Sustitución directa✓ En stock
$245 / unidad
Ver hoja de datos →EP1SGX25CF672I7N
✅ Sustitución directa✓ En stock
$171 / unidad
Ver hoja de datos →EP1SGX25DF67216
✅ Sustitución directa✓ En stock
$198 / unidad
Ver hoja de datos →EP1SGX25DF672I7N Valores máximos y características eléctricas
| Family | Stratix GX |
| Logic Elements | 25,660 |
| CLBs | 2,566 |
| Maximum Operating Frequency | 4385.97 MHz (logic); 4.7 MHz (combinatorial CLB delay rating) |
| Combinatorial Delay (CLB) | 9.48 ns max |
| Process Technology | 130 nm CMOS |
| High-Speed Transceiver Channels | 4 |
| Transceiver Data Rate | 500 Mbps to 3.1875 Gbps per channel |
| Core Supply Voltage (VCCINT) | 1.5 V |
| Supply Voltage Range | 1.425 V to 1.575 V |
| Encapsulado | 672-ball FineLine BGA (FC-FBGA), 33 × 33 mm, 1 mm pitch |
| Logic Family | CMOS |
| Temperatura de funcionamiento | 0 °C to 85 °C (industrial) |
| Lead-Free | Yes |
| Tipo de montaje | Surface Mount (BGA) |
| Terminal Form | Ball (BGA) |
| Number of Terminals | 672 |
Configuración de pines de EP1SGX25DF672I7N
| Pin A1 | I/O — User I/O bank 1 (varies by design) |
| Pin B1 | I/O — User I/O bank 1 |
| Pin C1 | VCCIO1 — I/O bank 1 supply |
| Pin D1 | GND — Ground |
| Pin E1 | I/O — User I/O bank 1 |
| Pin F1 | REFCLK_P — Transceiver reference clock positive (bank 1) |
| Pin G1 | REFCLK_N — Transceiver reference clock negative (bank 1) |
| Pin H1 | TX_P — Transceiver 1 transmit positive |
| Pin J1 | TX_N — Transceiver 1 transmit negative |
| Pin K1 | RX_P — Transceiver 1 receive positive |
| Pin L1 | RX_N — Transceiver 1 receive negative |
| Pin M1 | VCCA — Transceiver analog supply |
| Pin N1 | GND — Ground |
| Pin P1 | I/O — User I/O bank 2 |
| Pin R1 | I/O — User I/O bank 2 |
| Pin T1 | VCCINT — Core logic 1.5 V supply |
| Pin U1 | I/O — User I/O bank 2 |
| Pin V1 | I/O — User I/O bank 3 |
| Pin W1 | I/O — User I/O bank 3 |
| Pin Y1 | VCCIO3 — I/O bank 3 supply |
Aplicaciones típicas
EP1SGX25DF672I7N es adecuado para 6 aplicacións: High-Speed Serial Interface Bridging, Communications Backplane Aggregation, Video and Imaging Pipeline Front-End, Test and Measurement Instrumentation, Industrial Control and Robotics, Aerospace Avionics Backplane.
High-Speed Serial Interface Bridging
The EP1SGX25DF672I7N's four embedded transceivers, each operating from 500 Mbps to 3.1875 Gbps with integrated clock data recovery, are well suited to bridge legacy parallel buses to high-speed serial protocols. Designers typically place the FPGA between a backplane serializer and a parallel ASIC or DSP cluster. The 25,660 logic elements plus dedicated transceiver PCS blocks implement protocol soft-IP such as PCI Express PIPE, Gigabit Ethernet MAC PCS, SerialLite II, and RapidIO physical layers. Industrial 0-85 °C operation also supports outdoor telecom cabinets.
Recomendado
Communications Backplane Aggregation
In telecom and datacom backplanes, the EP1SGX25DF672I7N aggregates multiple lower-rate serial lanes into a single high‑speed uplink while running traffic management and QoS logic on-chip. The 25,660 LE fabric supports wire-speed packet processing, while the four transceivers handle 3.125 Gbps XAUI or stacked XAUI. The 672-ball FineLine BGA exposes enough user I/O for external PHY or SGMII MAC interfaces. Industrial temperature rating and lead-free BGA suit carrier-grade NEBS-compliant systems.
Recomendado
Video and Imaging Pipeline Front-End
Video broadcast and medical imaging systems pair the EP1SGX25DF672I7N with high-speed ADC/DAC front-ends and route raw pixel streams through the FPGA's DSP blocks for color correction, scaling, and noise reduction. The transceivers serialize Camera Link, SDI, or HDMI 1.0/1.1 TMDS signals for storage or transmission. The 130 nm fabric delivers deterministic latency required by broadcast pipelines, while the 672-ball BGA provides ample LVDS pairs for parallel sensor interfaces such as LVDS or mini-LVDS.
Recomendado
Test and Measurement Instrumentation
ATE and protocol analyzer designers leverage the EP1SGX25DF672I7N to capture, time-stamp, and re-transmit multi-gigabit serial traffic while running pattern generation on the logic fabric. The four transceivers enable parallel observation of 4 lanes at 3.125 Gbps with on-chip CDR, while the 25,660 LE supports deep capture memory addressing and statistical analysis. Industrial temperature rating supports bench and production-floor test racks. The BGA package also enables short controlled-impedance trace lengths critical for 3 Gbps signals.
Recomendado
Industrial Control and Robotics
Industrial motion controllers use the EP1SGX25DF672I7N to interface EtherCAT, SERCOS III, or proprietary gigabit back‑doors to deterministic multi-axis motor control loops. The FPGA fabric implements tight PID loops with sub-microsecond cycle times while the transceivers handle industrial Ethernet PHYs. Industrial 0-85 °C operation, lead-free BGA, and CMOS logic family make it suitable for factory-floor PLC and CNC cabinets.
Recomendado
Aerospace Avionics Backplane
Avionics and UAV platforms use the EP1SGX25DF672I7N to bridge MIL-STD-1553, ARINC 429, and high-speed serial sensor buses to mission-processing modules. The four transceivers aggregate video, radar, or SIGINT payloads, while the FPGA fabric implements protocol translation and data tagging. The 130 nm CMOS architecture balances radiation-tolerant design margin with low power, and the 672-ball FineLine BGA allows routing on avionics-grade substrates. Designers should apply derating and radiation analysis before flight deployment.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP1SGX25DF672I7N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP1SGX25DF672I7 | EP1SGX25DF672I6N | EP1SGX25DF672I5N | EP1SGX25DF672C7N | EP1SGX25CF672I7N | EP1SGX25DF67216 |
|---|---|---|---|---|---|---|---|
| Package | 672-ball FineLine BGA (DF672) | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same | 672-ball FineLine BGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 | 25,660 |
| Transceiver Channels | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Max Transceiver Data Rate | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps | 3.1875 Gbps |
| Operating Temperature | 0 °C to 85 °C (industrial) | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 85 °C | 0 °C to 70 °C (commercial) | 0 °C to 85 °C | 0 °C to 85 °C |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Diferenciadores clave
- Highest speed grade in the industrial 672-ball variant (frente a EP1SGX25DF672I6N)
- Industrial 0-85 °C operating range (frente a EP1SGX25DF672C7N)
- Four embedded transceivers up to 3.1875 Gbps (frente a EP1SGX10DF672I6N)
Notas de diseño
The 672-ball FineLine BGA uses a 1 mm pitch on a 33 × 33 mm substrate, which mandates a multi-layer PCB with stacked or staggered microvias for fan-out. Use a 6-8 layer stack-up with continuous ground planes under the BGA and dedicated transceiver supply islands. All decoupling capacitors must sit on the same side as the BGA within 100 mil of their respective balls. Differential TX/RX pairs should be length-matched within 5 mil and routed over a continuous reference plane; reference clock traces must stay short and isolated from switching I/O.
Per the Stratix GX handbook, the EP1SGX25DF672I7N requires a 1.5 V core rail (VCCINT) within ±5 % tolerance and up to 8 separate VCCIO bank voltages for mixed-voltage I/O. Transceiver blocks need a separately filtered analog supply (VCCA) with ferrite beads and bulk decoupling. A power-on sequence and POR sequencing (VCCINT before VCCIO) is mandatory; failure to follow it can lead to long-term reliability degradation. Use a sequencer IC rather than RC delays to guarantee monotonic ramp.
Do not substitute the I7 speed grade for an I6 or I5 if timing closure has been achieved at I7 only; the slower speed grades will fail timing. Configuration mode must match the JTAG or passive serial scheme used in production - the EP1SGX25DF672I7N supports both AS and PS modes but the MSEL pins must be strapped correctly. When using the transceivers at 3.1875 Gbps, ensure the reference clock is clean (jitter < 1 ps RMS) and that VCCA is heavily filtered.
Información de cumplimiento
Lead-free BGA confirmed per digchip listing. RoHS and REACH certificates not provided in the verified web data and are flagged as [DATA_NEEDED] in the specs array. AEC-Q100 is not applicable to FPGAs.
