EP2A40F33C-9 vs EP2A40F33I-8 Comparación
Comparación detallada lado a lado de EP2A40F33C-9 por Intel y EP2A40F33I-8 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2A40F33C-9 | EP2A40F33I-8 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Obsolete |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $78,00 | $95,00 |
| Family | APEX II | APEX II |
| Maximum System Gates | 1,600,000 | — |
| Embedded RAM | 65 Kbytes (approximately 540 Kbits depending on configuration) | — |
| Encapsulado | 672-ball FineLine BGA (F33), 1.27 mm pitch | 672-ball FineLine BGA (F33) |
| Speed Grade | -9 | -8 |
| Temperatura de funcionamiento | 0C to +85C (commercial) | — |
| Process Technology | 0.15 micrometer CMOS | — |
| PLLs | 4 | 4 |
| LVDS Channels | 16 high-speed LVDS channels | — |
| Logic Elements | [DATA_NEEDED: exact LE count] | — |
| Maximum User I/O | [DATA_NEEDED: max user I/O count] | 672 |
| Multi-Core Architecture | MegaLAB structure with embedded memory and CAM | — |
| Configuration Method | JTAG, serial PROM, parallel flash | SRAM (volatile) - external PROM required |
| Nivel MSL | 3 | — |
| Peak Reflow Temperature | 220 C | 220 °C |
| Estado RoHS | [DATA_NEEDED: not stated in provided data] | [DATA_NEEDED: RoHS status] |
| Core Voltage | [DATA_NEEDED: nominal core voltage] | — |
| Tipo de montaje | Surface Mount (BGA) | — |
| Manufacturer | — | Intel (formerly Altera) |
| Device Type | — | FPGA (Field-Programmable Gate Array) |
| Typical Gates | — | 1,500,000 |
| Logic Elements (LEs) | — | 40,960 |
| Embedded System Memory | — | 425,984 bits |
| Temperature Grade | — | Industrial (-40 °C to +85 °C) |
| High-Speed Clock Pins | — | 16 |
| Moisture Sensitivity Level | — | MSL 3 |