EP2A40F33C-9 vs EP2A40F33I-8 Comparaison
Comparaison détaillée côte à côte de EP2A40F33C-9 par Intel et EP2A40F33I-8 par Intel. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
Comparaison des spécifications
| Paramètre | EP2A40F33C-9 | EP2A40F33I-8 |
|---|---|---|
| Marque | Intel | Intel |
| Catégorie | FPGA & CPLD | FPGA & CPLD |
| Statut du cycle de vie | NRND | Obsolete |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $78,00 | $95,00 |
| Family | APEX II | APEX II |
| Maximum System Gates | 1,600,000 | — |
| Embedded RAM | 65 Kbytes (approximately 540 Kbits depending on configuration) | — |
| Boîtier | 672-ball FineLine BGA (F33), 1.27 mm pitch | 672-ball FineLine BGA (F33) |
| Speed Grade | -9 | -8 |
| Température de fonctionnement | 0C to +85C (commercial) | — |
| Process Technology | 0.15 micrometer CMOS | — |
| PLLs | 4 | 4 |
| LVDS Channels | 16 high-speed LVDS channels | — |
| Logic Elements | [DATA_NEEDED: exact LE count] | — |
| Maximum User I/O | [DATA_NEEDED: max user I/O count] | 672 |
| Multi-Core Architecture | MegaLAB structure with embedded memory and CAM | — |
| Configuration Method | JTAG, serial PROM, parallel flash | SRAM (volatile) - external PROM required |
| Niveau MSL | 3 | — |
| Peak Reflow Temperature | 220 C | 220 °C |
| Statut RoHS | [DATA_NEEDED: not stated in provided data] | [DATA_NEEDED: RoHS status] |
| Core Voltage | [DATA_NEEDED: nominal core voltage] | — |
| Type de montage | Surface Mount (BGA) | — |
| Manufacturer | — | Intel (formerly Altera) |
| Device Type | — | FPGA (Field-Programmable Gate Array) |
| Typical Gates | — | 1,500,000 |
| Logic Elements (LEs) | — | 40,960 |
| Embedded System Memory | — | 425,984 bits |
| Temperature Grade | — | Industrial (-40 °C to +85 °C) |
| High-Speed Clock Pins | — | 16 |
| Moisture Sensitivity Level | — | MSL 3 |