EP2A40F33C-9 vs EP2A40F33I-8 Comparison

Detailed side-by-side comparison of EP2A40F33C-9 by Intel and EP2A40F33I-8 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.

Specification Comparison

Parameter EP2A40F33C-9 EP2A40F33I-8
Brand Intel Intel
Category FPGA & CPLD FPGA & CPLD
Lifecycle Status Nrnd Obsolete
Stock Status In Stock In Stock
Unit Price (USD) $78.00 $95.00
Family APEX II APEX II
Maximum System Gates 1,600,000 β€”
Embedded RAM 65 Kbytes (approximately 540 Kbits depending on configuration) β€”
Package 672-ball FineLine BGA (F33), 1.27 mm pitch 672-ball FineLine BGA (F33)
Speed Grade -9 -8
Operating Temperature 0C to +85C (commercial) β€”
Process Technology 0.15 micrometer CMOS β€”
PLLs 4 4
LVDS Channels 16 high-speed LVDS channels β€”
Logic Elements [DATA_NEEDED: exact LE count] β€”
Maximum User I/O [DATA_NEEDED: max user I/O count] 672
Multi-Core Architecture MegaLAB structure with embedded memory and CAM β€”
Configuration Method JTAG, serial PROM, parallel flash SRAM (volatile) - external PROM required
MSL Level 3 β€”
Peak Reflow Temperature 220 C 220 Β°C
RoHS Status [DATA_NEEDED: not stated in provided data] [DATA_NEEDED: RoHS status]
Core Voltage [DATA_NEEDED: nominal core voltage] β€”
Mounting Type Surface Mount (BGA) β€”
Manufacturer β€” Intel (formerly Altera)
Device Type β€” FPGA (Field-Programmable Gate Array)
Typical Gates β€” 1,500,000
Logic Elements (LEs) β€” 40,960
Embedded System Memory β€” 425,984 bits
Temperature Grade β€” Industrial (-40 Β°C to +85 Β°C)
High-Speed Clock Pins β€” 16
Moisture Sensitivity Level β€” MSL 3

Datasheets & Resources

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