EP2C8F256C6 vs EP2C8F256I8N Comparación
Comparación detallada lado a lado de EP2C8F256C6 por Intel y EP2C8F256I8N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP2C8F256C6 | EP2C8F256I8N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $8,10 | $21,95 |
| Series | Cyclone II | Cyclone II |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements | 8,256 | — |
| Total RAM Bits | 165,888 | 165,888 |
| Number of I/O | 182 | — |
| Number of LABs/CLBs | 516 | [DATA_NEEDED: LAB count] |
| Number of Logic Elements/Cells | 8256 | — |
| Embedded Multipliers | 36 (18x18) | — |
| PLLs | 4 | 2 |
| Encapsulado | 256-LBGA (FBGA) | — |
| Package Pin/Pin Count | 256 | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Temperatura de funcionamiento | 0C to +85C (commercial) | -40C to +85C (industrial) |
| Process Node | 90 nm | — |
| Tensión de alimentación | 1.15 V to 3.3 V (bank-dependent) | — |
| Configuration Mode | AS / PS / JTAG | — |
| Estado RoHS | [DATA_NEEDED: rohs status] | Compliant (Pb-free, lead-free reflow compatible) |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| Logic Elements (LEs) | — | 8,256 |
| Embedded Memory Bits | — | 165,888 bits |
| Logic Blocks / Logic Cells | — | 540 (Logic Cells) |
| User I/O Pins | — | 182 |
| Embedded 18x18 Multipliers | — | Up to 36 |
| Global Clock Networks | — | 16 |
| Core Supply Voltage | — | 1.2 V |
| I/O Supply Voltage | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-dependent) |
| Process Technology | — | 90 nm CMOS (SRAM-based) |
| Package Type | — | 256-LBGA (FineLine BGA), 17x17 mm, 1.0 mm pitch |
| Configuration Method | — | SRAM, loaded from external EPCS flash at power-up |