EP2SGX60DF780I4 vs EP2SGX60DF780C3N Comparación
Comparación detallada lado a lado de EP2SGX60DF780I4 por Intel y EP2SGX60DF780C3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP2SGX60DF780I4 - 60K LEs Stratix II GX FPGA, 780-FBGA | Intel
EP2SGX60DF780I4 ⚠ Última compraComparación de especificaciones
| Parámetro | EP2SGX60DF780I4 | EP2SGX60DF780C3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Fin de vida |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $1.550,00 | $188,00 |
| Family | Stratix II GX | Stratix II GX |
| Device Logic Elements | 60,440 | — |
| Logic Cells / CLBs | 60,440 | — |
| Total RAM Bits | 2,544,192 bits | — |
| User I/O Count | 364 | — |
| Transceivers | Embedded multi-gigabit transceivers (MGTs) | — |
| Transceiver Data Rate | [DATA_NEEDED: transceiver data rate in Gbps] | — |
| Internal Maximum Frequency | 732.1 MHz | — |
| Propagation Delay | [DATA_NEEDED: propagation delay] | [DATA_NEEDED: propagation delay ns] |
| Process Technology | 90 nm CMOS | 90 nm |
| Core Voltage | 1.2 V | 1.2 V |
| Encapsulado | 780-ball FC-FBGA (29 x 29 mm, 1 mm pitch) | — |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | [DATA_NEEDED: operating temperature range C] |
| Speed Grade | I4 (Industrial, speed grade 4) | — |
| Nivel MSL | [DATA_NEEDED: MSL level] | — |
| Estado RoHS | Compliant | Compliant (per distributor listing) |
| Device Type | — | FPGA |
| Logic Elements | — | 60,440 |
| LABs/CLBs | — | 3,022 |
| Total Memory Bits | — | 2,544,192 |
| User I/Os | — | 364 |
| Package Type | — | 780-pin FC-FBGA (DF780) |
| Package Dimensions | — | 23 x 23 mm |
| Pitch | — | 1 mm |
| Internal Frequency | — | 717 MHz |