EP3C25F324C8N vs EP3C25F324I7 Comparación
Comparación detallada lado a lado de EP3C25F324C8N por Intel y EP3C25F324I7 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C25F324C8N | EP3C25F324I7 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $27,10 | $64,80 |
| Family | Cyclone III | — |
| Series | Cyclone III | Cyclone III |
| Logic Elements (LEs) | 24,624 | 24,624 |
| Total Memory Bits | 608,256 bits | — |
| Embedded Memory (Kbits) | 608 Kbits | — |
| Number of I/O | 215 | — |
| Encapsulado | 324-BGA (FineLine) | 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch |
| Supply Voltage - Core | 1.2 V | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | 0 C to +85 C (commercial, suffix C) | — |
| Speed Grade | 8 | — |
| Total RAM Bits | 608,256 | — |
| Process Node | 60 nm low-power CMOS | — |
| Number of Multipliers (18x18) | 66 | — |
| Number of PLLs | 4 | — |
| Estado RoHS | Compliant | Compliant |
| Logic Array Blocks (LABs) | — | 1,539 |
| Embedded Memory | — | 608,256 bits (594 Kbits M9K blocks) |
| Embedded 18x18 Multipliers | — | 66 |
| PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Maximum User I/O | — | 215 |
| Process Technology | — | TSMC 65 nm low-power CMOS |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Voltage (VCCIO) | — | 1.2 V to 3.3 V (per bank) |
| Temperatura de unión de funcionamiento | — | -40 °C to +100 °C (industrial) |
| Configuration Modes | — | Passive Serial (PS), Active Serial (AS), JTAG |