EP3C25F324C8N vs EP3C25F324I7 对比

详细并排对比 EP3C25F324C8N 出自 Intel 和 EP3C25F324I7 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP3C25F324C8N EP3C25F324I7
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 不推荐新设计
库存状态 有库存 有库存
单价(USD) $27.10 $64.80
Family Cyclone III —
Series Cyclone III Cyclone III
Logic Elements (LEs) 24,624 24,624
Total Memory Bits 608,256 bits —
Embedded Memory (Kbits) 608 Kbits —
Number of I/O 215 —
封装 324-BGA (FineLine) 324-ball FBGA (FineLine BGA), 19 x 19 mm, 1.0 mm pitch
Supply Voltage - Core 1.2 V —
安装类型 Surface Mount Surface Mount
工作温度 0 C to +85 C (commercial, suffix C) —
Speed Grade 8 —
Total RAM Bits 608,256 —
Process Node 60 nm low-power CMOS —
Number of Multipliers (18x18) 66 —
Number of PLLs 4 —
RoHS 状态 Compliant Compliant
Logic Array Blocks (LABs) — 1,539
Embedded Memory — 608,256 bits (594 Kbits M9K blocks)
Embedded 18x18 Multipliers — 66
PLLs — 4
Global Clock Networks — 20
Maximum User I/O — 215
Process Technology — TSMC 65 nm low-power CMOS
Core Voltage (VCCINT) — 1.2 V
I/O Voltage (VCCIO) — 1.2 V to 3.3 V (per bank)
工作结温 — -40 °C to +100 °C (industrial)
Configuration Modes — Passive Serial (PS), Active Serial (AS), JTAG

数据手册与资源

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