EP3C40F484C8 vs EP3C40F484C7N Comparación
Comparación detallada lado a lado de EP3C40F484C8 por Intel y EP3C40F484C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C40F484C8 | EP3C40F484C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $88,10 | $264,00 |
| Device Family | Cyclone III | Cyclone III |
| Logic Elements (LE) | 39,600 | — |
| Logic Array Blocks (LAB) | 2,475 | — |
| Embedded Memory (bits) | 1,161,216 | — |
| M9K Memory Blocks | 126 | — |
| Embedded 18x18 Multipliers | 56 | 126 |
| PLLs | 4 | 4 |
| Maximum User I/O | 331 | — |
| User I/O Banks | 8 | — |
| Encapsulado | 484-ball FBGA (F484), 1.0 mm pitch, 23 x 23 mm | 484-FBGA (F484), 1.0 mm pitch |
| Speed Grade | C8 (commercial, mid-speed) | — |
| Temperatura de funcionamiento | 0C to +85C (commercial) | 0C to +85C (commercial, C7 speed grade) |
| Process Node | 60 nm TSMC low-power CMOS | — |
| Supply Voltage (Core) | 1.2 V | — |
| Configuration Scheme | Active serial (AS), Passive serial (PS), JTAG | — |
| Estado RoHS | Compliant (lead-free FBGA) | Compliant (lead-free FBGA) |
| Nivel MSL | 3 (per JEDEC J-STD-020) | 3 |
| Logic Elements | — | 39,600 |
| Total Memory Bits | — | 1,161,216 |
| Global Clock Networks | — | 20 |
| User I/Os | — | 331 |
| Process Technology | — | 65 nm low-power |
| Configuration Memory | — | SRAM-based |
| I/O Standards Supported | — | LVDS, LVTTL, LVCMOS, SSTL, PCI |
| Tipo de montaje | — | Surface Mount |