EP3C55F484C7 vs EP3C55F484C6 Comparación
Comparación detallada lado a lado de EP3C55F484C7 por Intel y EP3C55F484C6 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3C55F484C7 | EP3C55F484C6 |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $52,95 | $222,00 |
| Device Family | Cyclone III | — |
| Logic Elements (LE) | 55,856 | — |
| Logic Array Blocks (LABs) | 3,495 | — |
| Embedded Memory Bits | 2,396,160 bits | — |
| Embedded Memory (M9K blocks) | 260 blocks of 9 Kbit each | — |
| Embedded 18x18 Multipliers | 156 | 56 |
| Maximum User I/Os | 327 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | 20 |
| Internal Operating Frequency (max) | 472 MHz | — |
| Process Technology | 65 nm TSMC low-k CMOS | 65 nm low-power CMOS |
| Core Voltage | 1.2 V | 1.2 V |
| Encapsulado | FBGA-484 (FineLine BGA, 23 × 23 mm, 1.0 mm pitch) | 484-FBGA (F484) |
| Operating Temperature Grade | Commercial (0 °C to +85 °C) - C7 speed grade | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (BGA) |
| Estado RoHS | Compliant (lead-free FBGA) | Compliant |
| Configuration Mode | Active Serial (AS), Passive Serial (PS), JTAG | — |
| Configuration Memory Type | SRAM (volatile, requires external flash) | — |
| Family | — | Cyclone III |
| Series | — | EP3C55 |
| Logic Elements | — | 55,856 LE |
| Embedded Memory | — | 2,396,160 bits (2.4 Mbit) |
| Maximum User I/O | — | 327 |
| Speed Grade | — | 6 (commercial) |
| Number of PLLs | — | 4 |
| I/O Banks | — | 8 |
| Supported I/O Standards | — | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Configuration | — | JTAG, AS (EPCS), PS, FPP |
| Temperatura de funcionamiento | — | 0C to +85C (commercial) |