EP3C55F484C7 vs EP3C55F484C6 Comparison
Detailed side-by-side comparison of EP3C55F484C7 by Intel and EP3C55F484C6 by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Specification Comparison
| Parameter | EP3C55F484C7 | EP3C55F484C6 |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last_time_buy | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $52.95 | $222.00 |
| Device Family | Cyclone III | β |
| Logic Elements (LE) | 55,856 | β |
| Logic Array Blocks (LABs) | 3,495 | β |
| Embedded Memory Bits | 2,396,160 bits | β |
| Embedded Memory (M9K blocks) | 260 blocks of 9 Kbit each | β |
| Embedded 18x18 Multipliers | 156 | 56 |
| Maximum User I/Os | 327 | β |
| PLLs | 4 | β |
| Global Clock Networks | 20 | 20 |
| Internal Operating Frequency (max) | 472 MHz | β |
| Process Technology | 65 nm TSMC low-k CMOS | 65 nm low-power CMOS |
| Core Voltage | 1.2 V | 1.2 V |
| Package | FBGA-484 (FineLine BGA, 23 Γ 23 mm, 1.0 mm pitch) | 484-FBGA (F484) |
| Operating Temperature Grade | Commercial (0 Β°C to +85 Β°C) - C7 speed grade | β |
| Mounting Type | Surface Mount (BGA) | Surface Mount (BGA) |
| RoHS Status | Compliant (lead-free FBGA) | Compliant |
| Configuration Mode | Active Serial (AS), Passive Serial (PS), JTAG | β |
| Configuration Memory Type | SRAM (volatile, requires external flash) | β |
| Family | β | Cyclone III |
| Series | β | EP3C55 |
| Logic Elements | β | 55,856 LE |
| Embedded Memory | β | 2,396,160 bits (2.4 Mbit) |
| Maximum User I/O | β | 327 |
| Speed Grade | β | 6 (commercial) |
| Number of PLLs | β | 4 |
| I/O Banks | β | 8 |
| Supported I/O Standards | β | LVDS, LVTTL, LVCMOS, SSTL, HSTL |
| Configuration | β | JTAG, AS (EPCS), PS, FPP |
| Operating Temperature | β | 0C to +85C (commercial) |