EP3SE260F1517C3N vs EP3SE260F1517C4 Comparación
Comparación detallada lado a lado de EP3SE260F1517C3N por Intel y EP3SE260F1517C4 por Altera. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE260F1517C3N | EP3SE260F1517C4 |
|---|---|---|
| Marca | Intel | Altera |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $9.850,00 | $8.400,00 |
| Family | Stratix III E | Stratix® III E FPGA |
| Logic Elements | 254,400 | — |
| Embedded Memory | 16,672,768 bits (16.7 Mbits) | — |
| User I/Os | 976 | — |
| DSP Blocks (18x18 Multipliers) | 816 | — |
| M9K Memory Blocks | 1,040 | — |
| Maximum Transceiver Data Rate | 600 Mbps | — |
| PLLs | 4 | — |
| Global Clock Networks | 16 | — |
| Encapsulado | 1517-BBGA (FCBGA) | 1517-BBGA, FCBGA |
| Process Technology | 65 nm TSMC low-power CMOS | — |
| Speed Grade | C3 (commercial) | -4 |
| Temperatura de unión de funcionamiento | 0 C to +85 C (commercial) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Estado RoHS | Compliant | Compliant (per Altera product page) |
| External Memory Interfaces | DDR3, DDR2, QDRII+, RLDRAM2 | — |
| Series | — | Stratix III E |
| Logic Elements (LE) | — | 255,000 |
| Adaptive Logic Modules (ALM) | — | 10,200 LABs / 10200 ALMs (per Mouser listing) |
| Embedded Memory (bits) | — | 16,672,768 |
| User I/O Count | — | 976 |
| DSP Blocks | — | 768 (18x18 multipliers per Mouser listing) |
| Ball Count | — | 1517 |
| Package Style | — | Flip-Chip BGA |
| Temperatura de funcionamiento | — | Commercial (0C to +85C) - inferred from C4 suffix |
| Process Node | — | 40 nm |
| Lead-Free | — | Yes |