EP3SE260H780I4L vs EP3SE260H780I4 Comparación

Comparación detallada lado a lado de EP3SE260H780I4L por Intel y EP3SE260H780I4 por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

Comparación de especificaciones

Parámetro EP3SE260H780I4L EP3SE260H780I4
Marca Intel Intel
Categoría FPGA & CPLD FPGA & CPLD
Estado del ciclo de vida Última compra NRND
Estado del stock In Stock In Stock
Precio unitario (USD) $1.395,00 $1.390,00
Family Stratix III E (Enhanced) Stratix III Enhanced (Stratix III E)
Logic Elements 255,000 255,000
Total Memory Bits 16,672,640 —
Number of LABs/CLBs [DATA_NEEDED: LAB count] —
User I/O Count 488 —
Core Voltage 0.9 V 1.1 V
Process Technology 65 nm 65 nm CMOS
Package Type 780-pin FC-HFBGA (flip-chip BGA) —
Tipo de montaje Surface Mount (flip-chip) Surface Mount (BGA)
Number of Transceivers 24 (family-level maximum, per-pin count depends on variant) —
Max Transceiver Data Rate 6.375 Gbps (Stratix III E family spec) —
Number of 18x18 Multipliers [DATA_NEEDED: per-package multiplier count] —
Temperatura de funcionamiento Industrial, -40C to +85C -40C to +100C (industrial, 'I' grade)
Estado RoHS Compliant (lead-free) [DATA_NEEDED: RoHS compliance status]
Configuration Mode JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel —
Pin/Package 780-BBGA, FCBGA (flip-chip) —
Logic Cells — 255,000
Logic Array Blocks (LABs) — 10,200
Adaptive Logic Modules (ALMs) — approximately 203,200
Maximum User I/Os — 488
Embedded RAM (total) — approximately 14.4 Mbit (M9K/M144K blocks)
DSP Blocks — approximately 768 (18x18 multipliers)
Maximum Operating Frequency — up to 450 MHz core / 717 MHz per Partstack record
Encapsulado — 780-ball FC-HFBGA (HBGA)
Speed Grade — 4
Configuration Schemes — JTAG, Passive Serial, Fast Passive Parallel, Active Serial

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