EP3SE260H780I4L vs EP3SE260H780I4 Сравнение
Подробное сравнение бок о бок EP3SE260H780I4L от Intel и EP3SE260H780I4 от Intel. Сравните ключевые характеристики, электрические параметры, упаковку, статус жизненного цикла, цены и наличие, чтобы выбрать лучший компонент для ваших требований.
Intel
EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel
EP3SE260H780I4L ⚠ Последняя закупкаСравнение характеристик
| Параметр | EP3SE260H780I4L | EP3SE260H780I4 |
|---|---|---|
| Бренд | Intel | Intel |
| Категория | FPGA & CPLD | FPGA & CPLD |
| Статус жизненного цикла | Последняя закупка | NRND |
| Наличие | In Stock | In Stock |
| Цена за единицу (USD) | $1.395,00 | $1.390,00 |
| Family | Stratix III E (Enhanced) | Stratix III Enhanced (Stratix III E) |
| Logic Elements | 255,000 | 255,000 |
| Total Memory Bits | 16,672,640 | — |
| Number of LABs/CLBs | [DATA_NEEDED: LAB count] | — |
| User I/O Count | 488 | — |
| Core Voltage | 0.9 V | 1.1 V |
| Process Technology | 65 nm | 65 nm CMOS |
| Package Type | 780-pin FC-HFBGA (flip-chip BGA) | — |
| Тип монтажа | Surface Mount (flip-chip) | Surface Mount (BGA) |
| Number of Transceivers | 24 (family-level maximum, per-pin count depends on variant) | — |
| Max Transceiver Data Rate | 6.375 Gbps (Stratix III E family spec) | — |
| Number of 18x18 Multipliers | [DATA_NEEDED: per-package multiplier count] | — |
| Рабочая температура | Industrial, -40C to +85C | -40C to +100C (industrial, 'I' grade) |
| Статус RoHS | Compliant (lead-free) | [DATA_NEEDED: RoHS compliance status] |
| Configuration Mode | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel | — |
| Pin/Package | 780-BBGA, FCBGA (flip-chip) | — |
| Logic Cells | — | 255,000 |
| Logic Array Blocks (LABs) | — | 10,200 |
| Adaptive Logic Modules (ALMs) | — | approximately 203,200 |
| Maximum User I/Os | — | 488 |
| Embedded RAM (total) | — | approximately 14.4 Mbit (M9K/M144K blocks) |
| DSP Blocks | — | approximately 768 (18x18 multipliers) |
| Maximum Operating Frequency | — | up to 450 MHz core / 717 MHz per Partstack record |
| Корпус | — | 780-ball FC-HFBGA (HBGA) |
| Speed Grade | — | 4 |
| Configuration Schemes | — | JTAG, Passive Serial, Fast Passive Parallel, Active Serial |