EP3SE260H780I4L vs EP3SE260H780I4 对比

详细并排对比 EP3SE260H780I4L 出自 Intel 和 EP3SE260H780I4 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EP3SE260H780I4L EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel

EP3SE260H780I4L - Stratix III E FPGA, 255K Logic Elements | Intel

EP3SE260H780I4L ⚠ 最后一次采购

规格对比

参数 EP3SE260H780I4L EP3SE260H780I4
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 不推荐新设计
库存状态 有库存 有库存
单价(USD) $1,395.00 $1,390.00
Family Stratix III E (Enhanced) Stratix III Enhanced (Stratix III E)
Logic Elements 255,000 255,000
Total Memory Bits 16,672,640 —
Number of LABs/CLBs [DATA_NEEDED: LAB count] —
User I/O Count 488 —
Core Voltage 0.9 V 1.1 V
Process Technology 65 nm 65 nm CMOS
Package Type 780-pin FC-HFBGA (flip-chip BGA) —
安装类型 Surface Mount (flip-chip) Surface Mount (BGA)
Number of Transceivers 24 (family-level maximum, per-pin count depends on variant) —
Max Transceiver Data Rate 6.375 Gbps (Stratix III E family spec) —
Number of 18x18 Multipliers [DATA_NEEDED: per-package multiplier count] —
工作温度 Industrial, -40C to +85C -40C to +100C (industrial, 'I' grade)
RoHS 状态 Compliant (lead-free) [DATA_NEEDED: RoHS compliance status]
Configuration Mode JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel —
Pin/Package 780-BBGA, FCBGA (flip-chip) —
Logic Cells — 255,000
Logic Array Blocks (LABs) — 10,200
Adaptive Logic Modules (ALMs) — approximately 203,200
Maximum User I/Os — 488
Embedded RAM (total) — approximately 14.4 Mbit (M9K/M144K blocks)
DSP Blocks — approximately 768 (18x18 multipliers)
Maximum Operating Frequency — up to 450 MHz core / 717 MHz per Partstack record
封装 — 780-ball FC-HFBGA (HBGA)
Speed Grade — 4
Configuration Schemes — JTAG, Passive Serial, Fast Passive Parallel, Active Serial

数据手册与资源

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