EP3SE50F484I3 vs EP3SL50F484I3N Comparación
Comparación detallada lado a lado de EP3SE50F484I3 por Intel y EP3SL50F484I3N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SE50F484I3 | EP3SL50F484I3N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Última compra |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $188,00 | $552,30 |
| Family | Stratix III E | Stratix III L |
| Logic Elements | 47,500 | 47,500 |
| Logic Array Blocks (LABs) | 1,900 | 1,900 |
| Embedded Memory | 5,760 Kbits | 2,184,192 bits (2.1 Mbit) |
| User I/Os | 296 | — |
| Process Technology | 65 nm | 65 nm CMOS |
| Core Voltage | 1.1 V | 0.9 V / 1.1 V |
| Encapsulado | 484-ball FCBGA (FineLine BGA), 1.0 mm pitch | 484-ball FBGA (FC-FBGA, 23x23 mm, 1.0 mm pitch) |
| Operating Temperature Grade | Industrial (-40 °C to +100 °C) | — |
| Speed Grade | I3 (-3 speed bin, industrial) | — |
| DSP Blocks | Yes (embedded multipliers and accumulators) | — |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| PLLs | Yes (multiple, for clock management) | — |
| I/O Standards | LVDS, LVCMOS, LVTTL, HSTL, SSTL, PCI, PCI-X | — |
| Transceivers | Multi-gigabit transceivers supported | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount (SMT) |
| Estado RoHS | Compliant | — |
| Lead-Free | Yes | — |
| Embedded 18x18 Multipliers | — | 218 |
| Maximum User I/O | — | 296 |
| Maximum Core Frequency | — | 500 MHz |
| Temperatura de unión de funcionamiento | — | -40C to +100C (Industrial) |
| Lead-Free / RoHS | — | Lead Free / Compliant |
| Nivel MSL | — | [DATA_NEEDED: MSL level per JEDEC J-STD-020] |
| Programming Tool | — | Quartus II (legacy) |