EP3SL200H780I3N vs EP3SL200H780C4L Comparación
Comparación detallada lado a lado de EP3SL200H780I3N por Intel y EP3SL200H780C4L por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP3SL200H780I3N | EP3SL200H780C4L |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | NRND | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $7.200,00 | $6.459,35 |
| Family | Stratix III L | — |
| Logic Elements | 200,000 | 200,000 |
| RAM Bits | 10,901,504 | — |
| User I/O | 488 | — |
| Encapsulado | 780-BBGA, FCBGA | — |
| Package Pin Count | 780 | — |
| Tipo de montaje | Surface Mount | — |
| Temperatura de funcionamiento | -40C to +100C (Industrial) | 0C to 85C (commercial) |
| Supply Voltage (Core) | 0.9 V | — |
| Technology | CMOS, 40 nm | — |
| Process Node | 40 nm | — |
| Number of Terminals | 780 | — |
| Case / Package Code | BGA-780 | — |
| Estado RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Manufacturer | — | Intel (formerly Altera) |
| Series | — | Stratix III |
| Device Type | — | FPGA - Field Programmable Gate Array |
| Embedded Memory | — | 6.5 Mbit |
| User I/O Count | — | 488 |
| Package Type | — | 780-ball FCBGA (FineLine BGA, HBGA) |
| Package Code | — | BGA-780 / PBGA780 / HBGA-780 |
| Package Mounting | — | Surface Mount |
| Internal Logic Frequency | — | up to 717 MHz (per ampheo datasheet brief) |
| Speed Grade | — | -4 (medium performance, commercial) |
| Lead-Free / Pb-Free | — | Yes (L suffix, lead-free) |
| Process Technology | — | TSMC 40 nm |
| Configuration Modes | — | FPP, AS, PS, JTAG |