EP3SL200H780I3N - Stratix III L FPGA, 200K LE, 780-BGA | Intel
N.º de pieza: EP3SL200H780I3N ✗ Fin de vida| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $8546.04 | $8.546,04 |
| 10 | $8350 | $83.500,00 |
| 100 | $7900 | $790.000,00 |
| 500 | $7500 | $3.750.000,00 |
| 1.000 | $7200 | $7.200.000,00 |
EP3SL200H780I3N Descripción general
A Field-Programmable Gate Array (FPGA) is a semiconductor integrated circuit whose logic fabric, routing, and I/O blocks can be reconfigured by the end user after manufacture. FPGAs sit in the broader category of programmable logic devices (PLDs) and belong to the digital IC hierarchy. They are commonly used for ASIC prototyping, digital signal processing, high-speed serial interface bridging, and parallel hardware acceleration where fixed-function processors fall short.
Key features of the EP3SL200H780I3N include 200,000 logic elements, 10,901,504 bits of embedded RAM, 488 user I/Os, and support for high-speed external memory interfaces (DDR2/DDR3/QDRII+/RLDRAM II). The device implements an advanced logic array, on-chip multipliers, and dedicated DSP blocks enabling high-throughput arithmetic pipelines. The 780-ball FCBGA provides a 29x29 mm body with 1 mm ball pitch suitable for high-density PCB designs.
Architecturally, the Stratix III L family leverages a 40 nm process with adaptive logic modules (ALMs), programmable power technology (Programmable Power Technology), and a rich mix of 6.375-Gbps transceivers. The EP3SL200H780I3N operates from a 0.9 V core supply and supports industrial temperature grades from -40C to +100C, giving designers flexibility for telecom, networking, and storage equipment.
Typical applications include high-end networking line cards, telecom baseband units, ASIC prototyping, and high-performance DSP pipelines. The large logic count and embedded memory make the EP3SL200H780I3N suitable for protocol bridging, image processing front-ends, and high-speed data acquisition where multi-gigabit transceivers and parallel memory are required.
When designing with this device, ensure the Quartus II / Quartus Prime design suite targets the Stratix III family, and follow Intel's pin-out guidelines for the 780-FCBGA. Plan power decoupling carefully, because the FPGA's dynamic current can shift by orders of magnitude during configuration or burst operation.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on a single distributor or manufacturer page. Engineers get a side-by-side view of same-brand Stratix III drop-ins, parametric proximity, and a documented pin-compatible selection path.
Alternativas directas para EP3SL200H780I3N — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con EP3SL200H780I3N (mismo factor de forma y huella) — difiere en Package, Speed Grade, Operating Temperature, Family, Mounting Type.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
EP3SL200H780I3
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$7980 / unidad
Ver hoja de datos →EP3SL200H780C2N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$6050 / unidad
Ver hoja de datos →EP3SL200H780C3N
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$4995 / unidad
Ver hoja de datos →EP3SL200H780C4N
✅ Sustitución directa ⚠️ Especificaciones sin verificar📋 Alternativa de referencia (no en el catálogo)
EP3SL200H780C4LN
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$1145 / unidad
Ver hoja de datos →EP3SL200H780C4L
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$6459.35 / unidad
Ver hoja de datos →EP3SE260H780I3N
✅ Sustitución directa✓ En stock
$3295 / unidad
Ver hoja de datos →EP3SE260H780I3
✅ Sustitución directa ⚠️ Especificaciones sin verificar✓ En stock
$1410 / unidad
Ver hoja de datos →EP3SL200H780I3N Valores máximos y características eléctricas
| Family | Stratix III L |
| Logic Elements | 200,000 |
| RAM Bits | 10,901,504 |
| User I/O | 488 |
| Encapsulado | 780-BBGA, FCBGA |
| Package Pin Count | 780 |
| Tipo de montaje | Surface Mount |
| Temperatura de funcionamiento | -40C to +100C (Industrial) |
| Supply Voltage (Core) | 0.9 V |
| Technology | CMOS, 40 nm |
| Process Node | 40 nm |
| Number of Terminals | 780 |
| Case / Package Code | BGA-780 |
| Estado RoHS | Compliant |
| Lead-Free | Yes |
Guía de configuración de pines de EP3SL200H780I3N bga-780
Configuración de pines para EP3SL200H780I3N (encapsulado bga-780). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para EP3SL200H780I3N.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
EP3SL200H780I3N es adecuado para 6 aplicacións: High-Speed Networking Line Cards, ASIC Prototyping and Emulation, Telecom Baseband Processing, High-Performance DSP Pipelines, Video Broadcast and Image Processing, Industrial Automation and Motor Control.
High-Speed Networking Line Cards
The EP3SL200H780I3N's 200,000 logic elements and 488 user I/Os make it ideal for high-end networking line cards that process multiple gigabit Ethernet streams simultaneously. Its 10,901,504 bits of embedded RAM buffer packet headers and lookup tables, while dedicated on-chip multipliers accelerate hash and CRC computations. Compared with a fixed-function network processor, this FPGA lets OEMs customize forwarding tables and protocol handling without silicon redesign. A typical design places the device between PHY transceivers and the host CPU, processing 10 Gbps class traffic in real time.
Recomendado
ASIC Prototyping and Emulation
Designers use the EP3SL200H780H780I3N to emulate large ASIC designs before tape-out, partitioning the ASIC across multiple FPGAs when needed. The 200K logic elements, abundant 10 Mb of embedded RAM, and 488 I/Os allow a single device to absorb substantial portions of a typical SoC, including CPU cores, memory controllers, and custom accelerators. Quartus Prime synthesis maps RTL directly, and the FCBGA-780 footprint supports high-speed signal integrity for ASIC-validation use cases.
Recomendado
Telecom Baseband Processing
In 3G/4G baseband units the EP3SL200H780I3N performs channel coding, modulation, and digital up-conversion across multiple carriers. The 200,000 logic elements implement turbo and LDPC decoders, while the 10,901,504 bits of embedded RAM store soft-bit buffers. The industrial temperature grade (-40C to +100C) supports outdoor or uncontrolled-cabinet installations. Combined with multi-gigabit transceivers, the device can interface directly with RF front-ends and baseband ADC/DAC converters.
Recomendado
High-Performance DSP Pipelines
The EP3SL200H780I3N's dedicated DSP blocks and on-chip memory deliver multi-GigaMAC DSP throughput for radar, sonar, software-defined radio, and medical imaging. The 488 I/Os connect to multi-channel ADCs and DACs, while 10,901,504 bits of RAM act as a fast sample buffer between FFT stages. Designers exploit the Stratix III ALM architecture to implement parallel filter banks, achieving latency orders of magnitude lower than DSP processor alternatives.
Recomendado
Video Broadcast and Image Processing
Broadcast studios deploy the EP3SL200H780I3N for real-time 4K video processing, format conversion, and multi-stream overlay. Its 200,000 logic elements handle motion estimation and deinterlacing pipelines, while 10 Mb embedded RAM provides line and macro-block buffers. The 488 I/Os interface to SDI, HDMI, and DisplayPort bridges. Industrial temperature grade supports broadcast-truck installations where ambient temperatures vary widely.
Recomendado
Industrial Automation and Motor Control
In high-axis-count industrial automation systems the EP3SL200H780I3N orchestrates precision multi-axis motion control, deterministic EtherCAT or PROFINET communication, and high-resolution encoder feedback processing. The 488 I/Os support hundreds of opto-isolated digital inputs and PWM outputs, while DSP blocks execute field-oriented control (FOC) loops with sub-microsecond period. Industrial temperature rating and abundant logic make it a single-chip PLC alternative for complex machines.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para EP3SL200H780I3N — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | EP3SL200H780I3 | EP3SL200H780C2N | EP3SL200H780C3N | EP3SL200H780C4N | EP3SE260H780I3N |
|---|---|---|---|---|---|---|
| Package | 780-BBGA, FCBGA | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same | 780-BBGA, FCBGA - same |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Family | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix III L | Stratix IV E |
| Logic Elements | 200,000 | 200,000 | 200,000 | 200,000 | 200,000 | 260,000 |
| User I/O | 488 | 488 | 488 | 488 | 488 | 488 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) |
| Speed Grade | -3 | -3 | -2 | -3 | -4 (faster) | -3 |
| RoHS / Lead-Free | Yes (N suffix) | No | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) |
Diferenciadores clave
- Highest-density Stratix III L member with 200K LE (frente a EP3SL200H780C2N)
- Same-package upgrade path to Stratix IV (frente a EP3SE260H780I3N)
- Industrial-grade option in the H780 family (frente a EP3SL200H780C4N)
Notas de diseño
The EP3SL200H780I3N can dissipate 5-15 W under typical workloads and up to ~25 W during configuration bursts. The FCBGA-780 package requires a thermal pad with a 4-6 W/(m*K) thermal interface material, plus at least four thermal vias under the lid array to ground/power planes. Designers should follow Intel's Stratix III Thermal Management application note and validate junction temperature in-system using the on-die temperature-sensing diode.
Route all 488 user I/Os on the top layers with reference to a continuous ground/power plane. Maintain 50 ohm single-ended and 100 ohm differential impedance for LVDS and transceiver pairs. Use Intel's pin-out files and the Quartus Prime Fitter report to break out high-utilization I/O banks; bank-VCCIO must be supplied from a low-noise regulator within 50 mm of the BGA balls.
Do not assume a Stratix III to Stratix IV board swap is pin-to-pin transparent. Despite the same 780-FCBGA package, I/O bank assignments, transceiver placement, and configuration-pin mapping differ, so existing firmware and Quartus II projects require re-compilation against the Stratix IV device library. Always run the Quartus I/O Assignment Analysis before committing the layout.
Información de cumplimiento
RoHS compliant per the 'N' suffix in part number. Reach and conflict-minerals status inherited from Intel's Stratix III family declarations. AEC-Q100 not applicable for FPGA ICs. Halogen-free status not explicitly stated in the provided data.