EP3SL50F780C3 vs EP3SL50F780C3G Comparación
Comparación detallada lado a lado de EP3SL50F780C3 por Intel y EP3SL50F780C3G por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Intel
EP3SL50F780C3 - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel / Altera
EP3SL50F780C3 ⚠ Última compraIntel
EP3SL50F780C3G - Stratix III L FPGA, 47.5K LE, 488 I/O, 780-FBGA | Altera / Intel
EP3SL50F780C3G ✓ ActivoComparación de especificaciones
| Parámetro | EP3SL50F780C3 | EP3SL50F780C3G |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Última compra | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $540,00 | $625,00 |
| Family | Stratix III L (low-power) | Stratix III L |
| Series | Stratix III | — |
| Logic Elements | 47,500 | — |
| Logic Array Blocks (LABs) | 1,900 | — |
| Embedded Memory Bits | 2,184,192 | — |
| User I/Os | 488 | — |
| Package Type | 780-BBGA, FCBGA (FineLine) | — |
| Device Pin Count | 780 | — |
| Temperatura de funcionamiento | 0C to +85C (Commercial) | 0C to +85C (commercial) |
| Speed Grade | 3 | — |
| Supply Voltage (Core) | [DATA_NEEDED: VCCINT nominal value] | — |
| PLLs | 12 | — |
| Global Clock Networks | 24 | — |
| Process Node | 65 nm TSMC | — |
| Configuration Method | SRAM-based, supports Partial Reconfiguration | SRAM-based, JTAG/AS configuration |
| Estado RoHS | Compliant | Compliant (per DigiKey listing) |
| Lead-Free / Halogen-Free | Lead-Free (per package marking); Halogen-Free status unknown | — |
| Nivel de sensibilidad a la humedad (MSL) | MSL3 (per JEDEC J-STD-020, typical for large FBGA) | — |
| Logic Elements (LE) | — | 47,500 |
| Adaptive Logic Modules (ALM) | — | 19,000 |
| Embedded Memory (bits) | — | 2,184,192 |
| Distributed RAM | — | 2.08 Mbit |
| User I/O Count | — | 488 |
| Core Voltage | — | 1.1 V |
| Temperature Grade Suffix | — | C (commercial, "3" speed grade) |
| Encapsulado | — | 780-ball FBGA |
| Tipo de montaje | — | SMD/SMT |
| Packaging | — | Tray |
| Process Technology | — | TSMC 40 nm low-power |
| Design Software | — | Intel Quartus II (v9.0+) |