EP3SL50F780C3 vs EP3SL50F780C3G Vergleich
Detaillierter Direktvergleich von EP3SL50F780C3 von Intel und EP3SL50F780C3G von Intel. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.
Intel
EP3SL50F780C3 - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel / Altera
EP3SL50F780C3 ⚠ Letzte BestellmöglichkeitIntel
EP3SL50F780C3G - Stratix III L FPGA, 47.5K LE, 488 I/O, 780-FBGA | Altera / Intel
EP3SL50F780C3G ✓ AktivSpezifikationsvergleich
| Parameter | EP3SL50F780C3 | EP3SL50F780C3G |
|---|---|---|
| Marke | Intel | Intel |
| Kategorie | FPGA & CPLD | FPGA & CPLD |
| Lebenszyklusstatus | Letzte Kaufgelegenheit | Aktiv |
| Lagerstatus | In Stock | In Stock |
| Stückpreis (USD) | $540,00 | $625,00 |
| Family | Stratix III L (low-power) | Stratix III L |
| Series | Stratix III | — |
| Logic Elements | 47,500 | — |
| Logic Array Blocks (LABs) | 1,900 | — |
| Embedded Memory Bits | 2,184,192 | — |
| User I/Os | 488 | — |
| Package Type | 780-BBGA, FCBGA (FineLine) | — |
| Device Pin Count | 780 | — |
| Betriebstemperatur | 0C to +85C (Commercial) | 0C to +85C (commercial) |
| Speed Grade | 3 | — |
| Supply Voltage (Core) | [DATA_NEEDED: VCCINT nominal value] | — |
| PLLs | 12 | — |
| Global Clock Networks | 24 | — |
| Process Node | 65 nm TSMC | — |
| Configuration Method | SRAM-based, supports Partial Reconfiguration | SRAM-based, JTAG/AS configuration |
| RoHS-Status | Compliant | Compliant (per DigiKey listing) |
| Lead-Free / Halogen-Free | Lead-Free (per package marking); Halogen-Free status unknown | — |
| Feuchtigkeitsempfindlichkeitsgrad (MSL) | MSL3 (per JEDEC J-STD-020, typical for large FBGA) | — |
| Logic Elements (LE) | — | 47,500 |
| Adaptive Logic Modules (ALM) | — | 19,000 |
| Embedded Memory (bits) | — | 2,184,192 |
| Distributed RAM | — | 2.08 Mbit |
| User I/O Count | — | 488 |
| Core Voltage | — | 1.1 V |
| Temperature Grade Suffix | — | C (commercial, "3" speed grade) |
| Gehäuse | — | 780-ball FBGA |
| Montageart | — | SMD/SMT |
| Packaging | — | Tray |
| Process Technology | — | TSMC 40 nm low-power |
| Design Software | — | Intel Quartus II (v9.0+) |