EP3SL50F780C3 vs EP3SL50F780C3G 对比

详细并排对比 EP3SL50F780C3 出自 Intel 和 EP3SL50F780C3G 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EP3SL50F780C3 EP3SL50F780C3G
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 有效
库存状态 有库存 有库存
单价(USD) $540.00 $625.00
Family Stratix III L (low-power) Stratix III L
Series Stratix III —
Logic Elements 47,500 —
Logic Array Blocks (LABs) 1,900 —
Embedded Memory Bits 2,184,192 —
User I/Os 488 —
Package Type 780-BBGA, FCBGA (FineLine) —
Device Pin Count 780 —
工作温度 0C to +85C (Commercial) 0C to +85C (commercial)
Speed Grade 3 —
Supply Voltage (Core) [DATA_NEEDED: VCCINT nominal value] —
PLLs 12 —
Global Clock Networks 24 —
Process Node 65 nm TSMC —
Configuration Method SRAM-based, supports Partial Reconfiguration SRAM-based, JTAG/AS configuration
RoHS 状态 Compliant Compliant (per DigiKey listing)
Lead-Free / Halogen-Free Lead-Free (per package marking); Halogen-Free status unknown —
湿敏等级(MSL) MSL3 (per JEDEC J-STD-020, typical for large FBGA) —
Logic Elements (LE) — 47,500
Adaptive Logic Modules (ALM) — 19,000
Embedded Memory (bits) — 2,184,192
Distributed RAM — 2.08 Mbit
User I/O Count — 488
Core Voltage — 1.1 V
Temperature Grade Suffix — C (commercial, "3" speed grade)
封装 — 780-ball FBGA
安装类型 — SMD/SMT
Packaging — Tray
Process Technology — TSMC 40 nm low-power
Design Software — Intel Quartus II (v9.0+)

数据手册与资源

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