EP3SL50F780C3 vs EP3SL50F780C3G Comparison
Detailed side-by-side comparison of EP3SL50F780C3 by Intel and EP3SL50F780C3G by Intel. Compare key specifications, electrical parameters, packaging, lifecycle status, pricing, and availability to determine the best component for your design requirements.
Intel
EP3SL50F780C3 - Stratix III L FPGA, 47.5K LE, 780-FBGA | Intel / Altera
EP3SL50F780C3 β Last Time BuyIntel
EP3SL50F780C3G - Stratix III L FPGA, 47.5K LE, 488 I/O, 780-FBGA | Altera / Intel
EP3SL50F780C3G β ActiveSpecification Comparison
| Parameter | EP3SL50F780C3 | EP3SL50F780C3G |
|---|---|---|
| Brand | Intel | Intel |
| Category | FPGA & CPLD | FPGA & CPLD |
| Lifecycle Status | Last_time_buy | Active |
| Stock Status | In Stock | In Stock |
| Unit Price (USD) | $540.00 | $625.00 |
| Family | Stratix III L (low-power) | Stratix III L |
| Series | Stratix III | β |
| Logic Elements | 47,500 | β |
| Logic Array Blocks (LABs) | 1,900 | β |
| Embedded Memory Bits | 2,184,192 | β |
| User I/Os | 488 | β |
| Package Type | 780-BBGA, FCBGA (FineLine) | β |
| Device Pin Count | 780 | β |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C (commercial) |
| Speed Grade | 3 | β |
| Supply Voltage (Core) | [DATA_NEEDED: VCCINT nominal value] | β |
| PLLs | 12 | β |
| Global Clock Networks | 24 | β |
| Process Node | 65 nm TSMC | β |
| Configuration Method | SRAM-based, supports Partial Reconfiguration | SRAM-based, JTAG/AS configuration |
| RoHS Status | Compliant | Compliant (per DigiKey listing) |
| Lead-Free / Halogen-Free | Lead-Free (per package marking); Halogen-Free status unknown | β |
| Moisture Sensitivity Level (MSL) | MSL3 (per JEDEC J-STD-020, typical for large FBGA) | β |
| Logic Elements (LE) | β | 47,500 |
| Adaptive Logic Modules (ALM) | β | 19,000 |
| Embedded Memory (bits) | β | 2,184,192 |
| Distributed RAM | β | 2.08 Mbit |
| User I/O Count | β | 488 |
| Core Voltage | β | 1.1 V |
| Temperature Grade Suffix | β | C (commercial, "3" speed grade) |
| Package | β | 780-ball FBGA |
| Mounting Type | β | SMD/SMT |
| Packaging | β | Tray |
| Process Technology | β | TSMC 40 nm low-power |
| Design Software | β | Intel Quartus II (v9.0+) |