EP4CGX50DF23C6N vs EP4CGX50DF23C7N Comparación
Comparación detallada lado a lado de EP4CGX50DF23C6N por Intel y EP4CGX50DF23C7N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EP4CGX50DF23C6N | EP4CGX50DF23C7N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $52,30 | $43,20 |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 49,888 | 49,888 |
| Configurable Logic Blocks (CLBs) | 3,118 | 3,118 |
| Embedded Memory | 2,340 Kbits | — |
| Process Technology | 60 nm | 60 nm |
| Core Voltage | 1.2 V | — |
| Number of Pins / Balls | 484 | — |
| Package Type | 484-ball FBGA (PBGA) | — |
| JEDEC Package Code | S-PBGA-B484 | — |
| User I/O | 218 | — |
| Transceiver Channels | Up to 8 | — |
| Maximum Transceiver Data Rate | 3.125 Gbps | — |
| Operating Temperature Grade | Commercial | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Configuration Method | JTAG / Passive Serial / Active Serial | — |
| Total RAM Bits | — | 2,432 Kbit (≈ 304 KB) |
| Embedded 18x18 Multipliers | — | 66 |
| PLLs | — | 2 |
| Global Clock Networks | — | 8 (with up to 16 clock pins per region) |
| Number of I/O Pins | — | 290 |
| Transceivers | — | Up to 8 channels, 3.125 Gbps |
| Core Supply Voltage (VCCINT) | — | 1.15 V to 1.25 V (nominal 1.2 V) |
| Temperatura de funcionamiento | — | 0 °C to 85 °C (commercial) |
| Encapsulado | — | 484-ball FBGA (Plastic BGA, S-PBGA-B484, 23x23 mm) |
| Configuration Modes | — | Passive Serial (PS), Active Serial (AS), JTAG |
| Supported Memory Interfaces | — | DDR2 SDRAM, QDRII SRAM, RLDRAM II |
| Estado RoHS | — | Compliant (Pb-free variant) |
| Nivel MSL | — | 3 (168 hours) |