EPM2210GF256C5N vs EPM2210F256C5N Comparación
Comparación detallada lado a lado de EPM2210GF256C5N por Intel y EPM2210F256C5N por Intel. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | EPM2210GF256C5N | EPM2210F256C5N |
|---|---|---|
| Marca | Intel | Intel |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $11,20 | $17,85 |
| Family | MAX II | MAX II |
| Logic Elements | 2210 | 2210 |
| Encapsulado | 256-ball FineLine BGA (GF256) | 256-ball FineLine BGA (17x17mm, 1mm pitch) |
| Speed Grade | C5 | — |
| Temperature Grade | Commercial (N) | — |
| Process Node | 0.18 µm | — |
| Configuration Memory | Non-volatile on-chip Flash | Internal flash (non-volatile, instant-on) |
| Maximum User I/O Pins | 272 | — |
| User Flash Memory | 8 Kbits | — |
| On-chip Oscillator | Yes | — |
| Multi-volt I/O Support | 1.5V / 1.8V / 2.5V / 3.3V | — |
| Programmable Interconnect | MultiTrack | — |
| In-system Programming | JTAG (IEEE 1149.1) | — |
| Logic Block Architecture | 4-input LUT | — |
| Tipo de montaje | Surface Mount (BGA) | Surface Mount |
| Estado RoHS | [DATA_NEEDED: rohs status] | Compliant |
| Macrocells | — | 1700 |
| User I/Os | — | 204 |
| User Flash Memory (UFM) | — | 8 Kbits |
| Propagation Delay (tPD) | — | 7 ns |
| Turn-On Delay (tSU) | — | 11.2 ns |
| Maximum Internal Frequency | — | 201.1 MHz |
| Supply Voltage (VCCINT) | — | 2.375 V to 3.6 V (3.3 V typical) |
| I/O Voltage Standards | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Process Technology | — | 0.18 um CMOS with on-chip flash |
| Global Clocks | — | 4 |
| Temperatura de funcionamiento | — | 0C to +85C (commercial) |
| Programming Interface | — | JTAG (IEEE 1149.1) / ByteBlaster / USB-Blaster |
| Lead-Free | — | Yes |