H5AN8G6NAFR-PBC vs H5AN8G8NAFR-PBC Comparación
Comparación detallada lado a lado de H5AN8G6NAFR-PBC por SK hynix y H5AN8G8NAFR-PBC por SK hynix. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | H5AN8G6NAFR-PBC | H5AN8G8NAFR-PBC |
|---|---|---|
| Marca | SK hynix | SK hynix |
| Categoría | Memory ICs | DRAM |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3,55 | $2,20 |
| Tipo de memoria | DDR4 SDRAM | DDR4 SDRAM |
| Density | 8 Gbit | 8 Gb |
| Organización de memoria | 512M x 16 | 1G x 8 |
| VDD Supply Voltage | 1.20 V +/- 0.06 V | — |
| VDDQ Supply Voltage | 1.20 V +/- 0.06 V | — |
| VPP Supply Voltage | 2.5 V +0.25/-0.125 V | — |
| Tipo de interfaz | DDR4 (parallel, double data rate) | — |
| Speed Bins Supported | DDR4-1600 / 1866 / 2133 / 2400 (datasheet speed bin tables) | — |
| Refresh | Auto / Self Refresh | — |
| DLL | DLL ON mode for speed bin operation | — |
| Clock | Differential clock (CK/CK#) | — |
| Encapsulado | TFBGA-96 (rectangular) | FBGA-78 |
| Number of Terminals | 96 | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | [DATA_NEEDED: operating temperature range] |
| Estado RoHS | Compliant (Lead-Free & Halogen-Free) | Compliant |
| Composition | CMOS | — |
| Tensión de alimentación | — | 1.2 V |
| Speed Grade / Data Rate | — | [DATA_NEEDED: speed grade / data rate] |
| Interfaz | — | DDR4 (double data rate, synchronized to clock) |
| Address Inputs | — | A0 - A17 (A10/AP, A12/BC_n, RAS_n/A16, CAS_n/A15, WE_n/A14 multiplexed) |
| Connectivity Test Mode | — | TEN (optional input on x4/x8, required on x16) |
| Process Technology | — | CMOS |
| Lead-Free | — | Yes |
| Sin halógenos | — | Yes |
| Datasheet Revision | — | Rev. 1.2 / July 2017 |