H5AN8G8NCJR-PBC vs MT40A1G8AG-062E Comparación
Comparación detallada lado a lado de H5AN8G8NCJR-PBC por SK hynix y MT40A1G8AG-062E por Micron Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | H5AN8G8NCJR-PBC | MT40A1G8AG-062E |
|---|---|---|
| Marca | SK hynix | Micron Technology |
| Categoría | Memory ICs | Memory ICs |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2,40 | $3,10 |
| Tipo de memoria | DDR4 SDRAM | DDR4 SDRAM |
| Tamaño de memoria | 8 Gb (1 GB) | 8 Gbit |
| Organización de memoria | 1G x 8 (x8) | 1G x 8 |
| Supply Voltage (VDD) | 1.2 V | 1.2 V |
| Interface Voltage (VDDQ) | 1.2 V (SSTL12) | — |
| Velocidad de datos | [DATA_NEEDED: data rate for -PBC speed grade (Mbps/MT/s)] | — |
| Encapsulado | 78-ball FBGA | 78-FBGA (7.5 x 11 mm) |
| Tipo de montaje | Surface Mount | Surface Mount (BGA) |
| Architecture | CMOS, fully synchronous, dual-edge clocked | — |
| Bank Structure | 8 internal banks, bank-group architecture | — |
| Burst Length | BL8 | — |
| Características | ODT, DM, DQS strobes, programmable CAS latency, self-refresh | — |
| Die Revision Family | CJR (H5AN8G8NCJR-xxC) | — |
| Estado RoHS | Lead-Free & Halogen-Free | [DATA_NEEDED: RoHS status] |
| Temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| Refresh | Auto-refresh and self-refresh | — |
| Typical Applications | PC/server main memory, embedded solder-down memory | — |
| Interfaz | — | Parallel |
| Clock Frequency | — | 1.6 GHz (DDR4-3200, 3200 MT/s data rate) |
| Clock Cycle Time | — | 19 ns class (-062E speed grade) |
| Temperature Grade | — | Automotive (AUT) |
| Access Time (CAS Latency class) | — | DDR4-3200 timing class (tAA per datasheet) |
| Bank Group Architecture | — | Yes (DDR4 bank groups) |
| Termination | — | On-Die Termination (ODT) |
| CA Parity | — | Supported (DDR4 command/address parity) |
| Packaging Option | — | Tape and Reel (TR / :R suffix) |
| Rango de temperatura de funcionamiento | — | [DATA_NEEDED: operating temperature range] |
| Refresh Rate | — | [DATA_NEEDED: refresh rate] |