H5TC4G63AFR-PBA vs H5TC4G63AFR-PBJ Comparación
Comparación detallada lado a lado de H5TC4G63AFR-PBA por SK hynix y H5TC4G63AFR-PBJ por SK hynix. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | H5TC4G63AFR-PBA | H5TC4G63AFR-PBJ |
|---|---|---|
| Marca | SK hynix | SK hynix |
| Categoría | Memory ICs | Memory ICs |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $3,98 | $7,50 |
| Tipo de memoria | DDR3L SDRAM | DDR3L SDRAM |
| Density | 4Gb | — |
| Organización de memoria | 256M x 16 | — |
| Supply Voltage (VDD/VDDQ) | 1.35V | — |
| Velocidad de datos | 1866 Mbps (PC3L-14900) | [DATA_NEEDED: Data rate (e.g., 1600 Mbps)] |
| Encapsulado | 96-ball FBGA | 96-ball TFBGA |
| Ball Pitch | 0.8mm | — |
| Number of Banks | 8 | — |
| Burst Length | 8 and 4 (with burst chop) | — |
| CAS Latency (CL) | 11, 12, 13 | — |
| Rango de temperatura de funcionamiento | 0°C to +95°C (Tcase) | — |
| Interfaz | 16-bit I/O | — |
| On-Die Termination (ODT) | Yes | — |
| ZQ Calibration | Yes | Yes |
| Write Leveling | Yes | Yes |
| Auto Self-Refresh | Yes | Yes |
| Partial Array Self-Refresh | Yes | — |
| RoHS | Compliant | — |
| Tamaño de memoria | — | 4 Gb (256M x 16) |
| Tensión de alimentación | — | 1.35 V |
| Temperature Grade | — | Industrial (-40°C to +95°C) |
| Refresh Cycles | — | 8192 |
| Package Shape | — | Rectangular |
| Number of Terminals | — | 96 |
| Latencia CAS | — | [DATA_NEEDED: CAS Latency] |
| Access Time | — | 0.225 ns (from H5TC4G63AFR-PBR datasheet) |
| Data Mask | — | Yes |
| Auto Precharge | — | Yes |
| Asynchronous Reset | — | Yes |
| Dynamic On-Chip Termination | — | Yes |
| Estado RoHS | — | [DATA_NEEDED: RoHS Status] |