IRFR9024NTRLPBF vs IRFR5505TRPBF Comparación
Comparación detallada lado a lado de IRFR9024NTRLPBF por Infineon y IRFR5505TRPBF por Infineon. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | IRFR9024NTRLPBF | IRFR5505TRPBF |
|---|---|---|
| Marca | Infineon | Infineon |
| Categoría | MOSFETs | MOSFETs |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $0,32 | $0,48 |
| Polarity | P-Channel | P-Channel |
| MOSFET Operating Mode | Enhancement | — |
| Drain-Source Voltage (VDS) | -55 V | — |
| Continuous Drain Current (ID) at TC=25C | -11 A | -18 A |
| On-Resistance RDS(on) max at VGS=-10V | 175 mOhm | 110 mOhm |
| Gate-Source Voltage (VGS) max | +/-20 V | +/-20 V |
| Power Dissipation (PD) at TC=25C | 38 W | — |
| Gate Charge (Qg) typical | 12.7 nC | — |
| Package Type | TO-252AA (DPAK) | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Recuento de pines | 3 (Drain, Gate, Source + Tab) | — |
| Technology | HEXFET (Generation 5) | IR MOSFET (HEXFET 5th generation) |
| Rango de temperatura de funcionamiento | -55C to +175C | — |
| Lead-Free / RoHS | Yes (LPBF suffix) | — |
| Reel Orientation | Left (TRL suffix) | — |
| Manufacturer | — | Infineon Technologies (formerly International Rectifier) |
| Series | — | HEXFET |
| Drain-Source Voltage (VDS) max | — | -55 V |
| Pulsed Drain Current (IDM) | — | -72 A |
| Total Gate Charge (Qg) | — | 21.3 nC |
| Gate-Source Charge (Qgs) | — | [DATA_NEEDED: Qgs] |
| Gate-Drain Charge (Qgd) | — | [DATA_NEEDED: Qgd] |
| Input Capacitance (Ciss) | — | [DATA_NEEDED: Ciss] |
| Output Capacitance (Coss) | — | [DATA_NEEDED: Coss] |
| Rise Time (tr) | — | [DATA_NEEDED: tr] |
| Fall Time (tf) | — | [DATA_NEEDED: tf] |
| Maximum Power Dissipation (PD) at TC=25C | — | 57 W |
| Temperatura de unión de funcionamiento | — | -55 C to +175 C |
| Thermal Resistance Junction-to-Case (RthJC) | — | 2.2 C/W |
| Thermal Resistance Junction-to-Ambient (RthJA) | — | 50 C/W (typical, DPAK on 1 oz copper) |
| Encapsulado | — | TO-252AA (DPAK), surface mount |
| Estado RoHS | — | Compliant (PBF suffix) |
| Lead-Free | — | Yes (PBF suffix) |