LPC55S69JBD100K vs MCXN556TCDFT Comparación

Comparación detallada lado a lado de LPC55S69JBD100K por NXP Semiconductors y MCXN556TCDFT por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.

NXP Semiconductors
LPC55S69JBD100K LPC55S69JBD100K - Dual Cortex-M33 150MHz MCU, 640KB Flash | NXP

LPC55S69JBD100K - Dual Cortex-M33 150MHz MCU, 640KB Flash | NXP

LPC55S69JBD100K ✓ Activo
NXP Semiconductors
MCXN556TCDFT MCXN556TCDFT - MCX N556 MCU 184MHz 250KB VFBGA-184 | NXP

MCXN556TCDFT - MCX N556 MCU 184MHz 250KB VFBGA-184 | NXP

MCXN556TCDFT ✓ Activo

Comparación de especificaciones

Parámetro LPC55S69JBD100K MCXN556TCDFT
Marca NXP Semiconductors NXP Semiconductors
Categoría Microcontrollers Microcontrollers
Estado del ciclo de vida Activo Activo
Estado del stock In Stock In Stock
Precio unitario (USD) $4,12 $5,22
Core Dual ARM Cortex-M33 (Armv8-M) —
Frecuencia de reloj máxima 150 MHz —
Flash Memory 640 KB (640K x 8) —
SRAM 320 KB —
Encapsulado 100-pin HLQFP (14x14 mm) VFBGA-184 (9 mm x 9 mm x 0.86 mm, 0.5 mm pitch)
Tipo de montaje Surface Mount Surface Mount
JEDEC Package Code S-PQFP-G100 —
Temperatura de funcionamiento -40C to +105C —
Tensión de alimentación [DATA_NEEDED: VDD range] 1.8 V to 3.6 V [DATA_NEEDED: exact VDD range from datasheet]
USB USB High-Speed with on-chip PHY —
Security TrustZone-M, secure boot, PRINCE, TRNG, CASPER —
Hardware Accelerators PowerQuad (DSP), CASPER (crypto) —
Communication Interfaces Flexcomm (USART/SPI/I2C/I2S), USB HS, SDIO, CAN-FD —
ADC [DATA_NEEDED: ADC channels and resolution] 12-bit [DATA_NEEDED: number of ADC channels, sample rate]
Estado RoHS Compliant Compliant [DATA_NEEDED: confirm per NXP product page]
Nivel MSL [DATA_NEEDED: MSL rating] [DATA_NEEDED: MSL classification per JEDEC J-STD-020]
GPIO Count [DATA_NEEDED: GPIO count] —
Core Architecture — Arm Cortex-M33 + Cortex-M0+ (dual-core)
Maximum Main Core Frequency — 250 MHz
Maximum Low-Power Core Frequency — 150 MHz
On-Chip SRAM — 250 KB
Ball Count — 184
Rango de temperatura de funcionamiento — -40C to +105C [DATA_NEEDED: confirm full operating range from datasheet]
Connectivity — USB, CAN-FD, I3C, FlexIO, UART, SPI, I2C [DATA_NEEDED: count of peripheral instances]
Security Features — Secure boot, cryptographic accelerators [DATA_NEEDED: confirm full security IP block list]
Series — MCX N (MCXN556)
Program Memory — [DATA_NEEDED: Flash size from datasheet]
Low-Power Modes — Multiple low-power states [DATA_NEEDED: full power-mode current values]

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