LPC55S69JBD100K vs MCXN556TCDFT Comparaison
Comparaison détaillée côte à côte de LPC55S69JBD100K par NXP Semiconductors et MCXN556TCDFT par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.
NXP Semiconductors
LPC55S69JBD100K - Dual Cortex-M33 150MHz MCU, 640KB Flash | NXP
LPC55S69JBD100K ✓ ActifComparaison des spécifications
| Paramètre | LPC55S69JBD100K | MCXN556TCDFT |
|---|---|---|
| Marque | NXP Semiconductors | NXP Semiconductors |
| Catégorie | Microcontrollers | Microcontrollers |
| Statut du cycle de vie | Actif | Actif |
| Statut du stock | In Stock | In Stock |
| Prix unitaire (USD) | $4,12 | $5,22 |
| Core | Dual ARM Cortex-M33 (Armv8-M) | — |
| Fréquence d'horloge maximale | 150 MHz | — |
| Flash Memory | 640 KB (640K x 8) | — |
| SRAM | 320 KB | — |
| Boîtier | 100-pin HLQFP (14x14 mm) | VFBGA-184 (9 mm x 9 mm x 0.86 mm, 0.5 mm pitch) |
| Type de montage | Surface Mount | Surface Mount |
| JEDEC Package Code | S-PQFP-G100 | — |
| Température de fonctionnement | -40C to +105C | — |
| Tension d'alimentation | [DATA_NEEDED: VDD range] | 1.8 V to 3.6 V [DATA_NEEDED: exact VDD range from datasheet] |
| USB | USB High-Speed with on-chip PHY | — |
| Security | TrustZone-M, secure boot, PRINCE, TRNG, CASPER | — |
| Hardware Accelerators | PowerQuad (DSP), CASPER (crypto) | — |
| Communication Interfaces | Flexcomm (USART/SPI/I2C/I2S), USB HS, SDIO, CAN-FD | — |
| ADC | [DATA_NEEDED: ADC channels and resolution] | 12-bit [DATA_NEEDED: number of ADC channels, sample rate] |
| Statut RoHS | Compliant | Compliant [DATA_NEEDED: confirm per NXP product page] |
| Niveau MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL classification per JEDEC J-STD-020] |
| GPIO Count | [DATA_NEEDED: GPIO count] | — |
| Core Architecture | — | Arm Cortex-M33 + Cortex-M0+ (dual-core) |
| Maximum Main Core Frequency | — | 250 MHz |
| Maximum Low-Power Core Frequency | — | 150 MHz |
| On-Chip SRAM | — | 250 KB |
| Ball Count | — | 184 |
| Plage de température de fonctionnement | — | -40C to +105C [DATA_NEEDED: confirm full operating range from datasheet] |
| Connectivity | — | USB, CAN-FD, I3C, FlexIO, UART, SPI, I2C [DATA_NEEDED: count of peripheral instances] |
| Security Features | — | Secure boot, cryptographic accelerators [DATA_NEEDED: confirm full security IP block list] |
| Series | — | MCX N (MCXN556) |
| Program Memory | — | [DATA_NEEDED: Flash size from datasheet] |
| Low-Power Modes | — | Multiple low-power states [DATA_NEEDED: full power-mode current values] |