LPC55S69JBD100K vs MCXN556TCDFT Comparaison

Comparaison détaillée côte à côte de LPC55S69JBD100K par NXP Semiconductors et MCXN556TCDFT par NXP Semiconductors. Comparez les spécifications clés, les paramètres électriques, le conditionnement, le statut de cycle de vie, les prix et la disponibilité pour déterminer le meilleur composant pour vos exigences de conception.

NXP Semiconductors
LPC55S69JBD100K LPC55S69JBD100K - Dual Cortex-M33 150MHz MCU, 640KB Flash | NXP

LPC55S69JBD100K - Dual Cortex-M33 150MHz MCU, 640KB Flash | NXP

LPC55S69JBD100K ✓ Actif
NXP Semiconductors
MCXN556TCDFT MCXN556TCDFT - MCX N556 MCU 184MHz 250KB VFBGA-184 | NXP

MCXN556TCDFT - MCX N556 MCU 184MHz 250KB VFBGA-184 | NXP

MCXN556TCDFT ✓ Actif

Comparaison des spécifications

Paramètre LPC55S69JBD100K MCXN556TCDFT
Marque NXP Semiconductors NXP Semiconductors
Catégorie Microcontrollers Microcontrollers
Statut du cycle de vie Actif Actif
Statut du stock In Stock In Stock
Prix unitaire (USD) $4,12 $5,22
Core Dual ARM Cortex-M33 (Armv8-M) —
Fréquence d'horloge maximale 150 MHz —
Flash Memory 640 KB (640K x 8) —
SRAM 320 KB —
Boîtier 100-pin HLQFP (14x14 mm) VFBGA-184 (9 mm x 9 mm x 0.86 mm, 0.5 mm pitch)
Type de montage Surface Mount Surface Mount
JEDEC Package Code S-PQFP-G100 —
Température de fonctionnement -40C to +105C —
Tension d'alimentation [DATA_NEEDED: VDD range] 1.8 V to 3.6 V [DATA_NEEDED: exact VDD range from datasheet]
USB USB High-Speed with on-chip PHY —
Security TrustZone-M, secure boot, PRINCE, TRNG, CASPER —
Hardware Accelerators PowerQuad (DSP), CASPER (crypto) —
Communication Interfaces Flexcomm (USART/SPI/I2C/I2S), USB HS, SDIO, CAN-FD —
ADC [DATA_NEEDED: ADC channels and resolution] 12-bit [DATA_NEEDED: number of ADC channels, sample rate]
Statut RoHS Compliant Compliant [DATA_NEEDED: confirm per NXP product page]
Niveau MSL [DATA_NEEDED: MSL rating] [DATA_NEEDED: MSL classification per JEDEC J-STD-020]
GPIO Count [DATA_NEEDED: GPIO count] —
Core Architecture — Arm Cortex-M33 + Cortex-M0+ (dual-core)
Maximum Main Core Frequency — 250 MHz
Maximum Low-Power Core Frequency — 150 MHz
On-Chip SRAM — 250 KB
Ball Count — 184
Plage de température de fonctionnement — -40C to +105C [DATA_NEEDED: confirm full operating range from datasheet]
Connectivity — USB, CAN-FD, I3C, FlexIO, UART, SPI, I2C [DATA_NEEDED: count of peripheral instances]
Security Features — Secure boot, cryptographic accelerators [DATA_NEEDED: confirm full security IP block list]
Series — MCX N (MCXN556)
Program Memory — [DATA_NEEDED: Flash size from datasheet]
Low-Power Modes — Multiple low-power states [DATA_NEEDED: full power-mode current values]

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