LPC55S69JBD100K vs MCXN556TCDFT Comparação

Comparação detalhada lado a lado de LPC55S69JBD100K por NXP Semiconductors e MCXN556TCDFT por NXP Semiconductors. Compare especificações principais, parâmetros elétricos, encapsulamento, status do ciclo de vida, preços e disponibilidade para determinar o melhor componente para os requisitos do seu projeto.

NXP Semiconductors
LPC55S69JBD100K LPC55S69JBD100K - Dual Cortex-M33 150MHz MCU, 640KB Flash | NXP

LPC55S69JBD100K - Dual Cortex-M33 150MHz MCU, 640KB Flash | NXP

LPC55S69JBD100K ✓ Ativo
NXP Semiconductors
MCXN556TCDFT MCXN556TCDFT - MCX N556 MCU 184MHz 250KB VFBGA-184 | NXP

MCXN556TCDFT - MCX N556 MCU 184MHz 250KB VFBGA-184 | NXP

MCXN556TCDFT ✓ Ativo

Comparação de especificações

Parâmetro LPC55S69JBD100K MCXN556TCDFT
Marca NXP Semiconductors NXP Semiconductors
Categoria Microcontrollers Microcontrollers
Status do ciclo de vida Ativo Ativo
Status do estoque In Stock In Stock
Preço unitário (USD) $4,12 $5,22
Core Dual ARM Cortex-M33 (Armv8-M) —
Frequência máxima de clock 150 MHz —
Flash Memory 640 KB (640K x 8) —
SRAM 320 KB —
Encapsulamento 100-pin HLQFP (14x14 mm) VFBGA-184 (9 mm x 9 mm x 0.86 mm, 0.5 mm pitch)
Tipo de montagem Surface Mount Surface Mount
JEDEC Package Code S-PQFP-G100 —
Temperatura de operação -40C to +105C —
Tensão de alimentação [DATA_NEEDED: VDD range] 1.8 V to 3.6 V [DATA_NEEDED: exact VDD range from datasheet]
USB USB High-Speed with on-chip PHY —
Security TrustZone-M, secure boot, PRINCE, TRNG, CASPER —
Hardware Accelerators PowerQuad (DSP), CASPER (crypto) —
Communication Interfaces Flexcomm (USART/SPI/I2C/I2S), USB HS, SDIO, CAN-FD —
ADC [DATA_NEEDED: ADC channels and resolution] 12-bit [DATA_NEEDED: number of ADC channels, sample rate]
Status RoHS Compliant Compliant [DATA_NEEDED: confirm per NXP product page]
Nível MSL [DATA_NEEDED: MSL rating] [DATA_NEEDED: MSL classification per JEDEC J-STD-020]
GPIO Count [DATA_NEEDED: GPIO count] —
Core Architecture — Arm Cortex-M33 + Cortex-M0+ (dual-core)
Maximum Main Core Frequency — 250 MHz
Maximum Low-Power Core Frequency — 150 MHz
On-Chip SRAM — 250 KB
Ball Count — 184
Faixa de temperatura de operação — -40C to +105C [DATA_NEEDED: confirm full operating range from datasheet]
Connectivity — USB, CAN-FD, I3C, FlexIO, UART, SPI, I2C [DATA_NEEDED: count of peripheral instances]
Security Features — Secure boot, cryptographic accelerators [DATA_NEEDED: confirm full security IP block list]
Series — MCX N (MCXN556)
Program Memory — [DATA_NEEDED: Flash size from datasheet]
Low-Power Modes — Multiple low-power states [DATA_NEEDED: full power-mode current values]

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