M7AFS600-1FGG256I vs AFS600-1FGG256 Comparación
Comparación detallada lado a lado de M7AFS600-1FGG256I por Microchip Technology y AFS600-1FGG256 por Microchip Technology. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Microchip Technology
M7AFS600-1FGG256I - Fusion FPGA 600K Gates ARM CoreMP7 | Microchip
M7AFS600-1FGG256I ✓ ActivoMicrochip Technology
AFS600-1FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip
AFS600-1FGG256 ✓ ActivoComparación de especificaciones
| Parámetro | M7AFS600-1FGG256I | AFS600-1FGG256 |
|---|---|---|
| Marca | Microchip Technology | Microchip Technology |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Activo | Activo |
| Family | Fusion (Mixed-Signal Flash FPGA) | — |
| System Gates | 600K | 600,000 gates |
| Processor Core | ARM CoreMP7 | — |
| Number of I/O | 119 | — |
| Tensión de alimentación de funcionamiento | 1.5 V | — |
| Process Technology | 130 nm, 7-layer metal flash-based CMOS | 130 nm CMOS |
| Configuration Memory | Flash (nonvolatile) | Embedded nonvolatile flash |
| System Performance | Up to 350 MHz | — |
| Speed Grade | -1 | — |
| Minimum Operating Temperature | -40 C | — |
| Maximum Operating Temperature | +85 C | — |
| Encapsulado / Carcasa | 256-Ball FBGA (FGG256) | — |
| Estilo de montaje | SMD/SMT | — |
| Packaging | Tray | — |
| Series | M7AFS600 | — |
| Live at Power-Up (LAPU) | Yes | — |
| Estado RoHS | [DATA_NEEDED: RoHS status] | RoHS compliant |
| Analog Subsystem | Integrated ADC, voltage/temperature monitors (per Fusion family datasheet) | — |
| User I/O | — | 119 I/O |
| Tensión de alimentación | — | 1.5 V |
| Logic Family | — | Flash-based CMOS |
| Metal Layers | — | 7 layers |
| Package Type | — | 256-ball FBGA |
| Package Pin Count | — | 256 balls |
| Package Pitch | — | 1.0 mm |
| Temperatura de funcionamiento | — | 0°C to 70°C |
| Power-Up Configuration | — | Live at power-up |
| Integrated Analog Resources | — | Configurable analog blocks |
| Integrated Clock Management | — | Clock generation and management |
| Embedded Memory | — | Large flash memory blocks |
| Package Family | — | FBGA surface-mount package family |
| Lead-Free Status | — | Lead-free |
| Pin Assignments | — | [DATA_NEEDED: complete AFS600-1FGG256 pin assignments] |
| Maximum Operating Frequency | — | [DATA_NEEDED: maximum operating frequency] |