M7AFS600-1FGG256I vs AFS600-1FGG256 비교

다음의 상세 나란히 비교: M7AFS600-1FGG256I 제조: Microchip Technology 및 AFS600-1FGG256 제조: Microchip Technology. 주요 사양, 전기적 파라미터, 패키징, 수명 주기 상태, 가격 및 재고를 비교하여 설계 요구 사항에 가장 적합한 부품을 결정하십시오.

Microchip Technology
M7AFS600-1FGG256I M7AFS600-1FGG256I - Fusion FPGA 600K Gates ARM CoreMP7 | Microchip

M7AFS600-1FGG256I - Fusion FPGA 600K Gates ARM CoreMP7 | Microchip

M7AFS600-1FGG256I ✓ 활성
Microchip Technology
AFS600-1FGG256 AFS600-1FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-1FGG256 - 600K-Gate Mixed-Signal FPGA | Microchip

AFS600-1FGG256 ✓ 활성

사양 비교

파라미터 M7AFS600-1FGG256I AFS600-1FGG256
브랜드 Microchip Technology Microchip Technology
카테고리 FPGA & CPLD FPGA & CPLD
수명 주기 상태 활성 활성
Family Fusion (Mixed-Signal Flash FPGA) —
System Gates 600K 600,000 gates
Processor Core ARM CoreMP7 —
Number of I/O 119 —
동작 공급 전압 1.5 V —
Process Technology 130 nm, 7-layer metal flash-based CMOS 130 nm CMOS
Configuration Memory Flash (nonvolatile) Embedded nonvolatile flash
System Performance Up to 350 MHz —
Speed Grade -1 —
Minimum Operating Temperature -40 C —
Maximum Operating Temperature +85 C —
패키지 / 케이스 256-Ball FBGA (FGG256) —
장착 스타일 SMD/SMT —
Packaging Tray —
Series M7AFS600 —
Live at Power-Up (LAPU) Yes —
RoHS 상태 [DATA_NEEDED: RoHS status] RoHS compliant
Analog Subsystem Integrated ADC, voltage/temperature monitors (per Fusion family datasheet) —
User I/O — 119 I/O
공급 전압 — 1.5 V
Logic Family — Flash-based CMOS
Metal Layers — 7 layers
Package Type — 256-ball FBGA
Package Pin Count — 256 balls
Package Pitch — 1.0 mm
동작 온도 — 0°C to 70°C
Power-Up Configuration — Live at power-up
Integrated Analog Resources — Configurable analog blocks
Integrated Clock Management — Clock generation and management
Embedded Memory — Large flash memory blocks
Package Family — FBGA surface-mount package family
Lead-Free Status — Lead-free
Pin Assignments — [DATA_NEEDED: complete AFS600-1FGG256 pin assignments]
Maximum Operating Frequency — [DATA_NEEDED: maximum operating frequency]

데이터시트 & 자료

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