MPC8572VTAVNE - PowerPC e500 Dual-Core 1.5GHz SoC | NXP | FCBGA-1023
N.º de pieza: MPC8572VTAVNE ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $425 | $425,00 |
| 10 | $395 | $3.950,00 |
| 100 | $360 | $36.000,00 |
| 500 | $332 | $166.000,00 |
| 1.000 | $308 | $308.000,00 |
MPC8572VTAVNE Descripción general
A communications SoC (System-on-Chip) of this class integrates one or more general-purpose CPU cores, a high-throughput memory subsystem, and a flexible I/O fabric on a single die. Within the broader taxonomy, the MPC8572VTAVNE is a member of the microprocessor family (MPU), a subclass of integrated circuits, and is specifically targeted at data-plane and control-plane workloads where a single chip must terminate multiple high-speed serial links. The PowerQUICC III lineage from NXP is the third generation of the PowerQUICC architecture, designed for symmetric and asymmetric multi-core systems in networking infrastructure.
Key differentiating features include dual e500 cores with separate L1 caches, hardware table lookup and pattern-matching accelerators used for packet classification, support for DDR2 and DDR3 memory controllers with ECC, three PCI Express interfaces, dual Gigabit Ethernet MACs, Serial RapidIO (SRIO), and an integrated security engine. The 1023-ball FCBGA package exposes the full set of high-speed serial links and parallel memory buses needed for backplane routing, while a dedicated local bus controller can interface to legacy Flash and peripherals.
Architecturally, the MPC8572VTAVNE relies on the Power Architecture Book E instruction set, augmented by the Signal Processing Engine (SPE) for SIMD-style DSP operations, and a coherent CoreNet platform fabric that ties the cores, L2, and I/O together with hardware snoop and coherency. Compared with general-purpose CPUs, this design is optimized for predictable interrupt latency, DMA-driven packet movement, and tight integration with networking peripherals - which is why it has historically been preferred for line-card SoCs in switches and routers.
Typical applications include enterprise switching and routing line cards, LTE and WiMAX base-station baseband processing, industrial control and factory automation controllers, military and aerospace ruggedized networking, and storage-area network (SAN) controllers. The wide I/O mix also makes it a frequent choice for medical imaging and high-end embedded instrumentation.
When designing with this part, ensure the PCB has a sufficient copper pour and via hole stitching beneath the FCBGA land pattern to meet the 1023-ball thermal dissipation requirement; the 1.1 V core rail demands a low-noise multi-phase regulator. Avoid signal routing under the package and place the DDR2/DDR3 memory as close as possible to the controller pins to maintain timing margins.
This page synthesizes distributor stock levels, official NXP documentation, and a same-package cross-reference list that is not aggregated anywhere else, providing engineers a one-stop view for MPC8572VTAVNE selection, sourcing, and lifecycle planning.
Alternativas directas para MPC8572VTAVNE — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MPC8572VTAVNE (mismo factor de forma y huella) — difiere en Core Architecture, Memory Controller, Package, Ethernet, Operating Temperature.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MPC8572EVTAVNE
✅ Sustitución directa✓ En stock
$125 / unidad
Ver hoja de datos →MPC8572ELVTAVND
✅ Sustitución directa✓ En stock
$198 / unidad
Ver hoja de datos →MPC8572VTAVND
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8572EVTATLD
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MPC8572ECVTAVNE
✅ Sustitución directa✓ En stock
$308.55 / unidad
Ver hoja de datos →MPC8572VTAVNE Valores máximos y características eléctricas
| Manufacturer | NXP Semiconductors (formerly Freescale) |
| Core Architecture | PowerPC e500 (Book E, with SPE/APU) |
| Number of Cores | 2 |
| Core Clock Frequency (max) | 1.5 GHz |
| Rango de temperatura de funcionamiento | 0 C to +105 C |
| Core Voltage | 1.1 V |
| L2 Cache | 1 MB (shared) |
| Memory Controller | DDR2 / DDR3 with ECC |
| PCI Express | 3 x PCIe interfaces |
| Ethernet MAC | 2 x 10/100/1000 Mbps (Triple Speed) |
| Serial RapidIO | Yes |
| Security Engine | Integrated |
| Encapsulado | 1023-ball FCBGA, 33 mm x 33 mm |
| Tipo de montaje | Surface Mount (BGA) |
| Estado RoHS | compliant |
| Product Family | PowerQUICC III (MPC85xx) |
Guía de configuración de pines de MPC8572VTAVNE 1023-ball fcbga, 33 mm x 33 mm
Configuración de pines para MPC8572VTAVNE (encapsulado 1023-ball fcbga, 33 mm x 33 mm). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MPC8572VTAVNE.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MPC8572VTAVNE es adecuado para 6 aplicacións: Enterprise Switching and Routing Line Cards, LTE and WiMAX Base Station Baseband, Industrial Control and Factory Automation, Storage Area Network (SAN) and RAID Controllers, Military and Aerospace Ruggedized Networking, Medical Imaging and High-End Embedded Instrumentation.
Enterprise Switching and Routing Line Cards
The MPC8572VTAVNE's dual 1.5 GHz PowerPC e500 cores and three PCI Express interfaces make it ideal for line cards in enterprise switches and routers. The cores run forwarding tables, ACLs, and routing protocols, while the integrated Triple-Speed Gigabit Ethernet MACs terminate multiple copper or SGMII uplinks without an external PHY controller. Hardware pattern-matching engines accelerate IPsec and packet classification at line rate, while the 1023-ball FCBGA exposes full 64-bit DDR2/DDR3 with ECC for routing-table memory. Compared with a discrete CPU-plus-NPU design, this SoC reduces BOM, PCB area, and certification cost for a multi-gigabit line card.
Recomendado
LTE and WiMAX Base Station Baseband
Wireless base-station baseband processing demands deterministic packet throughput, hardware-accelerated encryption, and high-bandwidth memory. The MPC8572VTAVNE delivers all three: dual e500 cores run Layer 2/3 stack and MAC scheduling, the Signal Processing Engine (SPE) accelerates FFT and turbo-decoding primitives, and the integrated security engine terminates IPsec traffic to the core network. The 1 MB shared L2 cache and 64-bit DDR2/DDR3 controller with ECC handle the high packet-rate bursts typical of LTE PHY layer queues. Serial RapidIO connects cleanly to DSP clusters or RF front-end cards without an external bridge.
Recomendado
Industrial Control and Factory Automation
Factory automation controllers require deterministic real-time response, deterministic Ethernet, and a robust operating temperature range. The MPC8572VTAVNE's two e500 cores can be partitioned between a real-time control loop (VxWorks or QNX) and an HMI or scripting engine, sharing memory through the coherent CoreNet fabric. Dual Gigabit Ethernet MACs support deterministic protocols such as EtherCAT, Profinet, or TSN bridges via external PHYs. The 0 to +105 C extended commercial temperature rating, plus ECC-protected memory, supports long-life factory-floor installations where downtime is costly.
Recomendado
Storage Area Network (SAN) and RAID Controllers
External RAID controllers and SAN fabric switches need high-throughput DMA, ECC-protected memory, and multiple high-speed serial links. The MPC8572VTAVNE's three PCI Express interfaces map directly to a SAS/SATA HBA, an FC HBA, and an external management link, while the Serial RapidIO port provides an alternative fabric for tightly-coupled storage clustering. ECC on the DDR2/DDR3 controller protects against silent bit errors that would otherwise corrupt large-capacity storage arrays. The dual e500 cores run a real-time I/O scheduler and management UI simultaneously.
Recomendado
Military and Aerospace Ruggedized Networking
Defense and aerospace networking systems need long lifecycle, extended temperature operation, and high-bandwidth deterministic processing. The MPC8572VTAVNE is qualified for 0 to +105 C operation, with the MPC8572ELVTAVND variant pushing this to -40 to +105 C for harsher platforms. The FCBGA package is compatible with PCB staking and underfill processes used for vibration resistance. Its hardware encryption accelerators offload AES, DES, and SHA workloads from the cores, freeing CPU cycles for protocol processing and situational-awareness tasks on tactical networks.
Recomendado
Medical Imaging and High-End Embedded Instrumentation
Ultrasound and CT imaging systems need high-throughput data acquisition, real-time DSP, and reliable data links to a host PC. The MPC8572VTAVNE combines dual 1.5 GHz e500 cores with the Signal Processing Engine, allowing beamforming and reconstruction algorithms to be partitioned efficiently across cores. The three PCI Express interfaces connect to FPGAs or analog front-end digitizers, and the dual Gigabit Ethernet MACs stream processed images to the host at line rate. ECC memory protects diagnostic integrity, while the FCBGA package simplifies thermal management in compact enclosures.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MPC8572VTAVNE — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MPC8572EVTAVNE | MPC8572ELVTAVND | MPC8572VTAVND | MPC8572ECVTAVNE |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 1023-FCBGA (33x33) | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same | 1023-FCBGA (33x33) - same |
| Core Architecture | PowerPC e500 dual-core | PowerPC e500 dual-core (same) | PowerPC e500 dual-core (same) | PowerPC e500 dual-core (same) | PowerPC e500 dual-core (same) |
| Core Clock Frequency (max) | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz | 1.5 GHz |
| L2 Cache | 1 MB (shared) | 1 MB (shared) | 1 MB (shared) | 1 MB (shared) | 1 MB (shared) |
| Security Engine | Integrated SEC 3.x | Enhanced SEC 4.x (improved) | Enhanced SEC 4.x (improved) | Integrated SEC 3.x (same) | Encryption-disabled 'C' variant |
| Operating Temperature | 0 C to +105 C | 0 C to +105 C | -40 C to +105 C (industrial) | 0 C to +105 C | 0 C to +105 C |
| PCI Express Interfaces | 3 | 3 | 3 | 3 | 3 |
| DDR Memory Controller | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC | DDR2/DDR3 with ECC |
Diferenciadores clave
- Enhanced security engine in the E variant (frente a MPC8572EVTAVNE)
- Industrial temperature grade with ECC in the ELVTAVND variant (frente a MPC8572ELVTAVND)
- Encryption-disabled 'C' revision variant for export-controlled designs (frente a MPC8572ECVTAVNE)
Notas de diseño
Estimated: the 1023-ball FCBGA at 33 x 33 mm has a typical theta_JA in the 8-12 C/W range when mounted on a 4-layer JEDEC test PCB. At full dual-core 1.5 GHz operation the part dissipates approximately 12-15 W; ensure at least 1 oz copper planes plus thermal vias under the die, and consider a small heatsink or forced airflow for fanless enclosures. Junction temperature must stay below 105 C to match the operating spec.
Use a 0.4 mm ball-pitch escape pattern with 0.4 mm laser-drilled microvias in a sequential lamination stack-up. The FCBGA land pads must be NSMD (Non-Solder Mask Defined) per JEDEC recommendations for fine-pitch BGA to reduce pad cracking. Match the DDR2/DDR3 trace lengths to within 50 mils and place the memory chips within 50 mm of the SoC for clean signal integrity.
The 1.1 V core rail should be supplied by a multi-phase buck regulator with at least 20 A peak capability. Use 22 uF X5R ceramic bulk plus 470 uF polymer bulk decoupling at the FCBGA. The DDR termination rail (VTT) needs to track VDDQ within +/-50 mV; a dedicated VTT LDO is recommended. Decouple every supply pin with a 100 nF X7R cap as close to the ball as layout allows.
Do not route high-speed SERDES (PCIe, SRIO, SGMII) signals under the FCBGA or across reference plane splits - this destroys signal integrity and causes link training failures. Always boot from a NAND Flash or NOR Flash image verified on the actual board rev; the MPC8572VTAVNE does not have internal ROM, so an invalid boot image causes silent no-boot. Confirm the board's RCW (Reset Configuration Word) matches your boot source selection.
Place the 125 MHz system reference clock oscillator within 5 cm of the MPC8572VTAVNE clock inputs, guarded by a continuous GND plane and routed length-matched to other clocks. Use 4-mil 50-ohm controlled-impedance traces for PCIe and SGMII SERDES, with ground stitching vias every 200 mils. Match intra-pair skew to within 5 mils and inter-pair skew to within 20 mils for proper eye margins.
Información de cumplimiento
RoHS and REACH compliance per NXP product page. Not AEC-Q100 qualified - this part is intended for networking and industrial applications, not automotive. Halogen-free status was not confirmed in the Verified Web Data and is listed as unknown.
