RMLV0816BGSD-4S2 vs RMLV0816BGSD-4S2#AC0 Comparación
Comparación detallada lado a lado de RMLV0816BGSD-4S2 por Renesas Electronics y RMLV0816BGSD-4S2#AC0 por Renesas Electronics. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Renesas Electronics
RMLV0816BGSD-4S2 - 8Mb Low-Power SRAM 512Kx16 45ns TSOP | Renesas
RMLV0816BGSD-4S2 ✓ ActivoRenesas Electronics
RMLV0816BGSD-4S2#AC0 - 8Mb Advanced LPSRAM | Renesas | TSOP-II 52
RMLV0816BGSD-4S2#AC0 ✓ ActivoComparación de especificaciones
| Parámetro | RMLV0816BGSD-4S2 | RMLV0816BGSD-4S2#AC0 |
|---|---|---|
| Marca | Renesas Electronics | Renesas Electronics |
| Categoría | Memory ICs | Memory ICs |
| Estado del ciclo de vida | Activo | Activo |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $2,50 | $3,78 |
| Tipo de memoria | Static RAM (SRAM), Asynchronous | Volatile SRAM (LPSRAM) |
| Memory Subcategory | Low-Power SRAM (LPSRAM) | — |
| Memory Density | 8 Mbit | — |
| Organización de memoria | 524,288-word x 16-bit (512K x 16) | 524,288-word × 16-bit (configurable to 1M × 8) |
| Supply Voltage (VCC) | 2.7 V to 3.6 V | 2.4 V to 3.6 V |
| Access Time | 45 ns | 45 ns |
| Interfaz | Parallel (asynchronous) | — |
| Rango de temperatura de funcionamiento | -40 C to +85 C (industrial) | -40 °C to +85 °C |
| Encapsulado | 52-pin TSOP-II | — |
| Tipo de montaje | Surface Mount | Surface Mount |
| Output Enable (/OE) | Yes | — |
| Write Enable (/WE) | Yes | — |
| Chip Select (/CS) | Yes | — |
| Byte Control | /LB and /UB (lower/upper byte enable) | UB# (upper byte), LB# (lower byte) |
| I/O Compatibility | TTL-compatible | — |
| Standby Current | [DATA_NEEDED: standby current] | — |
| Active Current | [DATA_NEEDED: operating current] | — |
| Process Technology | Renesas Advanced LPSRAM CMOS | Renesas Advanced LPSRAM CMOS |
| Estado RoHS | Compliant | Compliant |
| Nivel MSL | 3 (per JEDEC J-STD-020, typical for TSOP-II) | MSL3 (per JEDEC J-STD-020, where stated in the datasheet) |
| Tamaño de memoria | — | 8 Mbit |
| Bus Width | — | Parallel, 8-bit or 16-bit |
| Tipo de interfaz | — | Parallel (asynchronous) |
| Package Type | — | 52-TSOP II |
| Configuración de salida | — | Three-state (with OE# control) |
| Write Control | — | WE# (active-low) |
| Chip Enable | — | CE# (active-low) |
| Data Retention Voltage (typical) | — | 2.0 V [DATA_NEEDED: confirm from datasheet retention section] |