RMLV0816BGSD-4S2 vs RMLV0816BGSD-4S2#AC0 对比

详细并排对比 RMLV0816BGSD-4S2 出自 Renesas Electronics 和 RMLV0816BGSD-4S2#AC0 出自 Renesas Electronics。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Renesas Electronics
RMLV0816BGSD-4S2 RMLV0816BGSD-4S2 - 8Mb Low-Power SRAM 512Kx16 45ns TSOP | Renesas

RMLV0816BGSD-4S2 - 8Mb Low-Power SRAM 512Kx16 45ns TSOP | Renesas

RMLV0816BGSD-4S2 ✓ 量产中
Renesas Electronics
RMLV0816BGSD-4S2#AC0 RMLV0816BGSD-4S2#AC0 - 8Mb Advanced LPSRAM | Renesas | TSOP-II 52

RMLV0816BGSD-4S2#AC0 - 8Mb Advanced LPSRAM | Renesas | TSOP-II 52

RMLV0816BGSD-4S2#AC0 ✓ 量产中

规格对比

参数 RMLV0816BGSD-4S2 RMLV0816BGSD-4S2#AC0
品牌 Renesas Electronics Renesas Electronics
分类 Memory ICs Memory ICs
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $2.50 $3.78
存储器类型 Static RAM (SRAM), Asynchronous Volatile SRAM (LPSRAM)
Memory Subcategory Low-Power SRAM (LPSRAM) —
Memory Density 8 Mbit —
存储组织 524,288-word x 16-bit (512K x 16) 524,288-word × 16-bit (configurable to 1M × 8)
Supply Voltage (VCC) 2.7 V to 3.6 V 2.4 V to 3.6 V
Access Time 45 ns 45 ns
接口 Parallel (asynchronous) —
工作温度范围 -40 C to +85 C (industrial) -40 °C to +85 °C
封装 52-pin TSOP-II —
安装类型 Surface Mount Surface Mount
Output Enable (/OE) Yes —
Write Enable (/WE) Yes —
Chip Select (/CS) Yes —
Byte Control /LB and /UB (lower/upper byte enable) UB# (upper byte), LB# (lower byte)
I/O Compatibility TTL-compatible —
Standby Current [DATA_NEEDED: standby current] —
Active Current [DATA_NEEDED: operating current] —
Process Technology Renesas Advanced LPSRAM CMOS Renesas Advanced LPSRAM CMOS
RoHS 状态 Compliant Compliant
MSL 等级 3 (per JEDEC J-STD-020, typical for TSOP-II) MSL3 (per JEDEC J-STD-020, where stated in the datasheet)
存储容量 — 8 Mbit
Bus Width — Parallel, 8-bit or 16-bit
接口类型 — Parallel (asynchronous)
Package Type — 52-TSOP II
输出配置 — Three-state (with OE# control)
Write Control — WE# (active-low)
Chip Enable — CE# (active-low)
Data Retention Voltage (typical) — 2.0 V [DATA_NEEDED: confirm from datasheet retention section]

数据手册与资源

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