S912XEG128BMAA vs MC9S12XDT512MAA Comparación
Comparación detallada lado a lado de S912XEG128BMAA por NXP Semiconductors y MC9S12XDT512MAA por NXP Semiconductors. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | S912XEG128BMAA | MC9S12XDT512MAA |
|---|---|---|
| Marca | NXP Semiconductors | NXP Semiconductors |
| Categoría | Microcontrollers | Microcontrollers |
| Estado del ciclo de vida | Activo | NRND |
| Estado del stock | In Stock | In Stock |
| Precio unitario (USD) | $9,85 | $0,00 |
| Core Processor | HCS12X | HCS12X |
| Core Size | 16-bit | 16-Bit |
| Core Architecture | CISC with XGATE co-processor | — |
| Operating Frequency (Bus Speed) | 50 MHz | — |
| Program Memory Size | 128 KB (128K x 8) Flash | 512KB (512K x 8) |
| Program Memory Type | Flash with hardware-emulated EEPROM | FLASH |
| RAM Size | [DATA_NEEDED: RAM size] | 20KB |
| EEPROM (Emulated) | Up to 4 KB (hardware-emulated) | — |
| Number of I/O Pins | 59 | — |
| Tensión de alimentación | 3.3 V / 5 V dual-voltage | [DATA_NEEDED: supply voltage range] |
| Rango de temperatura de funcionamiento | -40 °C to +125 °C (automotive grade) | — |
| Encapsulado | 80-QFP (14x14 mm), PQFP, tray | 80-QFP (14x14 mm), Square, Gull Wing |
| Connectivity | CANbus, EBI/EMI, I²C, IrDA, SCI, SPI | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI |
| ADC | 12-bit, 3 µs conversion time | — |
| Peripherals | LVD, POR, PWM, WDT, ECT, PIT, RTI | LVD, POR, PWM, WDT |
| Tipo de montaje | Surface Mount (gull-wing leads) | Surface Mount |
| Nivel MSL | 3 (per JEDEC J-STD-020, typical for QFP) | — |
| Estado RoHS | Compliant | — |
| AEC-Q100 Qualification | Automotive qualified | — |
| Maximum Clock Speed | — | 80 MHz |
| EEPROM Size | — | 4KB |
| Number of I/O | — | 59 |
| ADC Resolution | — | 10-bit, 8-channel |
| Temperatura de funcionamiento | — | -40C to +125C (TA) |
| Packaging Method | — | Tray |
| Sin halógenos | — | Compliant |
| ECCN | — | 3A991.a.2 |
| Estimated EOL Date | — | 2028 |