S912XEG128BMAA vs MC9S12XDT512MAA Vergleich

Detaillierter Direktvergleich von S912XEG128BMAA von NXP Semiconductors und MC9S12XDT512MAA von NXP Semiconductors. Vergleichen Sie die wichtigsten Spezifikationen, elektrischen Parameter, Gehäuse, Lebenszyklusstatus, Preise und Verfügbarkeit, um das beste Bauteil für Ihre Designanforderungen zu ermitteln.

NXP Semiconductors
S912XEG128BMAA S912XEG128BMAA - 16-bit 50MHz S12X MCU 128KB Flash | NXP

S912XEG128BMAA - 16-bit 50MHz S12X MCU 128KB Flash | NXP

S912XEG128BMAA ✓ Aktiv
NXP Semiconductors
MC9S12XDT512MAA MC9S12XDT512MAA - 16-bit 80MHz HCS12X MCU 512KB | NXP

MC9S12XDT512MAA - 16-bit 80MHz HCS12X MCU 512KB | NXP

MC9S12XDT512MAA Nrnd

Spezifikationsvergleich

Parameter S912XEG128BMAA MC9S12XDT512MAA
Marke NXP Semiconductors NXP Semiconductors
Kategorie Microcontrollers Microcontrollers
Lebenszyklusstatus Aktiv NRND
Lagerstatus In Stock In Stock
Stückpreis (USD) $9,85 $0,00
Core Processor HCS12X HCS12X
Core Size 16-bit 16-Bit
Core Architecture CISC with XGATE co-processor —
Operating Frequency (Bus Speed) 50 MHz —
Program Memory Size 128 KB (128K x 8) Flash 512KB (512K x 8)
Program Memory Type Flash with hardware-emulated EEPROM FLASH
RAM Size [DATA_NEEDED: RAM size] 20KB
EEPROM (Emulated) Up to 4 KB (hardware-emulated) —
Number of I/O Pins 59 —
Versorgungsspannung 3.3 V / 5 V dual-voltage [DATA_NEEDED: supply voltage range]
Betriebstemperaturbereich -40 °C to +125 °C (automotive grade) —
Gehäuse 80-QFP (14x14 mm), PQFP, tray 80-QFP (14x14 mm), Square, Gull Wing
Connectivity CANbus, EBI/EMI, I²C, IrDA, SCI, SPI CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI
ADC 12-bit, 3 µs conversion time —
Peripherals LVD, POR, PWM, WDT, ECT, PIT, RTI LVD, POR, PWM, WDT
Montageart Surface Mount (gull-wing leads) Surface Mount
MSL-Level 3 (per JEDEC J-STD-020, typical for QFP) —
RoHS-Status Compliant —
AEC-Q100 Qualification Automotive qualified —
Maximum Clock Speed — 80 MHz
EEPROM Size — 4KB
Number of I/O — 59
ADC Resolution — 10-bit, 8-channel
Betriebstemperatur — -40C to +125C (TA)
Packaging Method — Tray
Halogenfrei — Compliant
ECCN — 3A991.a.2
Estimated EOL Date — 2028

Datenblätter & Ressourcen

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