XA3S50-4PQG208Q vs XA3S50-4PQG208I Comparación
Comparación detallada lado a lado de XA3S50-4PQG208Q por AMD y XA3S50-4PQG208I por Xilinx. Compare las especificaciones clave, los parámetros eléctricos, el encapsulado, el estado del ciclo de vida, los precios y la disponibilidad para determinar el mejor componente para los requisitos de su diseño.
Comparación de especificaciones
| Parámetro | XA3S50-4PQG208Q | XA3S50-4PQG208I |
|---|---|---|
| Marca | AMD | Xilinx |
| Categoría | FPGA & CPLD | FPGA & CPLD |
| Estado del ciclo de vida | Obsolete | Activo |
| Device Type | Field Programmable Gate Array (FPGA) | Spartan-3A automotive field-programmable gate array (FPGA) |
| FPGA Family | Spartan-3 XA | — |
| System Gates | 50,000 gates | 50,000 gates |
| Configurable Logic Blocks | 192 CLBs | 192 CLBs |
| Logic Cells | 1,728 logic cells | 1,728 logic elements |
| Maximum Operating Frequency | 125 MHz | — |
| User I/O Pins | 124 I/O | — |
| On-Chip RAM | 73,728 bits | — |
| Tensión de alimentación | 1.2 V | — |
| Maximum Data Transfer Rate per I/O | 622 Mb/s | — |
| Single-Ended I/O Standards | 17 standards | 17 standards |
| Differential I/O Standards | 7 standards | 7 standards, including LVDS |
| Differential I/O Support | LVDS | — |
| On-Chip Termination | Digitally Controlled | — |
| Encapsulado | 208-pin PQFP | 208-pin PQFP plastic quad flat package |
| Package Pin Pitch | 0.50 mm | — |
| Terminal Form | Gull wing | — |
| Package Shape | Square | — |
| Automotive Qualification | AEC-Q100 qualified | AEC-Q100 automotive-grade designation reported in verified source data |
| Rango de temperatura de funcionamiento | [DATA_NEEDED: operating temperature range] | — |
| Configuration Memory | [DATA_NEEDED: configuration memory type] | — |
| Static Power | [DATA_NEEDED: static power] | — |
| Dynamic Power | [DATA_NEEDED: dynamic power] | — |
| Total RAM Bits | — | 73,728 bits |
| User I/O | — | 124 I/O |
| Maximum Data Rate per I/O | — | 622 Mb/s |
| Core Supply Voltage | — | 1.2 V |
| I/O Supply Voltage | — | 3.3 V |
| FPGA Technology | — | 90 nm |
| Total Package Pins | — | 208 pins |
| Speed Grade | — | -4 |
| Temperature Grade | — | Industrial, -40°C to +100°C |
| Digital Termination | — | Digitally controlled termination supported |